JP4065064B2 - 可視光感光性組成物及びパターンの製造方法 - Google Patents

可視光感光性組成物及びパターンの製造方法 Download PDF

Info

Publication number
JP4065064B2
JP4065064B2 JP26391198A JP26391198A JP4065064B2 JP 4065064 B2 JP4065064 B2 JP 4065064B2 JP 26391198 A JP26391198 A JP 26391198A JP 26391198 A JP26391198 A JP 26391198A JP 4065064 B2 JP4065064 B2 JP 4065064B2
Authority
JP
Japan
Prior art keywords
group
parts
polymer
visible light
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP26391198A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11153858A (ja
JPH11153858A5 (https=
Inventor
玄児 今井
英雄 木暮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kansai Paint Co Ltd
Original Assignee
Kansai Paint Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kansai Paint Co Ltd filed Critical Kansai Paint Co Ltd
Priority to JP26391198A priority Critical patent/JP4065064B2/ja
Publication of JPH11153858A publication Critical patent/JPH11153858A/ja
Publication of JPH11153858A5 publication Critical patent/JPH11153858A5/ja
Application granted granted Critical
Publication of JP4065064B2 publication Critical patent/JP4065064B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Materials For Photolithography (AREA)
  • Paints Or Removers (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP26391198A 1997-09-05 1998-09-03 可視光感光性組成物及びパターンの製造方法 Expired - Fee Related JP4065064B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26391198A JP4065064B2 (ja) 1997-09-05 1998-09-03 可視光感光性組成物及びパターンの製造方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP25623697 1997-09-05
JP9-256236 1997-09-05
JP9-257974 1997-09-08
JP25797497 1997-09-08
JP26391198A JP4065064B2 (ja) 1997-09-05 1998-09-03 可視光感光性組成物及びパターンの製造方法

Publications (3)

Publication Number Publication Date
JPH11153858A JPH11153858A (ja) 1999-06-08
JPH11153858A5 JPH11153858A5 (https=) 2005-10-27
JP4065064B2 true JP4065064B2 (ja) 2008-03-19

Family

ID=27334512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26391198A Expired - Fee Related JP4065064B2 (ja) 1997-09-05 1998-09-03 可視光感光性組成物及びパターンの製造方法

Country Status (1)

Country Link
JP (1) JP4065064B2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007031650A (ja) * 2005-07-29 2007-02-08 Japan Atomic Energy Agency 量子ビームにより着色する樹脂組成物とナノイメージング形成方法
JP5077526B2 (ja) * 2006-09-21 2012-11-21 日産化学工業株式会社 末端に不飽和基を有する化合物を含有するポジ型感光性樹脂組成物
JP5585796B2 (ja) * 2012-07-06 2014-09-10 日産化学工業株式会社 末端に不飽和基を有する化合物を含有するポジ型感光性樹脂組成物
JP6270024B2 (ja) * 2013-10-04 2018-01-31 日立化成株式会社 感光性接着剤組成物、それを用いる半導体装置の製造方法、及び半導体装置

Also Published As

Publication number Publication date
JPH11153858A (ja) 1999-06-08

Similar Documents

Publication Publication Date Title
US5650259A (en) Processes for pattern formation using photosensitive compositions and liquid development
KR100566041B1 (ko) 가시광감광성조성물및패턴의제조방법
JPH10204328A (ja) 反射防止コーティング組成物
US5234791A (en) Radiation-curable composition and radiation-sensitive recording material prepared therefrom for use with high-energy radiation
JPH025060A (ja) レジストパターンを得る方法
JP2004503830A (ja) 化学増幅型ネガ型フォトレジスト組成物
KR100566042B1 (ko) 포지티브형전착포토레지스트조성물및패턴의제조방법
JP2824209B2 (ja) 感光性組成物及びパターンの形成方法
JP4065064B2 (ja) 可視光感光性組成物及びパターンの製造方法
KR100287252B1 (ko) 포지티브형전착포토레지스트조성물및이조성물을사용한레지스트패턴형성법
KR100556079B1 (ko) 크레졸-포름알데히드 반응 혼합물로부터 분별된 노볼락 수지 및 이것으로 제조된 포토레지스트 조성물
JPH06295064A (ja) 感光性組成物及びパターンの製造方法
JP2824191B2 (ja) ポジ型電着フォトレジスト組成物及びレジストパターンの製造方法
JP2824188B2 (ja) 感光性組成物及びパターンの製造方法
JP2916137B2 (ja) 感光性組成物及びパターンの形成方法
JP2000267285A (ja) 感光性組成物及びパターンの形成方法
US7078158B2 (en) Composition for activation energy rays and method of forming pattern
JP2824190B2 (ja) ポジ型電着フォトレジスト組成物及びレジストパターンの製造方法
JPH11237731A (ja) ポジ型電着フオトレジスト組成物及びパターンの製造方法
JPH0736179A (ja) ネガ型感光性樹脂組成物
JPH06313134A (ja) 水性感光性組成物及びパターンの製造方法
JP7729294B2 (ja) ネガ型感光性樹脂組成物及びドライフィルムレジスト
JP2024002706A (ja) 感光性樹脂組成物、パターン硬化膜の製造方法、パターン硬化膜、及び半導体素子
JP2000243173A (ja) タッチパネル用ドットスペーサー及びその形成方法
JPH07128848A (ja) ポジ型感光性樹脂組成物およびレジスト像の製造法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050823

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050823

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070525

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070605

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070802

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20071016

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20071129

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20071225

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20071228

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110111

Year of fee payment: 3

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20080126

A072 Dismissal of procedure [no reply to invitation to correct request for examination]

Free format text: JAPANESE INTERMEDIATE CODE: A072

Effective date: 20080520

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110111

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110111

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees