JP4086826B2 - 基板の処理方法 - Google Patents

基板の処理方法 Download PDF

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Publication number
JP4086826B2
JP4086826B2 JP2004266631A JP2004266631A JP4086826B2 JP 4086826 B2 JP4086826 B2 JP 4086826B2 JP 2004266631 A JP2004266631 A JP 2004266631A JP 2004266631 A JP2004266631 A JP 2004266631A JP 4086826 B2 JP4086826 B2 JP 4086826B2
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Japan
Prior art keywords
substrate
finger
processing
support
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2004266631A
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English (en)
Japanese (ja)
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JP2006086180A (ja
JP2006086180A5 (enExample
Inventor
富大 天野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Denki Electric Inc
Original Assignee
Hitachi Kokusai Electric Inc
Kokusai Denki Electric Inc
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Application filed by Hitachi Kokusai Electric Inc, Kokusai Denki Electric Inc filed Critical Hitachi Kokusai Electric Inc
Priority to JP2004266631A priority Critical patent/JP4086826B2/ja
Publication of JP2006086180A publication Critical patent/JP2006086180A/ja
Publication of JP2006086180A5 publication Critical patent/JP2006086180A5/ja
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Publication of JP4086826B2 publication Critical patent/JP4086826B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2004266631A 2004-09-14 2004-09-14 基板の処理方法 Expired - Lifetime JP4086826B2 (ja)

Priority Applications (1)

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JP2004266631A JP4086826B2 (ja) 2004-09-14 2004-09-14 基板の処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004266631A JP4086826B2 (ja) 2004-09-14 2004-09-14 基板の処理方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007181729A Division JP2007266638A (ja) 2007-07-11 2007-07-11 基板の処理方法

Publications (3)

Publication Number Publication Date
JP2006086180A JP2006086180A (ja) 2006-03-30
JP2006086180A5 JP2006086180A5 (enExample) 2007-08-09
JP4086826B2 true JP4086826B2 (ja) 2008-05-14

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ID=36164460

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JP2004266631A Expired - Lifetime JP4086826B2 (ja) 2004-09-14 2004-09-14 基板の処理方法

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JP (1) JP4086826B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5511273B2 (ja) 2008-09-12 2014-06-04 株式会社日立国際電気 基板処理装置及び基板処理方法
JP4703749B2 (ja) 2008-09-17 2011-06-15 株式会社日立国際電気 基板処理装置及び基板処理方法
JP2011071293A (ja) * 2009-09-25 2011-04-07 Tokyo Electron Ltd プロセスモジュール、基板処理装置、および基板搬送方法
CN106409739B (zh) * 2016-09-29 2019-12-06 中国电子科技集团公司第四十八研究所 一种晶片真空自动传输系统及传输方法

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Publication number Publication date
JP2006086180A (ja) 2006-03-30

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