JP4098259B2 - プラズマ処理装置 - Google Patents

プラズマ処理装置 Download PDF

Info

Publication number
JP4098259B2
JP4098259B2 JP2004052808A JP2004052808A JP4098259B2 JP 4098259 B2 JP4098259 B2 JP 4098259B2 JP 2004052808 A JP2004052808 A JP 2004052808A JP 2004052808 A JP2004052808 A JP 2004052808A JP 4098259 B2 JP4098259 B2 JP 4098259B2
Authority
JP
Japan
Prior art keywords
plasma
sample
electrode
processing chamber
outer peripheral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2004052808A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005243988A (ja
JP2005243988A5 (https=
Inventor
宗雄 古瀬
匡規 角谷
雅嗣 荒井
裕穂 北田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Technologies Corp filed Critical Hitachi High Technologies Corp
Priority to JP2004052808A priority Critical patent/JP4098259B2/ja
Publication of JP2005243988A publication Critical patent/JP2005243988A/ja
Publication of JP2005243988A5 publication Critical patent/JP2005243988A5/ja
Application granted granted Critical
Publication of JP4098259B2 publication Critical patent/JP4098259B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Landscapes

  • Drying Of Semiconductors (AREA)
JP2004052808A 2004-02-27 2004-02-27 プラズマ処理装置 Expired - Lifetime JP4098259B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004052808A JP4098259B2 (ja) 2004-02-27 2004-02-27 プラズマ処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004052808A JP4098259B2 (ja) 2004-02-27 2004-02-27 プラズマ処理装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007312196A Division JP2008098660A (ja) 2007-12-03 2007-12-03 プラズマ処理装置

Publications (3)

Publication Number Publication Date
JP2005243988A JP2005243988A (ja) 2005-09-08
JP2005243988A5 JP2005243988A5 (https=) 2005-11-17
JP4098259B2 true JP4098259B2 (ja) 2008-06-11

Family

ID=35025390

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004052808A Expired - Lifetime JP4098259B2 (ja) 2004-02-27 2004-02-27 プラズマ処理装置

Country Status (1)

Country Link
JP (1) JP4098259B2 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4508054B2 (ja) * 2005-09-12 2010-07-21 パナソニック株式会社 電極部材の製造方法
JP2007115973A (ja) * 2005-10-21 2007-05-10 Shin Etsu Chem Co Ltd 耐食性部材
KR101046902B1 (ko) * 2005-11-08 2011-07-06 도쿄엘렉트론가부시키가이샤 샤워 플레이트 및 샤워 플레이트를 사용한 플라즈마 처리장치
WO2008035508A1 (fr) * 2006-09-20 2008-03-27 Sharp Kabushiki Kaisha Composant pour appareil de traitement, appareil de traitement, procédé pour fabriquer un composant pour appareil de traitement et procédé pour fabriquer cet appareil de traitement
JP5193481B2 (ja) * 2007-03-16 2013-05-08 株式会社日立ハイテクノロジーズ プラズマ処理方法及びプラズマ処理装置
JP2008270595A (ja) * 2007-04-23 2008-11-06 Texas Instr Japan Ltd 反応生成物剥離防止構造及びその製作方法、並びに当該構造を用いる半導体装置の製造方法
US9238863B2 (en) 2012-02-03 2016-01-19 Tocalo Co., Ltd. Method for blackening white fluoride spray coating, and fluoride spray coating covered member having a blackened layer on its surface
US9421570B2 (en) 2012-02-09 2016-08-23 Tocalo Co., Ltd. Method for forming fluoride spray coating and fluoride spray coating covered member
CN104701125A (zh) * 2013-12-05 2015-06-10 中微半导体设备(上海)有限公司 气体分布板
KR101671671B1 (ko) 2016-05-25 2016-11-01 주식회사 티씨케이 반도체 제조용 부품의 재생방법과 그 재생장치 및 재생부품
KR102411272B1 (ko) * 2018-03-26 2022-06-22 엔지케이 인슐레이터 엘티디 정전척 히터

Also Published As

Publication number Publication date
JP2005243988A (ja) 2005-09-08

Similar Documents

Publication Publication Date Title
KR102549546B1 (ko) 플라즈마 프로세싱 챔버 내의 엘라스토머 시일의 수명을 연장시키는 크기로 형성된 에지 링
JP6639584B2 (ja) プラズマ処理装置用の部品の製造方法
US11328905B2 (en) Thermal spraying method of component for plasma processing apparatus and component for plasma processing apparatus
US20080314321A1 (en) Plasma processing apparatus
CN100508103C (zh) 用于等离子体加工系统中的改进的波纹管罩的方法和装置
TWI567862B (zh) A particle adhesion control method and a processing device for the substrate to be processed
JP4992389B2 (ja) 載置装置、プラズマ処理装置及びプラズマ処理方法
US20160076129A1 (en) Component for plasma processing apparatus, and manufacturing method therefor
KR102106382B1 (ko) 플라스마 처리 장치
JP4098259B2 (ja) プラズマ処理装置
JP2008117982A5 (https=)
US8715782B2 (en) Surface processing method
JP4181069B2 (ja) プラズマ処理装置
CN119153301A (zh) 阳极化涂覆表面的宏观纹理化
JP2008098660A (ja) プラズマ処理装置
CN115803469B (zh) 内壁构件的再生方法
US20050199183A1 (en) Plasma processing apparatus
JP3881290B2 (ja) プラズマ処理装置
JP4128469B2 (ja) プラズマ処理装置
JP2008251857A (ja) プラズマ処理装置
JP2007324186A (ja) プラズマ処理装置
JP2003163201A (ja) プラズマエッチング装置
KR100819530B1 (ko) 플라즈마 에칭장치 및 플라즈마 처리실 내 부재의 형성방법
JP7587056B2 (ja) 内壁部材の再生方法
JP2007243020A (ja) プラズマ処理装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050930

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050930

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070919

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20071002

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20071203

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080311

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080312

R150 Certificate of patent or registration of utility model

Ref document number: 4098259

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110321

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110321

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120321

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130321

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130321

Year of fee payment: 5

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

EXPY Cancellation because of completion of term