JP3941966B2 - 絶縁性基板のような基板用の低電圧静電クランプ - Google Patents

絶縁性基板のような基板用の低電圧静電クランプ Download PDF

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Publication number
JP3941966B2
JP3941966B2 JP52388897A JP52388897A JP3941966B2 JP 3941966 B2 JP3941966 B2 JP 3941966B2 JP 52388897 A JP52388897 A JP 52388897A JP 52388897 A JP52388897 A JP 52388897A JP 3941966 B2 JP3941966 B2 JP 3941966B2
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Japan
Prior art keywords
electrodes
substrate
electrostatic clamp
electrode
array
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Expired - Lifetime
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JP52388897A
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English (en)
Japanese (ja)
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JP2000502509A5 (enExample
JP2000502509A (ja
Inventor
シャフルボサム，ポール，ケヴィン
バーンズ，マイケル，スコット
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ラム リサーチ コーポレイション
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Publication of JP2000502509A5 publication Critical patent/JP2000502509A5/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Coating Apparatus (AREA)
JP52388897A 1995-12-22 1996-12-20 絶縁性基板のような基板用の低電圧静電クランプ Expired - Lifetime JP3941966B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/577,382 1995-12-22
US08/577,382 US5838529A (en) 1995-12-22 1995-12-22 Low voltage electrostatic clamp for substrates such as dielectric substrates
PCT/US1996/020883 WO1997023945A1 (en) 1995-12-22 1996-12-20 Low voltage electrostatic clamp for substrates such as dielectric substrates

Publications (3)

Publication Number Publication Date
JP2000502509A JP2000502509A (ja) 2000-02-29
JP2000502509A5 JP2000502509A5 (enExample) 2004-11-11
JP3941966B2 true JP3941966B2 (ja) 2007-07-11

Family

ID=24308464

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52388897A Expired - Lifetime JP3941966B2 (ja) 1995-12-22 1996-12-20 絶縁性基板のような基板用の低電圧静電クランプ

Country Status (4)

Country Link
US (1) US5838529A (enExample)
EP (1) EP0880818B1 (enExample)
JP (1) JP3941966B2 (enExample)
WO (1) WO1997023945A1 (enExample)

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Also Published As

Publication number Publication date
US5838529A (en) 1998-11-17
WO1997023945A1 (en) 1997-07-03
EP0880818B1 (en) 2003-02-26
JP2000502509A (ja) 2000-02-29
EP0880818A1 (en) 1998-12-02

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