JP4005199B2 - 細線ワイヤソー装置 - Google Patents
細線ワイヤソー装置 Download PDFInfo
- Publication number
- JP4005199B2 JP4005199B2 JP1549398A JP1549398A JP4005199B2 JP 4005199 B2 JP4005199 B2 JP 4005199B2 JP 1549398 A JP1549398 A JP 1549398A JP 1549398 A JP1549398 A JP 1549398A JP 4005199 B2 JP4005199 B2 JP 4005199B2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- fixing base
- wire saw
- holding
- thin wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005520 cutting process Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 4
- 238000003754 machining Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1549398A JP4005199B2 (ja) | 1998-01-28 | 1998-01-28 | 細線ワイヤソー装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1549398A JP4005199B2 (ja) | 1998-01-28 | 1998-01-28 | 細線ワイヤソー装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH11207597A JPH11207597A (ja) | 1999-08-03 |
| JPH11207597A5 JPH11207597A5 (enExample) | 2005-06-09 |
| JP4005199B2 true JP4005199B2 (ja) | 2007-11-07 |
Family
ID=11890344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1549398A Expired - Fee Related JP4005199B2 (ja) | 1998-01-28 | 1998-01-28 | 細線ワイヤソー装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4005199B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100445881B1 (ko) * | 2002-07-03 | 2004-08-25 | 주식회사 영광산업 | 에어컨 콤퓨레이셔용 사판의 면치가공장치 |
| CN115816664B (zh) * | 2022-12-28 | 2024-11-12 | 泉州市品河精密科技有限公司 | 石材切割方法 |
-
1998
- 1998-01-28 JP JP1549398A patent/JP4005199B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11207597A (ja) | 1999-08-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Effective date: 20040826 Free format text: JAPANESE INTERMEDIATE CODE: A523 |
|
| A621 | Written request for application examination |
Effective date: 20041116 Free format text: JAPANESE INTERMEDIATE CODE: A621 |
|
| A977 | Report on retrieval |
Effective date: 20061110 Free format text: JAPANESE INTERMEDIATE CODE: A971007 |
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| A131 | Notification of reasons for refusal |
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| A521 | Written amendment |
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| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20070821 |
|
| A61 | First payment of annual fees (during grant procedure) |
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| R150 | Certificate of patent (=grant) or registration of utility model |
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| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 3 Free format text: PAYMENT UNTIL: 20100831 |
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| LAPS | Cancellation because of no payment of annual fees |