JP4083877B2 - 半導体発光素子および半導体発光装置 - Google Patents

半導体発光素子および半導体発光装置 Download PDF

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Publication number
JP4083877B2
JP4083877B2 JP18347198A JP18347198A JP4083877B2 JP 4083877 B2 JP4083877 B2 JP 4083877B2 JP 18347198 A JP18347198 A JP 18347198A JP 18347198 A JP18347198 A JP 18347198A JP 4083877 B2 JP4083877 B2 JP 4083877B2
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JP
Japan
Prior art keywords
light emitting
semiconductor light
negative electrode
layer
bonding pad
Prior art date
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Expired - Fee Related
Application number
JP18347198A
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English (en)
Japanese (ja)
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JP2000022210A5 (enExample
JP2000022210A (ja
Inventor
幸生 山崎
茂稔 伊藤
泰司 森本
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Sharp Corp
Original Assignee
Sharp Corp
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Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP18347198A priority Critical patent/JP4083877B2/ja
Publication of JP2000022210A publication Critical patent/JP2000022210A/ja
Publication of JP2000022210A5 publication Critical patent/JP2000022210A5/ja
Application granted granted Critical
Publication of JP4083877B2 publication Critical patent/JP4083877B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body

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  • Led Devices (AREA)
JP18347198A 1998-06-30 1998-06-30 半導体発光素子および半導体発光装置 Expired - Fee Related JP4083877B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18347198A JP4083877B2 (ja) 1998-06-30 1998-06-30 半導体発光素子および半導体発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18347198A JP4083877B2 (ja) 1998-06-30 1998-06-30 半導体発光素子および半導体発光装置

Publications (3)

Publication Number Publication Date
JP2000022210A JP2000022210A (ja) 2000-01-21
JP2000022210A5 JP2000022210A5 (enExample) 2005-07-28
JP4083877B2 true JP4083877B2 (ja) 2008-04-30

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP18347198A Expired - Fee Related JP4083877B2 (ja) 1998-06-30 1998-06-30 半導体発光素子および半導体発光装置

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Country Link
JP (1) JP4083877B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0653362U (ja) * 1992-09-11 1994-07-19 有限会社上川製作所 ゴーカート移動用台車

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6777805B2 (en) 2000-03-31 2004-08-17 Toyoda Gosei Co., Ltd. Group-III nitride compound semiconductor device
JP4810751B2 (ja) * 2001-04-19 2011-11-09 日亜化学工業株式会社 窒化物半導体素子
JP2003069074A (ja) * 2001-08-14 2003-03-07 Shurai Kagi Kofun Yugenkoshi 半導体装置
JP4635985B2 (ja) * 2002-10-03 2011-02-23 日亜化学工業株式会社 発光ダイオード
JP3956918B2 (ja) * 2002-10-03 2007-08-08 日亜化学工業株式会社 発光ダイオード
JP4502691B2 (ja) * 2003-04-16 2010-07-14 昭和電工株式会社 ｐ形オーミック電極構造、それを備えた化合物半導体発光素子及びＬＥＤランプ
KR100616693B1 (ko) 2005-08-09 2006-08-28 삼성전기주식회사 질화물 반도체 발광 소자
JP2007180326A (ja) * 2005-12-28 2007-07-12 Showa Denko Kk 発光装置
KR100721142B1 (ko) 2006-03-14 2007-05-23 삼성전기주식회사 질화물계 반도체 발광소자
JP2008078525A (ja) * 2006-09-25 2008-04-03 Mitsubishi Cable Ind Ltd 窒化物半導体発光ダイオード素子
KR100833311B1 (ko) * 2007-01-03 2008-05-28 삼성전기주식회사 질화물계 반도체 발광소자
US20120037946A1 (en) * 2010-08-12 2012-02-16 Chi Mei Lighting Technology Corporation Light emitting devices
JP5367792B2 (ja) * 2011-10-07 2013-12-11 スタンレー電気株式会社 発光素子
JP6380011B2 (ja) * 2014-10-31 2018-08-29 日亜化学工業株式会社 発光素子及びその製造方法
JP2017050350A (ja) 2015-08-31 2017-03-09 日亜化学工業株式会社 発光装置及びその製造方法
JP6637704B2 (ja) * 2015-09-10 2020-01-29 Ｄｏｗａエレクトロニクス株式会社 発光素子およびその製造方法、ならびにそれを用いた受発光モジュール
CN110828502B (zh) * 2018-08-09 2024-04-02 首尔伟傲世有限公司 发光元件
CN113630926B (zh) * 2020-05-07 2024-07-19 固安翌光科技有限公司 一种有机电致发光屏体及其制备方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0653362U (ja) * 1992-09-11 1994-07-19 有限会社上川製作所 ゴーカート移動用台車

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JP2000022210A (ja) 2000-01-21

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