JP4067078B2 - リソグラフィ投影装置およびデバイス製造方法 - Google Patents
リソグラフィ投影装置およびデバイス製造方法 Download PDFInfo
- Publication number
- JP4067078B2 JP4067078B2 JP2001262809A JP2001262809A JP4067078B2 JP 4067078 B2 JP4067078 B2 JP 4067078B2 JP 2001262809 A JP2001262809 A JP 2001262809A JP 2001262809 A JP2001262809 A JP 2001262809A JP 4067078 B2 JP4067078 B2 JP 4067078B2
- Authority
- JP
- Japan
- Prior art keywords
- mirror
- radiation
- alcohol
- projection apparatus
- space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
- G03F7/70958—Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties
Landscapes
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP00307608 | 2000-09-04 | ||
| EP00307608.0 | 2000-09-04 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007280355A Division JP4743440B2 (ja) | 2000-09-04 | 2007-10-29 | リソグラフィ投影装置及びデバイス製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002110539A JP2002110539A (ja) | 2002-04-12 |
| JP4067078B2 true JP4067078B2 (ja) | 2008-03-26 |
Family
ID=8173241
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001262809A Expired - Fee Related JP4067078B2 (ja) | 2000-09-04 | 2001-08-31 | リソグラフィ投影装置およびデバイス製造方法 |
| JP2007280355A Expired - Fee Related JP4743440B2 (ja) | 2000-09-04 | 2007-10-29 | リソグラフィ投影装置及びデバイス製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007280355A Expired - Fee Related JP4743440B2 (ja) | 2000-09-04 | 2007-10-29 | リソグラフィ投影装置及びデバイス製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7671965B2 (https=) |
| EP (1) | EP1186957B1 (https=) |
| JP (2) | JP4067078B2 (https=) |
| KR (1) | KR100656582B1 (https=) |
| DE (1) | DE60127050T2 (https=) |
| TW (1) | TW548524B (https=) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE60043998D1 (de) * | 2000-12-21 | 2010-04-22 | Euv Llc | Reduction de la contamination superficielle causee par des radiations |
| US6664554B2 (en) * | 2001-01-03 | 2003-12-16 | Euv Llc | Self-cleaning optic for extreme ultraviolet lithography |
| US7050149B2 (en) | 2002-06-11 | 2006-05-23 | Nikon Corporation | Exposure apparatus and exposure method |
| JPWO2003105203A1 (ja) * | 2002-06-11 | 2005-10-13 | 株式会社ニコン | 露光装置及び露光方法 |
| US20040105084A1 (en) * | 2002-09-30 | 2004-06-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| EP1403715A3 (en) * | 2002-09-30 | 2006-01-18 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| DE10309084A1 (de) | 2003-03-03 | 2004-09-16 | Carl Zeiss Smt Ag | Reflektives optisches Element und EUV-Lithographiegerät |
| US7217940B2 (en) * | 2003-04-08 | 2007-05-15 | Cymer, Inc. | Collector for EUV light source |
| DE10319005A1 (de) | 2003-04-25 | 2004-11-25 | Carl Zeiss Smt Ag | Reflektives optisches Element, optisches System und EUV-Lithographievorrichtung |
| DE10321103A1 (de) * | 2003-05-09 | 2004-12-02 | Carl Zeiss Smt Ag | Verfahren zur Vermeidung von Kontamination und EUV-Lithographievorrichtung |
| JP4613167B2 (ja) * | 2003-05-22 | 2011-01-12 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 少なくとも一つの光学要素を洗浄する方法および装置 |
| DE10342239B4 (de) * | 2003-09-11 | 2018-06-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zum Erzeugen von Extrem-Ultraviolettstrahlung oder weicher Röntgenstrahlung |
| EP1522895B1 (en) * | 2003-10-06 | 2006-11-02 | ASML Netherlands B.V. | Method of and apparatus for supplying a dynamic protective layer to a mirror |
| US7208746B2 (en) * | 2004-07-14 | 2007-04-24 | Asml Netherlands B.V. | Radiation generating device, lithographic apparatus, device manufacturing method and device manufactured thereby |
