TWI299058B - - Google Patents

Description

1299058

The present invention relates to 斟# ρ ^ β γ Ί Ί · an oxygen oxime on a conductor wafer, a gss disk, a photomask, a main octagonal insulating film, an optical glass Bu Gongyan, research on the surface of the compound of the second compound = 矽 is five, the invention description (1) [Technical field of the invention] ^And the grinding method using the polishing composition [Prior Art] In the magnetic glass, the reticle, the semiconductor wafer-film, the optical glass, etc., the oxidized ruthenium is used for the ruthenium, the alumina, the second oxidization Knife., 5 surface grinding system visits 唉 ^ Fumed silica (fumed silica), plastic 髀 - = 4. 4 temples are decorated on the surface of the dioxide has excellent emulsification two grinding speed.研磨 研磨 研磨 : : : : : : : : : : : : : : : : 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及Disperse in the pH 9 ~ 丨 oxidize ♦ granules by the mechanical action of =, and the precision of grinding by the test = oxidizing human action. Shi Xi is: 2 after the action of the post-combination with the general colloidal dioxide 2 1 soft and alkali material, easy to scratch and cause excessive erosion. The mouth is also compared with the above, the magnetic glass, the fossil eve insulating film, the optical glass, etc. Oxygen grinding also requires wafers 1. When the grinding is more than doubled, the door hanger is used: to use only the cerium oxide with a large particle diameter in the polishing process: use 1. The abrasive or the use of the oxidized stone It

7082-6271-PF(N2).ptd $7 Page 1299058

However, the high grinding cost is not the fifth. The invention description (2) The use of the southern concentration test has been implemented in a reasonable state. : cerium oxide on a semi-V-body wafer is placed on a synthetic resin foam or a creped disk, and is ground, a colloidal cerium oxide, etc. Generally, a magnetic glass, a reticle, an insulating film, and an optical In the step of glass or the like, a polishing cloth composed of a leather or the like is synthesized, and the method of polishing is performed by pressing and rotating to quantitatively supply an oxidizing agent. The basic technique for polishing a solution using a solution containing an alkali component (refer to the example of grinding) is different from the prior art in that the use of a solution such as a particle is called mechanical polishing. That is, the surface is formed by the mechanical action of the thin and soft etched layer to be removed, and the grinding is performed because the alkali component of the solution having the alkali component is pH 7 or higher. There are many patent applications in the region where the force is enhanced and the composition is accelerated, and fine colloidal cerium oxide particles have been dispersed as in Patent Document 1). The above-mentioned research on the chemical role of diamond vermiculite, or hard aluminum system, in particular, the rot of the hunters, in wafers, etc. By colloidal cerium oxide particles. The pH of the polishing composition solution is chemically ground, so it is necessary to say that the p Η 近 近 近 显示 显示 显示 显示 显示 显示 显示 显示 显示 显示 显示 显示 显示 显示 显示 显示 显示 显示 显示 显示 近 。 。 。 。 。 。 Therefore, for the above-mentioned grinding, the properties of the polishing composition solution are extremely important factors, and the properties and properties thereof, specifically, the formation speed of the design etching layer and the removal grinding speed are balanced, and must be stabilized for a long time change = and Factors other than temperature changes. In particular, the range of pH stability is not important. The etching layer is made by the glue contained in the polishing composition.

