JP4101823B2 - 半導体素子、電極形成方法及び半導体素子の製造方法 - Google Patents
半導体素子、電極形成方法及び半導体素子の製造方法 Download PDFInfo
- Publication number
- JP4101823B2 JP4101823B2 JP2005172585A JP2005172585A JP4101823B2 JP 4101823 B2 JP4101823 B2 JP 4101823B2 JP 2005172585 A JP2005172585 A JP 2005172585A JP 2005172585 A JP2005172585 A JP 2005172585A JP 4101823 B2 JP4101823 B2 JP 4101823B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- layer
- palladium
- semiconductor
- side electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims description 79
- 238000000034 method Methods 0.000 title claims description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 68
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 40
- 229910003445 palladium oxide Inorganic materials 0.000 claims description 37
- 239000010931 gold Substances 0.000 claims description 26
- 238000010438 heat treatment Methods 0.000 claims description 26
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 24
- 229910052763 palladium Inorganic materials 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 16
- 150000004767 nitrides Chemical class 0.000 claims description 15
- JOKPITBUODAHEN-UHFFFAOYSA-N sulfanylideneplatinum Chemical compound [Pt]=S JOKPITBUODAHEN-UHFFFAOYSA-N 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 229910052697 platinum Inorganic materials 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 239000001301 oxygen Substances 0.000 claims description 5
- JQPTYAILLJKUCY-UHFFFAOYSA-N palladium(ii) oxide Chemical compound [O-2].[Pd+2] JQPTYAILLJKUCY-UHFFFAOYSA-N 0.000 claims 9
- 229910000480 nickel oxide Inorganic materials 0.000 claims 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 claims 1
- HBEQXAKJSGXAIQ-UHFFFAOYSA-N oxopalladium Chemical compound [Pd]=O HBEQXAKJSGXAIQ-UHFFFAOYSA-N 0.000 description 30
- 229910002601 GaN Inorganic materials 0.000 description 25
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 238000000206 photolithography Methods 0.000 description 7
- 238000000682 scanning probe acoustic microscopy Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 6
- 238000002441 X-ray diffraction Methods 0.000 description 5
- 229910000428 cobalt oxide Inorganic materials 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 238000010894 electron beam technology Methods 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- 238000005253 cladding Methods 0.000 description 4
- 230000020169 heat generation Effects 0.000 description 4
- 238000001020 plasma etching Methods 0.000 description 4
- 238000001228 spectrum Methods 0.000 description 4
- 239000000969 carrier Substances 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000005036 potential barrier Methods 0.000 description 3
- 238000003672 processing method Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- PFNQVRZLDWYSCW-UHFFFAOYSA-N (fluoren-9-ylideneamino) n-naphthalen-1-ylcarbamate Chemical compound C12=CC=CC=C2C2=CC=CC=C2C1=NOC(=O)NC1=CC=CC2=CC=CC=C12 PFNQVRZLDWYSCW-UHFFFAOYSA-N 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- QZPSXPBJTPJTSZ-UHFFFAOYSA-N aqua regia Chemical compound Cl.O[N+]([O-])=O QZPSXPBJTPJTSZ-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000000333 X-ray scattering Methods 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28575—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
- H01L29/452—Ohmic electrodes on AIII-BV compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04252—Electrodes, e.g. characterised by the structure characterised by the material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2301/00—Functional characteristics
