JP3935333B2 - 液処理装置および液処理方法 - Google Patents

液処理装置および液処理方法 Download PDF

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Publication number
JP3935333B2
JP3935333B2 JP2001280937A JP2001280937A JP3935333B2 JP 3935333 B2 JP3935333 B2 JP 3935333B2 JP 2001280937 A JP2001280937 A JP 2001280937A JP 2001280937 A JP2001280937 A JP 2001280937A JP 3935333 B2 JP3935333 B2 JP 3935333B2
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Japan
Prior art keywords
substrate
liquid
roller
processing
lcd substrate
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Expired - Fee Related
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JP2001280937A
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Japanese (ja)
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JP2003092241A5 (enExample
JP2003092241A (ja
Inventor
義治 太田
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication of JP2003092241A5 publication Critical patent/JP2003092241A5/ja
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  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2001280937A 2001-09-17 2001-09-17 液処理装置および液処理方法 Expired - Fee Related JP3935333B2 (ja)

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JP2001280937A JP3935333B2 (ja) 2001-09-17 2001-09-17 液処理装置および液処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001280937A JP3935333B2 (ja) 2001-09-17 2001-09-17 液処理装置および液処理方法

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JP2003092241A JP2003092241A (ja) 2003-03-28
JP2003092241A5 JP2003092241A5 (enExample) 2004-10-28
JP3935333B2 true JP3935333B2 (ja) 2007-06-20

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JP2001280937A Expired - Fee Related JP3935333B2 (ja) 2001-09-17 2001-09-17 液処理装置および液処理方法

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JP (1) JP3935333B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3788789B2 (ja) * 2003-01-22 2006-06-21 東京応化工業株式会社 基板の現像方法及び現像装置
TWI407270B (zh) * 2009-12-30 2013-09-01 Au Optronics Corp 顯影設備
CN101718963B (zh) * 2010-01-14 2011-10-05 友达光电股份有限公司 显影设备
JP6227373B2 (ja) * 2013-10-23 2017-11-08 住友ゴム工業株式会社 ゴムシートへの離型剤塗布装置
CN118831776B (zh) * 2024-09-23 2024-11-19 珠海中信达科技有限公司 一种显影辊辊涂装置

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JP2003092241A (ja) 2003-03-28

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