1299058 V. INSTRUCTIONS (3) The mechanical action of the body cerium oxide particles has an appropriate size. It has been revealed that the sulphuric acid is used as a polishing emulsifier for wafers and the like. The particles are used to expose the silica s〇i to be removed, so that the particles must have a dose. About and 希夕谬 (silica sen) 7. An aqueous dispersion slurry using dioxane (for example, the patent document) and (SlUrry) as a semi-S11 ica) (refer to the insulating layer of the circle (the colloidal dioxygenation of the dioxin-cutting abrasive) The bismuth (four) sub-component of the body cerium oxide bead-like structure is composed of /), and the cerium is not high in the enthalpy polishing rate (see, for example, the patent f: face 4 = the above-mentioned particle size mixing system) (Syt〇n) 2: (Specially, the average particle diameter is 4 〇 nm, and the wide particles having 10 to 20 0 nm are used according to Patent Documents 6 and 7). The particles are mixed with the clothes / a... The high polishing rate of the products has been discovered in recent years. However, the presence of too small particles may cause deterioration of the mixing stability with other drugs, and the presence of excessive particles may cause scratches and doubts about filling the wiring trenches, the next generation. In Patent Document 8, a mixed system having a particle size similar to two or more types of Syton is used. Among them, there is no excessive particle, and a mixed system of two or more kinds of particle diameters is excellent, and which amount is too wide. The range cannot be determined and there is no Now unintentional use of conventional progressive SYT〇N art. And 'The present inventors have found that 15~3 Onm and second type of particles of 60~1〇 〇nm

7082-6271-PF(N2).ptd Page 9 1299058 V. DESCRIPTION OF THE INVENTION (4) The specific amount of the diameter is applied to the present invention in comparison with the polishing composition of the mixing system. *Swinging high-grade...The grinding of the surface of the hard sulphur dioxide must be discovered recently. It has been revealed that the method of using colloidal silica is used for the purpose of removing particles that are easily left on the surface of the f-plane. : Read 9 and 1G) n iron stone ^ water y body patented when grinding: less scratches and flat lagging (see document 11). However, high polishing performance cannot be achieved without the technique of discussing any of the cerium oxide particle liquids. On the other hand, there have been many proposals for liquid composition that are secondary. In the above-mentioned Patent Document 1', the polishing rate is increased by the pH of the suspension in the range of 1 〇 5 to 12. 5 . In addition, a polishing composition containing a water-soluble polymer water-soluble group having a molecular weight of 1,000,000 or more of hydrocolloid cerium oxide has been disclosed (see, for example, Patent Document 13). ). Further, it has been disclosed; and J 2 contains a piperazine of one type of water and a cerium oxide colloidal cerium oxide, and contains 10 to 80% by weight of a polishing composition/grinding method ( Reference is made, for example, to Patent Document 14). However, in the case of the above-mentioned proposal, in the alkaline mother liquid, a solution having a basic structure of an abrasive composed of fine particles such as colloidal cerium oxide or cerium oxide rubber is dispersed, and t is added by adding each. ΪImproving the dispersibility of the abrasive to increase the stability of the polishing. The polishing rate of the conventional polishing composition is improved for a long period of time. Bu has revealed that by adding the opposite number of pairs using acid dissociation numbers, 弱 1 2 · 0 weak acid and / or weak base, weak acid and strong base, weak

1299058 V. Description of the invention (5^ " ' ' ---------- Any combination of acid and weak base and liquid colloidal cerium oxide compound ^: buffer of buffering effect The use of the solvent 17 and 18) buffers, although the two documents 15,16, less, and repeated use of the two conditions change the pH of the low low polishing rate, in order to improve the upper two plus = grinding The composition, but the pH concentration, the stability of the colloid is deteriorated. The composition of the mouth-forming buffer is a stable use product. Further, when asked, it eventually causes gelation. It is not known to use titanium on an acidic two-body circuit containing a fluorinated I bow (refer to, for example, special mud slurry as a method of grinding and grinding ruthenium dioxide. Various fields = 19), the method of alkaline calcification of silver to oxidize the surface, but containing a gas, known as a fluorine ion immersion composition is the discovery of the present inventors. This is determined by the colloidal cerium dioxide of the ion, and the addition of the day of grinding does not ensure the stability of the colloid [Patent IU] Θ used up. US Patent No. 3328 1 41 Specification [Patent Document 2] US Patent No. 3 1 702 73 Specification [Patent Document 3] US Patent No. 4 9 1 0 1 5 5 Specification [Patent Document 4] Special Kaiping 7 -22 1 0 5 9 No. [Patent Document 5] Japanese Patent Publication No. 2 0 0 1 -1 1 43 No. 3 [Patent Document 6]