- H01S2301/17—Semiconductor lasers comprising special layers
- H01S2301/173—The laser chip comprising special buffer layers, e.g. dislocation prevention or reduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2304/00—Special growth methods for semiconductor lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04256—Electrodes, e.g. characterised by the structure characterised by the configuration
- H01S5/04257—Electrodes, e.g. characterised by the structure characterised by the configuration having positive and negative electrodes on the same side of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/223—Buried stripe structure
- H01S5/2231—Buried stripe structure with inner confining structure only between the active layer and the upper electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34333—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer based on Ga(In)N or Ga(In)P, e.g. blue laser
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Electromagnetism (AREA)
- Ceramic Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biophysics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electrodes Of Semiconductors (AREA)
- Led Devices (AREA)
- Semiconductor Lasers (AREA)
Description
本発明の第1の実施の形態に係る半導体素子としての青色LDは、図1に示すように、基板10上に形成されたエピタキシャル成長層12及びコンタクト層14等を備える。エピタキシャル成長層12の一部、及びコンタクト層14により、メサ状のリッジが設けられる。例えば、基板10として、窒化ガリウム等の窒化物半導体基板が用いられる。エピタキシャル成長層12には、n型GaN層、n型窒化アルミニウムガリウム(AlGaN)クラッド層、n型GaNガイド層、窒化インジウムガリウム(InGaN)多重量子井戸層、p型GaNガイド層、p型AlGaNクラッド層等が含まれる。コンタクト層14として、GaN等のp型半導体層が用いられる。なお、LDの発光層は、エピタキシャル成長層12の多重量子井戸層である。
本発明の第2の実施の形態に係る半導体素子としてのLEDは、図15に示すように、p型GaNコンタクト層14に設けられたp側電極18cと、n型GaNコンタクト層54に設けられたn側電極22を備える。パッド電極20が、p側電極18c上でn側電極22の反対側に設けられる。
上記のように、本発明の第1及び第2の実施の形態を記載したが、この開示の一部をなす論述及び図面はこの発明を限定するものであると理解すべきではない。この開示から当業者にはさまざまな代替実施の形態、実施の形態及び運用技術が明らかとなろう。
12…エピタキシャル成長層
14、54…コンタクト層
18、18a〜18c…p側電極
22…n側電極
30…PdO膜
32…Pd膜
34…Pt膜
36…Ni膜
38…Au膜
40…第1のNi含有膜
42…第2のNi含有膜
Claims (11)
- p型窒化物半導体層と、
前記窒化物半導体層表面上の酸化パラジウム膜を含むp側電極とを備え、
前記酸化パラジウム膜が、硫化白金型酸化パラジウムを含み、
前記酸化パラジウム膜に含まれる前記硫化白金型酸化パラジウムが、50%以上であることを特徴とする半導体素子。 - 前記p側電極が、前記酸化パラジウム膜の上に設けられた白金膜を含むことを特徴とする請求項1に記載の半導体素子。
- 前記p側電極が、前記酸化パラジウム膜の上で、少なくとも一部を酸化ニッケルとする第1のニッケル含有膜と、前記第1のニッケル含有膜表面上の金膜とを含むこと特徴とする請求項1に記載の半導体素子。
- p型半導体層表面にパラジウム膜を堆積し、
前記半導体層を酸素雰囲気中で熱処理して、少なくとも前記半導体層表面に隣接する領域の前記パラジウム膜を酸化して酸化パラジウム膜を形成することを含み、
前記熱処理が、200℃以上、400℃未満の温度範囲で行われることを特徴とする電極形成方法。 - 前記熱処理の前に、前記パラジウム膜表面上に白金膜を堆積することを、更に含むことを特徴とする請求項4に記載の電極形成方法。
- 前記熱処理の前に、前記パラジウム膜表面上にニッケル膜及び金膜を順次堆積することを、更に含むことを特徴とする請求項4に記載の電極形成方法。
- 前記半導体層が、窒化物半導体であることを特徴とする請求項4〜6のいずれか1項に記載の電極形成方法。
- 基板の上に発光層を含むエピタキシャル成長層、及び前記エピタキシャル成長層上にp型コンタクト層を成長し、
前記コンタクト層表面にパラジウム膜を堆積し、
前記基板を酸素雰囲気中で熱処理して、少なくとも前記コンタクト層表面に隣接する領域の前記パラジウム膜を酸化して酸化パラジウム膜を形成することを含み、
前記熱処理が、200℃以上、400℃未満の温度範囲で行われることを特徴とする半導体素子の製造方法。 - 前記熱処理の前に、前記パラジウム膜表面上に白金膜を堆積することを、更に含むことを特徴とする請求項8に記載の半導体素子の製造方法。
- 前記熱処理の前に、前記パラジウム膜表面上にニッケル膜及び金膜を順次堆積することを、更に含むことを特徴とする請求項8に記載の半導体素子の製造方法。
- 前記コンタクト層が、窒化物半導体であることを特徴とする請求項8〜10のいずれか1項に記載の半導体素子の製造方法。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005172585A JP4101823B2 (ja) | 2005-06-13 | 2005-06-13 | 半導体素子、電極形成方法及び半導体素子の製造方法 |
CNB2006800003323A CN100459196C (zh) | 2005-06-13 | 2006-02-21 | 半导体器件、制造电极的方法以及制造半导体器件的方法 |
KR1020067022341A KR100846022B1 (ko) | 2005-06-13 | 2006-02-21 | 반도체 장치, 전극 제작 방법 및 반도체 장치 제조 방법 |
US10/574,850 US7592641B2 (en) | 2005-06-13 | 2006-02-21 | Semiconductor device, method for fabricating an electrode, and method for manufacturing a semiconductor device |
