JP3971751B2 - 表面実装される発光ダイオードのウェーブソルダリング方法 - Google Patents
表面実装される発光ダイオードのウェーブソルダリング方法 Download PDFInfo
- Publication number
- JP3971751B2 JP3971751B2 JP2004074685A JP2004074685A JP3971751B2 JP 3971751 B2 JP3971751 B2 JP 3971751B2 JP 2004074685 A JP2004074685 A JP 2004074685A JP 2004074685 A JP2004074685 A JP 2004074685A JP 3971751 B2 JP3971751 B2 JP 3971751B2
- Authority
- JP
- Japan
- Prior art keywords
- footprint
- solder pad
- circuit board
- electronic component
- instrument
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 17
- 238000005476 soldering Methods 0.000 title claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 41
- 238000005286 illumination Methods 0.000 description 3
- 230000007717 exclusion Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
- B60Q3/00—Arrangement of lighting devices for vehicle interiors; Lighting devices specially adapted for vehicle interiors
- B60Q3/10—Arrangement of lighting devices for vehicle interiors; Lighting devices specially adapted for vehicle interiors for dashboards
- B60Q3/14—Arrangement of lighting devices for vehicle interiors; Lighting devices specially adapted for vehicle interiors for dashboards lighting through the surface to be illuminated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09418—Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/168—Wrong mounting prevention
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S362/00—Illumination
- Y10S362/80—Light emitting diode
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Instrument Panels (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Details Of Measuring Devices (AREA)
- Indicating Measured Values (AREA)
- Wire Bonding (AREA)
- Led Device Packages (AREA)
Description
14 回路板
22 計器指針
23 LED
26 ステッパモータ
30 電気的接続器(フットプリント)
54、56 排除領域
70 アノードソルダパッド
72 カソードソルダパッド
Claims (2)
- 車両の作動状態を車両の乗員に知らせるためのインストルメント・クラスタであって、 インストルメント・クラスタを支持し、車両のインストルメント・パネルに取付けできるハウジングと、
ハウジングに固定される回路板と、
回転可能に連結されたモータシャフトを備え前記回路板に固定されたモータと、
前記モータシャフトに取付けられかつ前記モータシャフトと一緒に回転できる、車両の作動状態を表示する計器指針と、
該計器指針を照明する少なくとも1つのダイオードと、
前記モータシャフトに近接して回路板上に配置され、少なくとも1つのダイオードを回路板に電気的に接続する少なくとも1つのダイオードフットプリントとを有し、
該少なくとも1つのダイオードフットプリントは、カソードソルダパッドおよびアノードソルダパッドを備え、アノードソルダパッドは略矩形であり、カソードソルダパッドは略L型である、
前記L型カソードソルダパッドが、前記略矩形のアノードソルダパッドの2つの辺の回りに配置され、
前記フットプリントの前縁が、ソルダーウェーブに対して傾斜させられている、
ことを特徴とするインストルメント・クラスタ。 - 電子部品をインストルメント・クラスタの回路板上にウェーブソルダリングする方法であって、
電子部品を回路板に電気的に接続する少なくとも1つの電子部品のフットプリントを設けるステップを備え、前記少なくとも1つの電子部品のフットプリントが略L型のカソードソルダパッドと略矩形のアノードソルダパッドとを備え、前記略L型のカソードソルダパッドが略矩形のアノードソルダパッドの2辺の回りに延びるように位置決めされ、
少なくとも1つの電子部品のフットプリントを、該少なくとも1つの電子部品のフットプリントの前縁がソルダーウェーブ方向に対して傾斜するように配向するステップと、
電子部品および電子部品フットプリントをウェーブソルダリングプロセスに曝して、電子部品を電子部品フットプリントに電気的に接続するステップとを有する、
ことを特徴とする方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/390,269 US6854853B2 (en) | 2003-03-17 | 2003-03-17 | Method for wave soldering of surface mounted light emitting diodes |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004276911A JP2004276911A (ja) | 2004-10-07 |
JP3971751B2 true JP3971751B2 (ja) | 2007-09-05 |
Family
ID=32043147
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004074685A Expired - Fee Related JP3971751B2 (ja) | 2003-03-17 | 2004-03-16 | 表面実装される発光ダイオードのウェーブソルダリング方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6854853B2 (ja) |
JP (1) | JP3971751B2 (ja) |
DE (1) | DE102004014094A1 (ja) |
GB (1) | GB2399687B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7564070B2 (en) * | 2005-11-23 | 2009-07-21 | Visteon Global Technologies, Inc. | Light emitting diode device having a shield and/or filter |
US7872570B2 (en) * | 2008-05-15 | 2011-01-18 | Havins William H | Informational display for rapid operator perception |
JP5182273B2 (ja) * | 2009-11-13 | 2013-04-17 | 株式会社デンソー | メータシステム |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2941A (en) * | 1843-02-04 | Improvement in the construction of presses | ||
US25596A (en) * | 1859-09-27 | Stove | ||
JPH06314858A (ja) | 1993-04-30 | 1994-11-08 | Toshiba Lighting & Technol Corp | 配線基板、発光ダイオードアレイ、照明装置および指針 |
US5920462A (en) * | 1998-04-10 | 1999-07-06 | Ford Motor Company | Heat spreader mounting pad configurations for laser soldering |
US6307527B1 (en) * | 1998-07-27 | 2001-10-23 | John S. Youngquist | LED display assembly |
JP2001066161A (ja) | 1999-08-31 | 2001-03-16 | Nippon Seiki Co Ltd | 計器装置 |
JP4224924B2 (ja) | 2000-03-30 | 2009-02-18 | 株式会社デンソー | 指示計器の製造方法 |
JP4281224B2 (ja) | 2000-07-10 | 2009-06-17 | 株式会社デンソー | 計器 |
JP2002076602A (ja) | 2000-08-23 | 2002-03-15 | Yazaki Corp | 表示基板のチップ実装方法 |
US6663251B2 (en) * | 2002-04-26 | 2003-12-16 | Auto Meter Products, Inc. | Gauge with illuminated dial and pointer |
-
2003
- 2003-03-17 US US10/390,269 patent/US6854853B2/en not_active Expired - Fee Related
-
2004
- 2004-02-17 GB GB0403417A patent/GB2399687B/en not_active Expired - Fee Related
- 2004-03-15 DE DE102004014094A patent/DE102004014094A1/de not_active Withdrawn
- 2004-03-16 JP JP2004074685A patent/JP3971751B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
GB2399687A (en) | 2004-09-22 |
DE102004014094A1 (de) | 2004-10-21 |
JP2004276911A (ja) | 2004-10-07 |
US20040184255A1 (en) | 2004-09-23 |
US6854853B2 (en) | 2005-02-15 |
GB2399687B (en) | 2005-12-14 |
GB0403417D0 (en) | 2004-03-24 |
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