1299058_ V. INSTRUCTIONS (6) US Patent No. 348 5 6 08 Specification [Patent Document 7] US Patent No. 40 579 3 9 Specification [Patent Document 8] Japanese Patent Publication No. 2 0 0 2 -3 02 74, Patent Literature 9] Japanese Patent Publication No. 2 0 0 0 -3 433 9 0 [Patent Document 10] Japanese Patent Publication No. 0 0 0 1 -3 08 0 5 0 [Patent Document 1 1] Special Kaiping 2 0 0 1 -3 1 Japanese Patent Publication No. 4 1 6 9 3 3 7 [Patent Document 13] Japanese Patent Publication No. Hei 2 - 1 5 86 84 (Patent Document 1 4) Special Kaiping 5 - 1 547 [Patent Document 15] Japanese Laid-Open Patent Publication No. Hei No. Hei 1 1 - 3 1 5 273 [Patent Document 16] Japanese Patent Laid-Open Publication No. Hei No. Hei 1 1 - 3 02 6 3 5 [Patent Document 17] Special Kaiping 1 1 - 3 02 634 No. [Patent Document 18]

7082-6271-PF(N2).ptd Page 12 1299058 V. Description of invention (14) m 诩i ift m δ si 苟u A nn 31 Μ Η3 Η· 3 ί〇〇W River? 0 乂IQ 1 m H· o H aw 藤河ο 1 m Η· P a ο S m ο 乂1 υι Η· 00 ο imw B 河Η ιΡψ _ ο 1 m 41 Η ύ 砘Ml Ff1 _ to Ch UD μ-1 O CO o ο ο ο ο Μ Η - Ο ω ο » 盛Μ Η- M 〇o ο Η- ο ο I-1 Η· ω ο ο » m DO l·-1 in H- 〇CJ o ο Μ ο Ο Η-1 Η- ο Η· ο ο Vt- ή Η - H- ω h* o o Η ϋ ϋ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . - Η-μ ο b Ο Vr ή »1 [Examples 3 to 6 and Comparative Examples 4 to 7] An example of surface polishing of slate glass is described below. The slab glass is pre-grinded with enamel abrasives (Speedfam CO#SF620). use

Page 20 7082-6271-PF(N2).ptd 1299058_ V. INSTRUCTION DESCRIPTION (15) The polishing composition of the content shown in Table 2 was subjected to a polishing test, and the results are shown in Table 2. The polishing conditions were subjected to mirror polishing in the following manner. <Polishing conditions> Grinding device: fixing plate diameter 65 mm, double-side grinding device fixing speed: 30 rpm Grinding cloth: Suba 400 (manufactured by Rodale) Load weight: 150 g/cm2 Grinding composition flow rate: 3 0 0 m 1 /min Grinding time: 7 minutes Workpiece: The pH of the green plate glass polishing composition was measured by a pH meter. The evaluation of the polished surface was carried out by visual observation of the state of occurrence of hydrazine (HAZE) under a spotlight. The polishing rate is converted by the change in thickness of the weight of the whiteboard glass before and after the grinding. It can be seen from Examples 3 to 6 that the mixing of small particles with a specific amount of large particles can significantly increase the polishing rate. In Comparative Example 4, only the increase in the mixing ratio of the small particles and the large particles of Comparative Examples 5 to 7 showed that the polishing rate was remarkably lowered.