| US7355672B2 (en) * | 2004-10-04 | 2008-04-08 | Asml Netherlands B.V. | Method for the removal of deposition on an optical element, method for the protection of an optical element, device manufacturing method, apparatus including an optical element, and lithographic apparatus |
| GB0426036D0 (en) * | 2004-11-26 | 2004-12-29 | Boc Group Plc | Protection of surfaces exposed to charged particles |
| US7211810B2 (en) * | 2004-12-29 | 2007-05-01 | Asml Netherlands B.V. | Method for the protection of an optical element, lithographic apparatus, and device manufacturing method |
| US7701554B2 (en) | 2004-12-29 | 2010-04-20 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method, and optical component |
| US7868304B2 (en) * | 2005-02-07 | 2011-01-11 | Asml Netherlands B.V. | Method for removal of deposition on an optical element, lithographic apparatus, device manufacturing method, and device manufactured thereby |
| US7365349B2 (en) * | 2005-06-27 | 2008-04-29 | Cymer, Inc. | EUV light source collector lifetime improvements |
| US7141806B1 (en) * | 2005-06-27 | 2006-11-28 | Cymer, Inc. | EUV light source collector erosion mitigation |
| US7561247B2 (en) * | 2005-08-22 | 2009-07-14 | Asml Netherlands B.V. | Method for the removal of deposition on an optical element, method for the protection of an optical element, device manufacturing method, apparatus including an optical element, and lithographic apparatus |
| JP2007214253A (ja) * | 2006-02-08 | 2007-08-23 | Ushio Inc | 極端紫外光光源装置および極端紫外光光源装置における集光光学手段の保護方法 |
| JP2007234822A (ja) * | 2006-02-28 | 2007-09-13 | Canon Inc | 露光装置及びその制御方法並びにデバイス製造方法 |
| GB0605725D0 (en) * | 2006-03-23 | 2006-05-03 | Boc Group Plc | Spectral filter repair |
| JP2008263173A (ja) * | 2007-03-16 | 2008-10-30 | Canon Inc | 露光装置 |
| KR101333032B1 (ko) | 2007-06-12 | 2013-11-26 | 코닌클리케 필립스 엔.브이. | 감소된 반사율을 향상시키기 위하여 euv 광 컴포넌트를 인시추 처리하는 광학 장치 및 방법 |
| JP2009272347A (ja) * | 2008-04-30 | 2009-11-19 | Toshiba Corp | 光反射型マスク、露光装置、測定方法、及び半導体装置の製造方法 |
| DE102008028868A1 (de) * | 2008-06-19 | 2009-12-24 | Carl Zeiss Smt Ag | Optische Baugruppe |
| DE102009043824A1 (de) * | 2009-08-21 | 2011-02-24 | Asml Netherlands B.V. | Reflektives optisches Element und Verfahren zu dessen Herstellung |
| CN108107681A (zh) * | 2016-11-25 | 2018-06-01 | 中国科学院长春光学精密机械与物理研究所 | 一种光刻投影物镜腔体精密监控装置 |
| DE102021212018B3 (de) | 2021-10-25 | 2022-11-10 | Carl Zeiss Smt Gmbh | Projektionsbelichtungsanlage, Verfahren zum Betreiben der Projektionsbelichtungsanlage |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58225636A (ja) * | 1982-06-25 | 1983-12-27 | バッテル・ディベロプメント・コーポレーション | X線を対象物に照射する装置 |
| JPH0682601B2 (ja) * | 1985-12-04 | 1994-10-19 | 株式会社日立製作所 | X線露光装置用ミラ− |
| EP0286306B1 (en) * | 1987-04-03 | 1993-10-06 | Fujitsu Limited | Method and apparatus for vapor deposition of diamond |
| US5523193A (en) * | 1988-05-31 | 1996-06-04 | Texas Instruments Incorporated | Method and apparatus for patterning and imaging member |
| JP2725295B2 (ja) * | 1988-08-02 | 1998-03-11 | 日本電気株式会社 | シンクロトロン放射光露光装置 |
| EP0527166B1 (de) * | 1990-05-02 | 1995-06-14 | Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V. | Belichtungsvorrichtung |
| JPH04233717A (ja) * | 1990-12-28 | 1992-08-21 | Canon Inc | X線露光装置 |
| US5229872A (en) * | 1992-01-21 | 1993-07-20 | Hughes Aircraft Company | Exposure device including an electrically aligned electronic mask for micropatterning |