PCT/JP2006/303523 WO2006134689A1 (en) | 2005-06-13 | 2006-02-21 | Semiconductor device, method for fabricating an electrode, and method for manufacturing a semiconductor device |
EP06714662A EP1900041A1 (en) | 2005-06-13 | 2006-02-21 | Semiconductor device, method for fabricating an electrode, and method for manufacturing a semiconductor device |
TW095106657A TW200731627A (en) | 2005-06-13 | 2006-02-27 | Semiconductor device, method for fabricating an electrode, and method for manufacturing a semiconductor device |
US12/539,275 US7993948B2 (en) | 2005-06-13 | 2009-08-11 | Semiconductor device, method for fabricating an electrode, and method for manufacturing a semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005172585A JP4101823B2 (ja) | 2005-06-13 | 2005-06-13 | 半導体素子、電極形成方法及び半導体素子の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006351617A JP2006351617A (ja) | 2006-12-28 |
JP4101823B2 true JP4101823B2 (ja) | 2008-06-18 |
Family
ID=36636238
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005172585A Expired - Fee Related JP4101823B2 (ja) | 2005-06-13 | 2005-06-13 | 半導体素子、電極形成方法及び半導体素子の製造方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US7592641B2 (ja) |
EP (1) | EP1900041A1 (ja) |
JP (1) | JP4101823B2 (ja) |
KR (1) | KR100846022B1 (ja) |
CN (1) | CN100459196C (ja) |
TW (1) | TW200731627A (ja) |
WO (1) | WO2006134689A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7897418B2 (en) | 2007-12-28 | 2011-03-01 | Mitsubishi Electric Corporation | Method for manufacturing semiconductor light emitting device |
JP5355954B2 (ja) * | 2008-07-30 | 2013-11-27 | 日本電信電話株式会社 | ヘテロ接合バイポーラトランジスタ |
JP5453303B2 (ja) * | 2010-02-22 | 2014-03-26 | パナソニック株式会社 | 発光装置とその製造方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03230463A (ja) | 1990-02-02 | 1991-10-14 | Nec Corp | イオン注入装置 |
JPH03233258A (ja) | 1990-02-09 | 1991-10-17 | Gastar Corp | 自動風呂装置における湯温変更制御方法 |
US5387459A (en) * | 1992-12-17 | 1995-02-07 | Eastman Kodak Company | Multilayer structure having an epitaxial metal electrode |
JPH07153700A (ja) | 1993-11-26 | 1995-06-16 | Sony Corp | 有機金属気相成長法及び発光素子作製方法 |
JP3233258B2 (ja) | 1996-04-24 | 2001-11-26 | 日亜化学工業株式会社 | 窒化物半導体の電極 |
US6291840B1 (en) * | 1996-11-29 | 2001-09-18 | Toyoda Gosei Co., Ltd. | GaN related compound semiconductor light-emitting device |
JPH10233529A (ja) * | 1997-02-14 | 1998-09-02 | Hewlett Packard Co <Hp> | 窒化物半導体素子およびその製造方法 |
JP3230463B2 (ja) | 1997-07-22 | 2001-11-19 | 昭和電工株式会社 | 発光半導体素子用透光性電極の作製方法 |
EP2610231A2 (en) | 1998-08-31 | 2013-07-03 | Idemitsu Kosan Co., Ltd. | Target for transparent electroconductive film, transparent electroconductive material, transparent electroconductive glass, and transparent electroconductive film |
JP4493127B2 (ja) | 1999-09-10 | 2010-06-30 | シャープ株式会社 | 窒化物半導体チップの製造方法 |
US6777872B2 (en) | 1999-12-21 | 2004-08-17 | Matsushita Electric Industrial Co., Ltd. | Plasma display panel and method for production thereof |
TW439304B (en) * | 2000-01-05 | 2001-06-07 | Ind Tech Res Inst | GaN series III-V compound semiconductor devices |
US6586328B1 (en) * | 2000-06-05 | 2003-07-01 | The Board Of Trustees Of The University Of Illinois | Method to metallize ohmic electrodes to P-type group III nitrides |
KR100632668B1 (ko) * | 2003-08-22 | 2006-10-11 | 엘지이노텍 주식회사 | 발광소자의 투명전극 및 그 제조방법 |
WO2004047189A1 (en) * | 2002-11-16 | 2004-06-03 | Lg Innotek Co.,Ltd | Light emitting device and fabrication method thereof |
KR100671924B1 (ko) * | 2003-02-19 | 2007-01-24 | 니치아 카가쿠 고교 가부시키가이샤 | 질화물 반도체 소자 |