7082-6271-PF(N2).ptd Page 21 1299058 V. Description of invention (16) m Art mm § Long ^ 11 nn ma Μ m River 1 3 Η· as» g Shop S υϊ Η· £ Η a W vine η Ώ 1 m Η· ;g 3 0) 8 藤 m Κ m £ GO Ο 1 m 屮Η River Ml [Πφ 岫ο I &amp; 藤 藤河 jjnfl imp _ μ 〇γϊ Q0 o CO ο Ο Κ1· ο Ο Η·1· Μ* Ο ϋι ID Cn mm 望ω KD ΓΟ三CO ο ο Ξ Ο Μ* — Ο UD 〇» m 山班cn OO ο ο Ο Η1· Η w Ο GO 〇m a cn — Cn To ο Η1· Ο ο Ο Η1 Μ· CO Ο -J 〇» m ( (Tt 瞎H1· DO o ω ο ο Ο Μ- ο o Vt- a 51 G σι ο ο Ο Η Η 4 Cn ο (Jl o Vt - a cn Hawthorn - Ο Cn ο ο Μ - ο Ο Μ - -J ο CjJ o Vt- ma CTk Stuffed H1· A 〇g Cn ο ο Ο Μ · ο o Vnr ύ -〇 [Examples 4 to 6 and The following is a description of the example of the grinding surface of the glass 81 glass ~ piece 5 i case magnetic comparison! om deuteration

7082-6271-PF(N2).ptd Page 22 1299058 V. INSTRUCTIONS (17) The magnetic sheet glass is ground using a 钸 grinding (Speedf am C0#SF6 20 ) material. The polishing test was carried out using the polishing composition shown in Table 3, and the results are shown in Table 3. The polishing conditions were subjected to mirror polishing in the following manner. <Grinding conditions> Grinding device · · Plate diameter 6 5 0 mm, double-side grinding device plate rotation speed: 30 rpm Grinding cloth · Suba 40 0 (manufactured by Rodale) Weight: 1 5 0 g / c m2 Grinding Composition flow rate · 3 0 0 m 1 /min Grinding time: 7 minutes Workpiece: 2 · 5 inches of crystallized magnetic sheet glass "The pH of the polishing composition is measured by a pH meter. The evaluation of the polished surface is in the set The state of occurrence of ruthenium was observed with the naked eye under the light. The polishing rate was converted from the change in thickness of the weight of the whiteboard glass before polishing. Comparing Comparative Example 8 with Example 7, it can be seen that a small amount is distributed in the small particles. The particle size of the human particles can significantly increase the polishing rate. Moreover, compared with the examples 7 to 9, it can be seen that the pH J is important because the grinding speed increases when f 'pH is high, and conversely, ^ I(J , 〇^ 1 〇 ^ ^ ^ It is seen that the effect of the material is good. Fluoride ions can promote the addition of low pH and can be ground. The other side φ, in the case of: 曰 = concentration reduction, shows that even if there are more additives; can not be two lines: 23 Page 7082-6271-PF(N2).Ptd 1299058 V. Description of invention (18) m 鞠 艺 艺 m m Sf! iA mm Η m cat river 1 3 Η· S ί3* K 萏ΙΩ Μ· g 3 〇g _ m κ 萏Ui Μ- g Η am river ο hundred 1 Ui Μ· g S! £ΰ 8 vine灸 吁 吁 U « « « « « « « « « « « « « « ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I To ο μ-1 ο -J ο ο b ο ο ο KD Ο mm 00 二上KD kD ο ο ο ο σ Ο Ι 1--1 1-^ Μ- Ο Ο m kD ΓΟ VO Mountain ID KD ο ο CTt ο ο ο σι Ο Η1 !-&gt; \^ ο UD Ο mm Room H- 〇Μ 砘S Hawthorn · CO Ο ο Ο Μ- Ο IJ· IJ- ο Μ Ο Ο t Vt- 热 00 驰方_到to 00 ο VD kD Ο CO ο ο ο ο cn Μ Μ* Μ· Η ο VD Ο Vt- M m KD m δϋ »-· !&gt;0 Ο ID KD ο ο Ο Ο CT. Ο Η Μ- ε ο Ο yt- Sl g g Μ to -J ο VD ο ο Ο S ο ο CT* DO Ο »-« οο ο Vt&quot; 1— # 态 例 例 例 例 例 例 例 例 例 例 例 例 例 例 例 例 例 例 例 例 例 例In the case of the fixed limit, the technique of the book is written by Fan Li, and the application of the application is 7082-6271-PF. (N2).ptd Page 24 1299058

