JP4044223B2 - 基板メッキ装置 - Google Patents

基板メッキ装置 Download PDF

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Publication number
JP4044223B2
JP4044223B2 JP28284598A JP28284598A JP4044223B2 JP 4044223 B2 JP4044223 B2 JP 4044223B2 JP 28284598 A JP28284598 A JP 28284598A JP 28284598 A JP28284598 A JP 28284598A JP 4044223 B2 JP4044223 B2 JP 4044223B2
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JP
Japan
Prior art keywords
substrate
plating
plating apparatus
cleaning
seed layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP28284598A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000109999A5 (enExample
JP2000109999A (ja
Inventor
文夫 栗山
直明 小榑
明久 本郷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP28284598A priority Critical patent/JP4044223B2/ja
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to TW088117038A priority patent/TW428223B/zh
Priority to US09/555,650 priority patent/US6495004B1/en
Priority to KR1020007005920A priority patent/KR100694563B1/ko
Priority to PCT/JP1999/005439 priority patent/WO2000020663A1/ja
Priority to EP99970132A priority patent/EP1048756A4/en
Publication of JP2000109999A publication Critical patent/JP2000109999A/ja
Publication of JP2000109999A5 publication Critical patent/JP2000109999A5/ja
Application granted granted Critical
Publication of JP4044223B2 publication Critical patent/JP4044223B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP28284598A 1998-10-05 1998-10-05 基板メッキ装置 Expired - Lifetime JP4044223B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP28284598A JP4044223B2 (ja) 1998-10-05 1998-10-05 基板メッキ装置
US09/555,650 US6495004B1 (en) 1998-10-05 1999-10-04 Substrate plating apparatus
KR1020007005920A KR100694563B1 (ko) 1998-10-05 1999-10-04 기판도금장치
PCT/JP1999/005439 WO2000020663A1 (fr) 1998-10-05 1999-10-04 Dispositif de placage de substrat
TW088117038A TW428223B (en) 1998-10-05 1999-10-04 Apparatus for plating a substrate
EP99970132A EP1048756A4 (en) 1998-10-05 1999-10-04 DEVICE FOR PLATING SUBSTRATES

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28284598A JP4044223B2 (ja) 1998-10-05 1998-10-05 基板メッキ装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007006325A Division JP2007107101A (ja) 2007-01-15 2007-01-15 基板メッキ装置及び基板メッキ方法

Publications (3)

Publication Number Publication Date
JP2000109999A JP2000109999A (ja) 2000-04-18
JP2000109999A5 JP2000109999A5 (enExample) 2004-12-02
JP4044223B2 true JP4044223B2 (ja) 2008-02-06

Family

ID=17657827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28284598A Expired - Lifetime JP4044223B2 (ja) 1998-10-05 1998-10-05 基板メッキ装置

Country Status (1)

Country Link
JP (1) JP4044223B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006339665A (ja) * 2000-10-12 2006-12-14 Ebara Corp 半導体基板製造装置
JP2008053737A (ja) * 2007-09-03 2008-03-06 Dainippon Screen Mfg Co Ltd 基板処理装置
KR101197403B1 (ko) 2010-06-16 2012-11-05 이영구 다중 증착 방식을 적용한 인라인 증착장치

Also Published As

Publication number Publication date
JP2000109999A (ja) 2000-04-18

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