TW200504188A - Polishing composition, preparation of polishing composition, and the method of polishing - Google Patents

Polishing composition, preparation of polishing composition, and the method of polishing

Info

Publication number
TW200504188A
TW200504188A TW093109571A TW93109571A TW200504188A TW 200504188 A TW200504188 A TW 200504188A TW 093109571 A TW093109571 A TW 093109571A TW 93109571 A TW93109571 A TW 93109571A TW 200504188 A TW200504188 A TW 200504188A
Authority
TW
Taiwan
Prior art keywords
polishing
composition
polishing composition
silica
preparation
Prior art date
Application number
TW093109571A
Other languages
Chinese (zh)
Other versions
TWI299058B (en
Inventor
Kuniaki Maejima
Shinsuke Miyabe
Masahiro Izumi
Original Assignee
Nippon Chemical Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Chemical Ind filed Critical Nippon Chemical Ind
Publication of TW200504188A publication Critical patent/TW200504188A/en
Application granted granted Critical
Publication of TWI299058B publication Critical patent/TWI299058B/zh

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Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

This invention relates to a fast, smooth surface polishing composition with silica as main ingredient, preparation of the composition, and the polishing method using same. The disclosed polishing composition comprises 2 kinds of silica with definitely distinguished average one-dimensional particle diameters of 40 ~ 60 nm and 60 ~ 100 nm existing in the ratio of 1:0.05 ~ 1:0.3 by weight. To the polishing composition as a whole, the concentration of silica particles comprises 5 ~ 40 wt% of colloid solution, in which the colloid solution is prepared by the buffer solution of salt dissolution with buffering function falling within pH 9.7 ~ 10.7. The ingredient of above composition also incorporated 0.01 ~ 0.1 mol/Kg-SiO2 of fluorine ion or anion from fluorine complex. If the disclosed composition is used to polish the surface of glass disk, the polishing speed can be increased and surface smoothness can be improved.
TW093109571A 2003-05-06 2004-04-07 Polishing composition, preparation of polishing composition, and the method of polishing TW200504188A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003127626A JP4042906B2 (en) 2003-05-06 2003-05-06 Polishing composition, method for adjusting polishing composition, and polishing method

Publications (2)

Publication Number Publication Date
TW200504188A true TW200504188A (en) 2005-02-01
TWI299058B TWI299058B (en) 2008-07-21

Family

ID=33504056

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093109571A TW200504188A (en) 2003-05-06 2004-04-07 Polishing composition, preparation of polishing composition, and the method of polishing

Country Status (2)

Country Link
JP (1) JP4042906B2 (en)
TW (1) TW200504188A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5373250B2 (en) * 2006-02-07 2013-12-18 日本化学工業株式会社 Method for producing semiconductor wafer polishing composition
JP5304993B2 (en) * 2008-08-04 2013-10-02 Ｊｓｒ株式会社 Chemical mechanical polishing aqueous dispersion for use in circuit board production, circuit board production method, circuit board, and multilayer circuit board
JP5396047B2 (en) * 2008-09-03 2014-01-22 三井金属鉱業株式会社 Abrasive slurry for glass
WO2016194614A1 (en) * 2015-06-03 2016-12-08 株式会社フジミインコーポレーテッド Polishing composition, polishing method, and production method

Also Published As

Publication number Publication date
JP2004331753A (en) 2004-11-25
TWI299058B (en) 2008-07-21
JP4042906B2 (en) 2008-02-06

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees