TW200504188A - Polishing composition, preparation of polishing composition, and the method of polishing - Google Patents
Polishing composition, preparation of polishing composition, and the method of polishingInfo
- Publication number
- TW200504188A TW200504188A TW093109571A TW93109571A TW200504188A TW 200504188 A TW200504188 A TW 200504188A TW 093109571 A TW093109571 A TW 093109571A TW 93109571 A TW93109571 A TW 93109571A TW 200504188 A TW200504188 A TW 200504188A
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing
- composition
- polishing composition
- silica
- preparation
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 8
- 238000005498 polishing Methods 0.000 title abstract 7
- 238000002360 preparation method Methods 0.000 title abstract 2
- 238000007517 polishing process Methods 0.000 title 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 6
- 239000000377 silicon dioxide Substances 0.000 abstract 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 abstract 2
- 239000000084 colloidal system Substances 0.000 abstract 2
- 239000000243 solution Substances 0.000 abstract 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 abstract 1
- 239000007853 buffer solution Substances 0.000 abstract 1
- 230000003139 buffering effect Effects 0.000 abstract 1
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 238000004090 dissolution Methods 0.000 abstract 1
- 229910052731 fluorine Inorganic materials 0.000 abstract 1
- 239000011737 fluorine Substances 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 239000004615 ingredient Substances 0.000 abstract 1
- 239000002075 main ingredient Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003127626A JP4042906B2 (ja) | 2003-05-06 | 2003-05-06 | 研磨用組成物，研磨用組成物の調整方法および研磨方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200504188A true TW200504188A (en) | 2005-02-01 |
| TWI299058B TWI299058B (enExample) | 2008-07-21 |
Family
ID=33504056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093109571A TW200504188A (en) | 2003-05-06 | 2004-04-07 | Polishing composition, preparation of polishing composition, and the method of polishing |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4042906B2 (enExample) |
| TW (1) | TW200504188A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5373250B2 (ja) * | 2006-02-07 | 2013-12-18 | 日本化学工業株式会社 | 半導体ウエハ研磨用組成物の製造方法 |
| JP5304993B2 (ja) * | 2008-08-04 | 2013-10-02 | Ｊｓｒ株式会社 | 回路基板の製造に用いる化学機械研磨用水系分散体、回路基板の製造方法、回路基板および多層回路基板 |
| JP5396047B2 (ja) * | 2008-09-03 | 2014-01-22 | 三井金属鉱業株式会社 | ガラス用研摩材スラリー |
| WO2016194614A1 (ja) * | 2015-06-03 | 2016-12-08 | 株式会社フジミインコーポレーテッド | 研磨用組成物、研磨方法、及び製造方法 |
-
2003
- 2003-05-06 JP JP2003127626A patent/JP4042906B2/ja not_active Expired - Fee Related
-
2004
- 2004-04-07 TW TW093109571A patent/TW200504188A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI299058B (enExample) | 2008-07-21 |
| JP4042906B2 (ja) | 2008-02-06 |
| JP2004331753A (ja) | 2004-11-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |