JP3969991B2 - 面実装電子部品 - Google Patents
面実装電子部品 Download PDFInfo
- Publication number
- JP3969991B2 JP3969991B2 JP2001313323A JP2001313323A JP3969991B2 JP 3969991 B2 JP3969991 B2 JP 3969991B2 JP 2001313323 A JP2001313323 A JP 2001313323A JP 2001313323 A JP2001313323 A JP 2001313323A JP 3969991 B2 JP3969991 B2 JP 3969991B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- electronic component
- layer
- gold plating
- plating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007747 plating Methods 0.000 claims description 48
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 32
- 229910052737 gold Inorganic materials 0.000 claims description 32
- 239000010931 gold Substances 0.000 claims description 32
- 239000003990 capacitor Substances 0.000 claims description 23
- 239000007787 solid Substances 0.000 claims description 23
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 13
- 238000002844 melting Methods 0.000 claims description 9
- 230000008018 melting Effects 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000000605 extraction Methods 0.000 claims 1
- 239000007769 metal material Substances 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
- 239000007784 solid electrolyte Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001313323A JP3969991B2 (ja) | 2001-10-10 | 2001-10-10 | 面実装電子部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001313323A JP3969991B2 (ja) | 2001-10-10 | 2001-10-10 | 面実装電子部品 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003124074A JP2003124074A (ja) | 2003-04-25 |
| JP2003124074A5 JP2003124074A5 (enExample) | 2005-04-14 |
| JP3969991B2 true JP3969991B2 (ja) | 2007-09-05 |
Family
ID=19131813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001313323A Expired - Fee Related JP3969991B2 (ja) | 2001-10-10 | 2001-10-10 | 面実装電子部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3969991B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010026312B4 (de) * | 2010-07-06 | 2022-10-20 | Phoenix Contact Gmbh & Co. Kg | Anschlusskontakt und Verfahren zur Herstellung von Anschlusskontakten |
| JP5874746B2 (ja) | 2014-01-09 | 2016-03-02 | 株式会社村田製作所 | 固体電解コンデンサ、電子部品モジュール、固体電解コンデンサの製造方法および電子部品モジュールの製造方法 |
| JP2015230976A (ja) | 2014-06-05 | 2015-12-21 | 株式会社村田製作所 | 固体電解コンデンサの製造方法および固体電解コンデンサ |
| WO2021066091A1 (ja) * | 2019-10-04 | 2021-04-08 | 株式会社村田製作所 | 電解コンデンサ及び電解コンデンサの製造方法 |
| CN113823569B (zh) * | 2020-06-18 | 2025-03-04 | 吴江华丰电子科技有限公司 | 一种制作电子装置的方法 |
-
2001
- 2001-10-10 JP JP2001313323A patent/JP3969991B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2003124074A (ja) | 2003-04-25 |
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