TWI374552B (en) | 2004-07-27 | 2012-10-11 | Cree Inc | Ultra-thin ohmic contacts for p-type nitride light emitting devices and methods of forming |
-
2005
- 2005-06-13 JP JP2005172585A patent/JP4101823B2/ja not_active Expired - Fee Related
-
2006
- 2006-02-21 EP EP06714662A patent/EP1900041A1/en not_active Withdrawn
- 2006-02-21 US US10/574,850 patent/US7592641B2/en not_active Expired - Fee Related
- 2006-02-21 WO PCT/JP2006/303523 patent/WO2006134689A1/en active Application Filing
- 2006-02-21 CN CNB2006800003323A patent/CN100459196C/zh not_active Expired - Fee Related
- 2006-02-21 KR KR1020067022341A patent/KR100846022B1/ko not_active IP Right Cessation
- 2006-02-27 TW TW095106657A patent/TW200731627A/zh unknown
-
2009
- 2009-08-11 US US12/539,275 patent/US7993948B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP1900041A1 (en) | 2008-03-19 |
JP2006351617A (ja) | 2006-12-28 |
US20100178721A1 (en) | 2010-07-15 |
US7993948B2 (en) | 2011-08-09 |
CN100459196C (zh) | 2009-02-04 |
KR20070061764A (ko) | 2007-06-14 |
WO2006134689A1 (en) | 2006-12-21 |
CN1989630A (zh) | 2007-06-27 |
KR100846022B1 (ko) | 2008-07-11 |
TW200731627A (en) | 2007-08-16 |
US20080246049A1 (en) | 2008-10-09 |
US7592641B2 (en) | 2009-09-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6896708B2 (ja) | 2次元正孔ガスを組み込んだ紫外線発光デバイス | |
EP1810351B1 (en) | Gan compound semiconductor light emitting element | |
WO2016163083A1 (ja) | 窒化物半導体発光素子 | |
US20090261372A1 (en) | Semiconductor light emitting device and method for fabricating the same | |
KR100910964B1 (ko) | 오믹 전극 및 이의 형성 방법 | |
US20070145396A1 (en) | Semiconductor light emitting device and method of manufacturing the same | |
KR20080003871A (ko) | 질화물 반도체 소자 및 그 제법 | |
JP2019207925A (ja) | 半導体発光素子および半導体発光素子の製造方法 | |
US20110233603A1 (en) | Semiconductor light-emitting device | |
KR100886110B1 (ko) | 반도체 발광소자용 지지기판 및 이를 이용한 수직구조의 반도체 발광소자 제조 방법 | |
JP5132739B2 (ja) | 半導体素子 | |
JP3767863B2 (ja) | 半導体発光素子およびその製法 | |
JP4101823B2 (ja) | 半導体素子、電極形成方法及び半導体素子の製造方法 | |
US8101965B2 (en) | III-nitride semiconductor light emitting device having a multilayered pad | |
EP2290708B1 (en) | Light-emitting element and a production method therefor | |
KR101231118B1 (ko) | 반도체 발광소자용 지지기판 및 상기 지지기판을 이용한고성능 수직구조의 반도체 발광소자 | |
KR101459770B1 (ko) | 그룹 3족 질화물계 반도체 소자 | |
KR100838756B1 (ko) | 질화물계 반도체 발광소자의 제조방법 | |
KR100737821B1 (ko) | 발광 소자 및 그 제조방법 | |
JP5725069B2 (ja) | 窒化物半導体発光素子 | |
KR20020065948A (ko) | 질화물 반도체소자의 피형 오믹 콘택 | |
KR20010002265A (ko) | 질화물 반도체소자의 피형 오믹 콘택 | |
KR20090115830A (ko) | 수직구조의 그룹 3족 질화물계 반도체 발광다이오드 소자및 제조방법 | |
KR20190102545A (ko) | 반도체 발광소자의 제조방법 | |
JP2007311375A (ja) | p型III−V族化合物半導体の作製方法及び発光素子の作製方法。 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20061024 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070911 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20071018 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20071211 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20071228 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20080205 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20080311 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20080319 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110328 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120328 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130328 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130328 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140328 Year of fee payment: 6 |
|
LAPS | Cancellation because of no payment of annual fees |