JP4034612B2 - 多層回路基板の止まり穴加工方法 - Google Patents

多層回路基板の止まり穴加工方法 Download PDF

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Publication number
JP4034612B2
JP4034612B2 JP2002219967A JP2002219967A JP4034612B2 JP 4034612 B2 JP4034612 B2 JP 4034612B2 JP 2002219967 A JP2002219967 A JP 2002219967A JP 2002219967 A JP2002219967 A JP 2002219967A JP 4034612 B2 JP4034612 B2 JP 4034612B2
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JP
Japan
Prior art keywords
multilayer circuit
circuit board
measurement
probe
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2002219967A
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English (en)
Japanese (ja)
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JP2004063771A (ja
Inventor
徹 結城
民雄 大谷
靖 伊藤
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Via Mechanics Ltd
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Hitachi Via Mechanics Ltd
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Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Priority to JP2002219967A priority Critical patent/JP4034612B2/ja
Priority to TW92118833A priority patent/TW200402256A/zh
Priority to CNB031503357A priority patent/CN100469499C/zh
Publication of JP2004063771A publication Critical patent/JP2004063771A/ja
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Publication of JP4034612B2 publication Critical patent/JP4034612B2/ja
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Expired - Lifetime legal-status Critical Current

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  • Drilling And Boring (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2002219967A 2002-07-29 2002-07-29 多層回路基板の止まり穴加工方法 Expired - Lifetime JP4034612B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2002219967A JP4034612B2 (ja) 2002-07-29 2002-07-29 多層回路基板の止まり穴加工方法
TW92118833A TW200402256A (en) 2002-07-29 2003-07-10 Multi-layered circuit board, detector for measurement, processing apparatus for blind through hole and processing method for blind through hole
CNB031503357A CN100469499C (zh) 2002-07-29 2003-07-24 多层电路板的定位孔加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002219967A JP4034612B2 (ja) 2002-07-29 2002-07-29 多層回路基板の止まり穴加工方法

Publications (2)

Publication Number Publication Date
JP2004063771A JP2004063771A (ja) 2004-02-26
JP4034612B2 true JP4034612B2 (ja) 2008-01-16

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JP2002219967A Expired - Lifetime JP4034612B2 (ja) 2002-07-29 2002-07-29 多層回路基板の止まり穴加工方法

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JP (1) JP4034612B2 (zh)
CN (1) CN100469499C (zh)
TW (1) TW200402256A (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4611010B2 (ja) * 2004-12-10 2011-01-12 日立ビアメカニクス株式会社 多層回路基板の製造方法
CN101537505B (zh) * 2008-12-30 2011-05-25 南京依利安达电子有限公司 印刷电路板的小孔径高密度钻孔方法
CN102069209B (zh) * 2010-12-22 2012-11-14 北京控制工程研究所 一种铝合金、铜合金零件的微孔钻削加工方法
CN102319976B (zh) * 2011-06-03 2012-12-26 哈尔滨飞机工业集团有限责任公司 一种成型模中产品定位件定位孔的加工方法
DE102013004679B4 (de) * 2013-03-19 2017-11-23 Skybrain Vermögensverwaltung GmbH Vorrichtung und Verfahren zum Bearbeiten von Leiterplatten
TW201605315A (zh) * 2014-02-21 2016-02-01 維亞機械股份有限公司 背鑽加工方法以及背鑽加工裝置
JP7054587B2 (ja) * 2016-11-25 2022-04-14 ビアメカニクス株式会社 ドリル加工装置及びドリル加工方法
CN106932709A (zh) * 2017-02-17 2017-07-07 李培培 一种多层线路板通电观测用调试装置
JP6861581B2 (ja) * 2017-06-09 2021-04-21 三菱電機株式会社 多層基板の信号取得構造、信号取得装置および電子装置

Also Published As

Publication number Publication date
CN100469499C (zh) 2009-03-18
CN1478626A (zh) 2004-03-03
JP2004063771A (ja) 2004-02-26
TWI319964B (zh) 2010-01-21
TW200402256A (en) 2004-02-01

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