JP4042906B2 - 研磨用組成物，研磨用組成物の調整方法および研磨方法 - Google Patents

研磨用組成物，研磨用組成物の調整方法および研磨方法 Download PDF

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Publication number
JP4042906B2
JP4042906B2 JP2003127626A JP2003127626A JP4042906B2 JP 4042906 B2 JP4042906 B2 JP 4042906B2 JP 2003127626 A JP2003127626 A JP 2003127626A JP 2003127626 A JP2003127626 A JP 2003127626A JP 4042906 B2 JP4042906 B2 JP 4042906B2
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Prior art keywords
polishing
silicon oxide
polishing composition
particles
composition
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JP2003127626A
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Japanese (ja)
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JP2004331753A (ja
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邦明 前島
慎介 宮部
昌宏 泉
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Nippon Chemical Industrial Co Ltd
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Nippon Chemical Industrial Co Ltd
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Priority to JP2003127626A priority Critical patent/JP4042906B2/ja
Priority to TW093109571A priority patent/TW200504188A/zh
Publication of JP2004331753A publication Critical patent/JP2004331753A/ja
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
JP2003127626A 2003-05-06 2003-05-06 研磨用組成物，研磨用組成物の調整方法および研磨方法 Expired - Fee Related JP4042906B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2003127626A JP4042906B2 (ja) 2003-05-06 2003-05-06 研磨用組成物，研磨用組成物の調整方法および研磨方法
TW093109571A TW200504188A (en) 2003-05-06 2004-04-07 Polishing composition, preparation of polishing composition, and the method of polishing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003127626A JP4042906B2 (ja) 2003-05-06 2003-05-06 研磨用組成物，研磨用組成物の調整方法および研磨方法

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JP2004331753A JP2004331753A (ja) 2004-11-25
JP4042906B2 true JP4042906B2 (ja) 2008-02-06

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JP2003127626A Expired - Fee Related JP4042906B2 (ja) 2003-05-06 2003-05-06 研磨用組成物，研磨用組成物の調整方法および研磨方法

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JP (1) JP4042906B2 (enExample)
TW (1) TW200504188A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5373250B2 (ja) * 2006-02-07 2013-12-18 日本化学工業株式会社 半導体ウエハ研磨用組成物の製造方法
JP5304993B2 (ja) * 2008-08-04 2013-10-02 Ｊｓｒ株式会社 回路基板の製造に用いる化学機械研磨用水系分散体、回路基板の製造方法、回路基板および多層回路基板
JP5396047B2 (ja) * 2008-09-03 2014-01-22 三井金属鉱業株式会社 ガラス用研摩材スラリー
WO2016194614A1 (ja) * 2015-06-03 2016-12-08 株式会社フジミインコーポレーテッド 研磨用組成物、研磨方法、及び製造方法

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TWI299058B (enExample) 2008-07-21
TW200504188A (en) 2005-02-01
JP2004331753A (ja) 2004-11-25

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