V. INSTRUCTION OF THE INVENTION (19) The idea that substantially the same structure and the same effect can be achieved is within the technical scope of the present invention. White inclusion For example, the above-mentioned polishing step is a polishing showing the breakage of the glass, but the polishing of the display panel and the ruthenium oxide film can also be carried out using the abrasive of the present invention. ", the effect of the invention" As described above, the polishing composition of the present invention is formed from a colloidal solution in which the average primary particle loading level can be clearly distinguished from 40 to 6 〇 nm and 60 to 100 nm. The two types of cerium oxide particles are present in a ratio of 丨:〇. 〇0.3 by weight, and the concentration of oxygen in the whole polishing composition is as follows: the concentration of the stalk is in the range of 5 to 4. In order to have a buffering effect between pH 9·7~10. 7 + Pro/Valley/Night, the above composition is to increase the grinding speed in a buffer solution of a small particle with a solution of the solution, and then use a pH buffer. Effect 2 - 疋 1 large particles and significant surface polishing of the cerium dioxide glass: i used sputum, for example, using the above-mentioned grinding surface is in good condition, can be greatly modified = 'grinding speed is increased, and the polishing combination The composition of the substance is also the problem of the second. In addition, the fluoride ion or the fluorine-coordinated anion 彳·mol/kg-Si〇2 degree of the present invention.

1299058_ BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 shows the polishing rate (nm/m in) when the surface of the white glass (main surface) is polished using a polishing composition that varies the weight ratio of large particles to small particles.

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Claims (1)

1299058 皇号9310QH71 六-, the scope of application for patents · 1 · A polishing composition, suitable for magnetic sheet glass, yttria insulating film on the circle, optical glass, etc. with yttrium oxide: y, I surface grinding , consisting of a colloidal solution, wherein the colloid::: ΐ ΐ particles and two large particles of cerium oxide +, the small particles of single 拗 two = secondary particle diameter is 40 nm or more, 60 nm or less, and the large particle: The particle diameter is more than 60 nm and less than 100 nm, and the ratio of the small particles is higher than ΐϊΐΐίHf1:0·05~1 ·Λ3, and the concentration of the oxidized stone particles of the a substance is 5% by weight to 10 7 a range of = wherein the colloidal solution is prepared by a buffer solution in which a buffer having a pH of 9. 8 a buffer is dissolved; and the composition for rubbing is f white ηπΐΛ J and the gas is coordinated with the gas T.lmol/kg-SiQ2(4)(1)^ Modulation 2: According to the first item, the secondary particle diameter of the polishing composition is 40:2, and the second step will be the average of the polishing composition - 2 types of the range Oxidized 2〇4niD below with a weight ratio of more than Μ1&quot;, 1001&quot; The colloidal solution is diluted with 1:3·05~1: 〇·3 of 3:the range of the polishing composition described in item 2 of the above range, into 5 weights using water or a solution of salt The colloidal solution having a concentration of yttrium oxide particles as a whole is in the range of 2% y and less than 20% by weight, and a pH of 9. 7 to 10 7 is used as a polishing composition. · (Glue, Shi, Xi, 4m: a method of grinding, by using the compound group as the first part of the patent application &quot; Page 27 1299058 ___ Case No. 93109571 VI-, the scope of patent application into the object to be ground. (5) A method of polishing, in which a polishing object composed of a compound containing cerium oxide as a main component is placed on a plate on which a polishing cloth composed of a synthetic vinegar foam or a suede-adjusted leather is placed, and the pressing is rotated and supplied. The main surface of the object to be polished is polished by applying the polishing composition according to item 1 of the patent application. 6. A polishing method using a polishing apparatus having a polishing element having a surface-attached polishing portion, the abrasive element being brought into contact with a ground end surface composed of a compound containing cerium oxide as a main component, and the polishing element and/or the object to be polished The material for polishing is supplied to the end surface portion and the object to be polished is ground by the polishing composition according to the above-mentioned patent application. 7082-6271-PFKN2)第28页