JP4065876B2 - パッド下の集積半導体構造 - Google Patents

パッド下の集積半導体構造 Download PDF

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JP4065876B2
JP4065876B2 JP2004516476A JP2004516476A JP4065876B2 JP 4065876 B2 JP4065876 B2 JP 4065876B2 JP 2004516476 A JP2004516476 A JP 2004516476A JP 2004516476 A JP2004516476 A JP 2004516476A JP 4065876 B2 JP4065876 B2 JP 4065876B2
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metal
semiconductor structure
structure according
pad
metal layer
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Expired - Fee Related
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JP2004516476A
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Japanese (ja)
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JP2006502561A (ja
Inventor
ローベルト バウアー，
ヴェルナー エアテゥレ，
ティル フローンミュラー，
ベルント ゴラー，
ラインハルト グライデレア，
オリバー ナグラー，
オラフ シュメッケビーア，
ヴォルフガング シュタットラー，
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Infineon Technologies AG
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Infineon Technologies AG
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
    • H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
    • H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
    • H01L2224/02165—Reinforcing structures
    • H01L2224/02166—Collar structures
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/05001—Internal layers
    • H01L2224/05075—Plural internal layers
    • H01L2224/0508—Plural internal layers being stacked
    • H01L2224/05085—Plural internal layers being stacked with additional elements, e.g. vias arrays, interposed between the stacked layers
    • H01L2224/05089—Disposition of the additional element
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    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
JP2004516476A 2002-07-01 2003-06-12 パッド下の集積半導体構造 Expired - Fee Related JP4065876B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10229493A DE10229493B4 (de) 2002-07-01 2002-07-01 Integrierte Halbleiterstruktur
PCT/DE2003/001955 WO2004004002A1 (de) 2002-07-01 2003-06-12 Unter ein pad integrierte halbleiterstruktur

Publications (2)

Publication Number Publication Date
JP2006502561A JP2006502561A (ja) 2006-01-19
JP4065876B2 true JP4065876B2 (ja) 2008-03-26

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JP2004516476A Expired - Fee Related JP4065876B2 (ja) 2002-07-01 2003-06-12 パッド下の集積半導体構造

Country Status (7)

Country Link
US (1) US7190077B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP1518272B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP4065876B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CN (1) CN100440497C (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (2) DE10229493B4 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW (1) TWI237890B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
WO (1) WO2004004002A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006108329A (ja) * 2004-10-04 2006-04-20 Fujitsu Ltd 半導体装置
CN100413066C (zh) * 2005-11-30 2008-08-20 中芯国际集成电路制造(上海)有限公司 低k介电材料的接合焊盘和用于制造半导体器件的方法
JP5353313B2 (ja) 2009-03-06 2013-11-27 富士通セミコンダクター株式会社 半導体装置
KR101823677B1 (ko) 2011-04-21 2018-01-30 엘지이노텍 주식회사 엘이디 조명장치
US20130154099A1 (en) * 2011-12-16 2013-06-20 Semiconductor Components Industries, Llc Pad over interconnect pad structure design
CN102571135B (zh) * 2012-02-15 2014-05-14 京信通信系统（中国）有限公司 射频半集成应用装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2598328B2 (ja) * 1989-10-17 1997-04-09 三菱電機株式会社 半導体装置およびその製造方法
EP0637840A1 (en) * 1993-08-05 1995-02-08 AT&T Corp. Integrated circuit with active devices under bond pads
KR100267105B1 (ko) * 1997-12-09 2000-11-01 윤종용 다층패드를구비한반도체소자및그제조방법
US5986343A (en) * 1998-05-04 1999-11-16 Lucent Technologies Inc. Bond pad design for integrated circuits
US6232662B1 (en) * 1998-07-14 2001-05-15 Texas Instruments Incorporated System and method for bonding over active integrated circuits
US6087732A (en) * 1998-09-28 2000-07-11 Lucent Technologies, Inc. Bond pad for a flip-chip package
JP2000183104A (ja) * 1998-12-15 2000-06-30 Texas Instr Inc <Ti> 集積回路上でボンディングするためのシステム及び方法
TW430935B (en) * 1999-03-19 2001-04-21 Ind Tech Res Inst Frame type bonding pad structure having a low parasitic capacitance
JP3727220B2 (ja) * 2000-04-03 2005-12-14 Ｎｅｃエレクトロニクス株式会社 半導体装置
US7201784B2 (en) * 2003-06-30 2007-04-10 Intel Corporation Surfactant slurry additives to improve erosion, dishing, and defects during chemical mechanical polishing of copper damascene with low k dielectrics

Also Published As

Publication number Publication date
US7190077B2 (en) 2007-03-13
DE10229493A1 (de) 2004-01-29
CN1666336A (zh) 2005-09-07
CN100440497C (zh) 2008-12-03
JP2006502561A (ja) 2006-01-19
DE50311482D1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2009-06-10
TWI237890B (en) 2005-08-11
EP1518272A1 (de) 2005-03-30
WO2004004002A1 (de) 2004-01-08
US20050242374A1 (en) 2005-11-03
TW200402863A (en) 2004-02-16
DE10229493B4 (de) 2007-03-29
EP1518272B1 (de) 2009-04-29

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