JP4080272B2 - 基板処理方法 - Google Patents

基板処理方法 Download PDF

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Publication number
JP4080272B2
JP4080272B2 JP2002224751A JP2002224751A JP4080272B2 JP 4080272 B2 JP4080272 B2 JP 4080272B2 JP 2002224751 A JP2002224751 A JP 2002224751A JP 2002224751 A JP2002224751 A JP 2002224751A JP 4080272 B2 JP4080272 B2 JP 4080272B2
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Japan
Prior art keywords
wafer
film
substrate
resist
processing
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Expired - Fee Related
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Japanese (ja)
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JP2004071620A (ja
JP2004071620A5 (https=
Inventor
孝之 戸島
正 飯野
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2002224751A priority Critical patent/JP4080272B2/ja
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  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Drying Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2002224751A 2002-08-01 2002-08-01 基板処理方法 Expired - Fee Related JP4080272B2 (ja)

Priority Applications (1)

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JP2002224751A JP4080272B2 (ja) 2002-08-01 2002-08-01 基板処理方法

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Application Number Priority Date Filing Date Title
JP2002224751A JP4080272B2 (ja) 2002-08-01 2002-08-01 基板処理方法

Publications (3)

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JP2004071620A JP2004071620A (ja) 2004-03-04
JP2004071620A5 JP2004071620A5 (https=) 2005-10-27
JP4080272B2 true JP4080272B2 (ja) 2008-04-23

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JP2002224751A Expired - Fee Related JP4080272B2 (ja) 2002-08-01 2002-08-01 基板処理方法

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5019741B2 (ja) * 2005-11-30 2012-09-05 東京エレクトロン株式会社 半導体装置の製造方法および基板処理システム
KR100824623B1 (ko) 2006-12-05 2008-04-25 동부일렉트로닉스 주식회사 반도체 소자 형성 방법
JP7569752B2 (ja) * 2021-06-07 2024-10-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

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JP2004071620A (ja) 2004-03-04

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