JP3992488B2 - 液処理装置および液処理方法 - Google Patents
液処理装置および液処理方法 Download PDFInfo
- Publication number
- JP3992488B2 JP3992488B2 JP2001378543A JP2001378543A JP3992488B2 JP 3992488 B2 JP3992488 B2 JP 3992488B2 JP 2001378543 A JP2001378543 A JP 2001378543A JP 2001378543 A JP2001378543 A JP 2001378543A JP 3992488 B2 JP3992488 B2 JP 3992488B2
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- JP
- Japan
- Prior art keywords
- chamber
- cleaning
- processing
- liquid
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000012545 processing Methods 0.000 title claims description 231
- 239000007788 liquid Substances 0.000 title claims description 177
- 238000003672 processing method Methods 0.000 title claims description 14
- 238000004140 cleaning Methods 0.000 claims description 256
- 230000007246 mechanism Effects 0.000 claims description 238
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 58
- 238000000034 method Methods 0.000 claims description 52
- 239000007789 gas Substances 0.000 claims description 41
- 239000000758 substrate Substances 0.000 claims description 40
- 230000008569 process Effects 0.000 claims description 38
- 238000011282 treatment Methods 0.000 claims description 30
- 238000001035 drying Methods 0.000 claims description 21
- 238000007599 discharging Methods 0.000 claims description 15
- 230000000694 effects Effects 0.000 claims description 12
- 239000011261 inert gas Substances 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000003021 water soluble solvent Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 197
- 238000012546 transfer Methods 0.000 description 90
- 239000000126 substance Substances 0.000 description 50
- 239000000243 solution Substances 0.000 description 29
- 238000007789 sealing Methods 0.000 description 21
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 20
- 238000011068 loading method Methods 0.000 description 18
- 229910001873 dinitrogen Inorganic materials 0.000 description 15
- 238000012423 maintenance Methods 0.000 description 14
- 239000002245 particle Substances 0.000 description 14
- 238000006243 chemical reaction Methods 0.000 description 10
- 238000003825 pressing Methods 0.000 description 10
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- 239000004065 semiconductor Substances 0.000 description 6
- 230000004308 accommodation Effects 0.000 description 5
- 238000012993 chemical processing Methods 0.000 description 5
- 238000011109 contamination Methods 0.000 description 4
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- 230000002093 peripheral effect Effects 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000008155 medical solution Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
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- 238000001704 evaporation Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
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Images
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- Liquid Crystal (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001378543A JP3992488B2 (ja) | 2000-12-15 | 2001-12-12 | 液処理装置および液処理方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000381716 | 2000-12-15 | ||
| JP2000-381716 | 2000-12-15 | ||
| JP2001378543A JP3992488B2 (ja) | 2000-12-15 | 2001-12-12 | 液処理装置および液処理方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002246361A JP2002246361A (ja) | 2002-08-30 |
| JP2002246361A5 JP2002246361A5 (enExample) | 2005-06-23 |
| JP3992488B2 true JP3992488B2 (ja) | 2007-10-17 |
Family
ID=26605892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001378543A Expired - Fee Related JP3992488B2 (ja) | 2000-12-15 | 2001-12-12 | 液処理装置および液処理方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3992488B2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120016011A (ko) * | 2010-08-12 | 2012-02-22 | 도쿄엘렉트론가부시키가이샤 | 액 처리 장치, 액 처리 방법 및 기억 매체 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4907310B2 (ja) * | 2006-11-24 | 2012-03-28 | 東京エレクトロン株式会社 | 処理装置、処理方法及び記録媒体 |
| JP5800705B2 (ja) * | 2011-12-22 | 2015-10-28 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置及び基板処理方法 |
| JP6876417B2 (ja) * | 2016-12-02 | 2021-05-26 | 東京エレクトロン株式会社 | 基板処理装置の洗浄方法および基板処理装置の洗浄システム |
| JP7277137B2 (ja) * | 2018-12-28 | 2023-05-18 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置、および搬送モジュール |
-
2001
- 2001-12-12 JP JP2001378543A patent/JP3992488B2/ja not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120016011A (ko) * | 2010-08-12 | 2012-02-22 | 도쿄엘렉트론가부시키가이샤 | 액 처리 장치, 액 처리 방법 및 기억 매체 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002246361A (ja) | 2002-08-30 |
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