TWI299058B - - Google Patents
Download PDFInfo
- Publication number
- TWI299058B TWI299058B TW93109571A TW93109571A TWI299058B TW I299058 B TWI299058 B TW I299058B TW 93109571 A TW93109571 A TW 93109571A TW 93109571 A TW93109571 A TW 93109571A TW I299058 B TWI299058 B TW I299058B
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing
- particles
- grinding
- polishing composition
- cerium oxide
- Prior art date
Links
- 238000005498 polishing Methods 0.000 claims description 61
- 239000002245 particle Substances 0.000 claims description 39
- 238000000227 grinding Methods 0.000 claims description 38
- 239000000203 mixture Substances 0.000 claims description 32
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 18
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 17
- 239000000243 solution Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 10
- 239000000872 buffer Substances 0.000 claims description 5
- 150000001875 compounds Chemical group 0.000 claims description 5
- 239000004744 fabric Substances 0.000 claims description 4
- 239000005357 flat glass Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 239000005304 optical glass Substances 0.000 claims description 4
- 239000000084 colloidal system Substances 0.000 claims description 3
- 238000007517 polishing process Methods 0.000 claims description 3
- 239000004575 stone Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000007853 buffer solution Substances 0.000 claims description 2
- 239000006260 foam Substances 0.000 claims description 2
- 239000010985 leather Substances 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 claims 2
- 239000011163 secondary particle Substances 0.000 claims 2
- 150000003839 salts Chemical class 0.000 claims 1
- 235000021419 vinegar Nutrition 0.000 claims 1
- 239000000052 vinegar Substances 0.000 claims 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 claims 1
- 239000011521 glass Substances 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 238000002156 mixing Methods 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- -1 oxygen oxime Chemical class 0.000 description 3
- 229910052707 ruthenium Inorganic materials 0.000 description 3
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 3
- 241001092040 Crataegus Species 0.000 description 2
- 235000009917 Crataegus X brevipes Nutrition 0.000 description 2
- 235000013204 Crataegus X haemacarpa Nutrition 0.000 description 2
- 235000009685 Crataegus X maligna Nutrition 0.000 description 2
- 235000009444 Crataegus X rubrocarnea Nutrition 0.000 description 2
- 235000009486 Crataegus bullatus Nutrition 0.000 description 2
- 235000017181 Crataegus chrysocarpa Nutrition 0.000 description 2
- 235000009682 Crataegus limnophila Nutrition 0.000 description 2
- 235000004423 Crataegus monogyna Nutrition 0.000 description 2
- 235000002313 Crataegus paludosa Nutrition 0.000 description 2
- 235000009840 Crataegus x incaedua Nutrition 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical compound O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 2
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229910021485 fumed silica Inorganic materials 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 241000282326 Felis catus Species 0.000 description 1
- 125000000174 L-prolyl group Chemical group [H]N1C([H])([H])C([H])([H])C([H])([H])[C@@]1([H])C(*)=O 0.000 description 1
- 206010036790 Productive cough Diseases 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 230000002308 calcification Effects 0.000 description 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 238000004945 emulsification Methods 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 239000000416 hydrocolloid Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000006174 pH buffer Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010454 slate Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 210000003802 sputum Anatomy 0.000 description 1
- 208000024794 sputum Diseases 0.000 description 1
- 235000010269 sulphur dioxide Nutrition 0.000 description 1
- 239000004291 sulphur dioxide Substances 0.000 description 1
- 239000001117 sulphuric acid Substances 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010455 vermiculite Substances 0.000 description 1
- 229910052902 vermiculite Inorganic materials 0.000 description 1
- 235000019354 vermiculite Nutrition 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003127626A JP4042906B2 (ja) | 2003-05-06 | 2003-05-06 | 研磨用組成物，研磨用組成物の調整方法および研磨方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200504188A TW200504188A (en) | 2005-02-01 |
| TWI299058B true TWI299058B (enExample) | 2008-07-21 |
Family
ID=33504056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093109571A TW200504188A (en) | 2003-05-06 | 2004-04-07 | Polishing composition, preparation of polishing composition, and the method of polishing |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4042906B2 (enExample) |
| TW (1) | TW200504188A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI404598B (zh) * | 2008-09-03 | 2013-08-11 | Mitsui Mining & Smelting Co | 玻璃用研磨漿 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5373250B2 (ja) * | 2006-02-07 | 2013-12-18 | 日本化学工業株式会社 | 半導体ウエハ研磨用組成物の製造方法 |
| JP5304993B2 (ja) * | 2008-08-04 | 2013-10-02 | Ｊｓｒ株式会社 | 回路基板の製造に用いる化学機械研磨用水系分散体、回路基板の製造方法、回路基板および多層回路基板 |
| WO2016194614A1 (ja) * | 2015-06-03 | 2016-12-08 | 株式会社フジミインコーポレーテッド | 研磨用組成物、研磨方法、及び製造方法 |
-
2003
- 2003-05-06 JP JP2003127626A patent/JP4042906B2/ja not_active Expired - Fee Related
-
2004
- 2004-04-07 TW TW093109571A patent/TW200504188A/zh not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI404598B (zh) * | 2008-09-03 | 2013-08-11 | Mitsui Mining & Smelting Co | 玻璃用研磨漿 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200504188A (en) | 2005-02-01 |
| JP4042906B2 (ja) | 2008-02-06 |
| JP2004331753A (ja) | 2004-11-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104582899B (zh) | 研磨剂、研磨剂套剂及基体的研磨方法 | |
| JP5953762B2 (ja) | Ｃｍｐ研磨液及びその製造方法、並びに基体の研磨方法 | |
| JP5569574B2 (ja) | 研磨剤及びこの研磨剤を用いた基板の研磨方法 | |
| JP5418590B2 (ja) | 研磨剤、研磨剤セット及び基板の研磨方法 | |
| US20070218811A1 (en) | Cmp polishing slurry and method of polishing substrate | |
| CN102105267B (zh) | 抛光组合物及利用该抛光组合物的抛光方法 | |
| JP6422325B2 (ja) | 半導体基板用研磨液組成物 | |
| WO2019182063A1 (ja) | 研磨液、研磨液セット及び研磨方法 | |
| KR102571098B1 (ko) | 연마액 및 연마 방법 | |
| JP2015088495A (ja) | 研磨剤、研磨剤セット及び基体の研磨方法 | |
| WO2008030420A1 (en) | Silicon carbide polishing method utilizing water-soluble oxidizers | |
| JPWO2020022290A1 (ja) | スラリ及び研磨方法 | |
| WO2019182061A1 (ja) | 研磨液、研磨液セット及び研磨方法 | |
| WO2000008678A1 (en) | Abrasive composition for polishing lsi device | |
| JP6888744B2 (ja) | スラリ及び研磨方法 | |
| WO2018179064A1 (ja) | スラリ及び研磨方法 | |
| TWI299058B (enExample) | ||
| KR20250102094A (ko) | 연마용 음전하 이온 산화제가 포함된 양전하 연마제 | |
| JP2014187268A (ja) | Ｃｍｐ研磨剤及び基板の研磨方法 | |
| JP6728939B2 (ja) | 研磨剤、研磨剤セット及び基体の研磨方法 | |
| JP5362319B2 (ja) | 研磨液組成物 | |
| JP2018095836A (ja) | 正及び負のシリカ粒子を含むｃｍｐ研磨組成物 | |
| TW201606061A (zh) | 有機膜硏磨用組成物及硏磨方法 | |
| TWI326706B (enExample) | ||
| TWI284674B (en) | Polishing composition, preparation method thereof and wafer polishing method using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |