JP4006023B2 - 集積回路 - Google Patents

集積回路 Download PDF

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Publication number
JP4006023B2
JP4006023B2 JP50615297A JP50615297A JP4006023B2 JP 4006023 B2 JP4006023 B2 JP 4006023B2 JP 50615297 A JP50615297 A JP 50615297A JP 50615297 A JP50615297 A JP 50615297A JP 4006023 B2 JP4006023 B2 JP 4006023B2
Authority
JP
Japan
Prior art keywords
integrated circuit
esd protection
predetermined length
protection structure
insulating region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP50615297A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11509371A (ja
Inventor
ヘベカー、ハインツ
レクツエク、ウエルナー
サヴイニアク、ドミニク
テレツキ、ハルトムート
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPH11509371A publication Critical patent/JPH11509371A/ja
Application granted granted Critical
Publication of JP4006023B2 publication Critical patent/JP4006023B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
    • H10D89/811—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using FETs as protective elements

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  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
JP50615297A 1995-07-20 1996-07-11 集積回路 Expired - Lifetime JP4006023B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19526566.1 1995-07-20
DE19526566 1995-07-20
PCT/DE1996/001258 WO1997004484A1 (de) 1995-07-20 1996-07-11 Integrierte schaltung

Publications (2)

Publication Number Publication Date
JPH11509371A JPH11509371A (ja) 1999-08-17
JP4006023B2 true JP4006023B2 (ja) 2007-11-14

Family

ID=7767368

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50615297A Expired - Lifetime JP4006023B2 (ja) 1995-07-20 1996-07-11 集積回路

Country Status (6)

Country Link
EP (1) EP0839389B1 (enExample)
JP (1) JP4006023B2 (enExample)
KR (1) KR100308074B1 (enExample)
DE (1) DE59608801D1 (enExample)
TW (1) TW308733B (enExample)
WO (1) WO1997004484A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10217935B4 (de) * 2001-04-23 2007-06-28 Fuji Electric Co., Ltd., Kawasaki Halbleiterbauteil

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4734752A (en) * 1985-09-27 1988-03-29 Advanced Micro Devices, Inc. Electrostatic discharge protection device for CMOS integrated circuit outputs
JPH065749B2 (ja) * 1986-05-22 1994-01-19 日本電気株式会社 半導体装置
KR940004449B1 (ko) * 1990-03-02 1994-05-25 가부시키가이샤 도시바 반도체장치

Also Published As

Publication number Publication date
TW308733B (enExample) 1997-06-21
EP0839389B1 (de) 2002-02-27
DE59608801D1 (de) 2002-04-04
KR100308074B1 (ko) 2001-11-17
EP0839389A1 (de) 1998-05-06
JPH11509371A (ja) 1999-08-17
KR19990028970A (ko) 1999-04-15
WO1997004484A1 (de) 1997-02-06

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