| JPH0720293A (ja) * | 1993-06-30 | 1995-01-24 | Canon Inc | X線ミラー及びこれを用いたx線露光装置とデバイス製造方法 |
| US5593800A (en) * | 1994-01-06 | 1997-01-14 | Canon Kabushiki Kaisha | Mask manufacturing method and apparatus and device manufacturing method using a mask manufactured by the method or apparatus |
| JP3599370B2 (ja) * | 1994-05-23 | 2004-12-08 | 日本碍子株式会社 | 水素製造装置 |
| WO1997033205A1 (en) * | 1996-03-06 | 1997-09-12 | Philips Electronics N.V. | Differential interferometer system and lithographic step-and-scan apparatus provided with such a system |
| FR2752386B1 (fr) * | 1996-08-14 | 1998-09-11 | Commissariat Energie Atomique | Procede de nettoyage ou de decontamination d'un objet au moyen d'un faisceau laser ultraviolet et dispositif pour sa mise en oeuvre |
| EP0918984B1 (de) * | 1996-08-16 | 2001-06-27 | Zeptosens AG | Optische detektionsvorrichtung |
| JPH1090496A (ja) * | 1996-09-19 | 1998-04-10 | Nikon Corp | 反射型光学素子及びこれを用いた反射型光学系 |
| WO1998028665A1 (en) * | 1996-12-24 | 1998-07-02 | Koninklijke Philips Electronics N.V. | Two-dimensionally balanced positioning device with two object holders, and lithographic device provided with such a positioning device |
| JPH10221499A (ja) * | 1997-02-07 | 1998-08-21 | Hitachi Ltd | レーザプラズマx線源およびそれを用いた半導体露光装置並びに半導体露光方法 |
| AU8885198A (en) * | 1997-08-26 | 1999-03-16 | Nikon Corporation | Aligner, exposure method, method of pressure adjustment of projection optical system, and method of assembling aligner |
| JP2000091207A (ja) * | 1998-09-14 | 2000-03-31 | Nikon Corp | 投影露光装置及び投影光学系の洗浄方法 |
| US6198792B1 (en) * | 1998-11-06 | 2001-03-06 | Euv Llc | Wafer chamber having a gas curtain for extreme-UV lithography |
| JP2000173893A (ja) * | 1998-12-04 | 2000-06-23 | Nikon Corp | 投影露光装置及び光学素子の汚染判別方法 |
| US6533952B2 (en) * | 1999-06-08 | 2003-03-18 | Euv Llc | Mitigation of radiation induced surface contamination |
| US6304630B1 (en) * | 1999-12-24 | 2001-10-16 | U.S. Philips Corporation | Method of generating EUV radiation, method of manufacturing a device by means of said radiation, EUV radiation source unit, and lithographic projection apparatus provided with such a radiation source unit |
| US6421421B1 (en) * | 2000-05-22 | 2002-07-16 | Plex, Llc | Extreme ultraviolet based on colliding neutral beams |
-
2001
- 2001-08-24 TW TW090120880A patent/TW548524B/zh not_active IP Right Cessation
- 2001-08-31 JP JP2001262809A patent/JP4067078B2/ja not_active Expired - Fee Related
- 2001-08-31 DE DE60127050T patent/DE60127050T2/de not_active Expired - Lifetime
- 2001-08-31 EP EP01307428A patent/EP1186957B1/en not_active Expired - Lifetime
- 2001-08-31 KR KR1020010053082A patent/KR100656582B1/ko not_active Expired - Fee Related
- 2001-09-04 US US09/943,758 patent/US7671965B2/en not_active Expired - Fee Related
-
2007
- 2007-10-29 JP JP2007280355A patent/JP4743440B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE60127050T2 (de) | 2007-12-13 |
| DE60127050D1 (de) | 2007-04-19 |
| JP4743440B2 (ja) | 2011-08-10 |
| KR20020018957A (ko) | 2002-03-09 |
| KR100656582B1 (ko) | 2006-12-12 |
| EP1186957B1 (en) | 2007-03-07 |
| US20020051124A1 (en) | 2002-05-02 |
| JP2002110539A (ja) | 2002-04-12 |
| JP2008098651A (ja) | 2008-04-24 |
| TW548524B (en) | 2003-08-21 |
| EP1186957A3 (en) | 2005-02-16 |
| EP1186957A2 (en) | 2002-03-13 |
| US7671965B2 (en) | 2010-03-02 |
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