JP3916405B2 - 電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び半導体部品実装済完成品 - Google Patents

電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び半導体部品実装済完成品 Download PDF

Info

Publication number
JP3916405B2
JP3916405B2 JP2001061797A JP2001061797A JP3916405B2 JP 3916405 B2 JP3916405 B2 JP 3916405B2 JP 2001061797 A JP2001061797 A JP 2001061797A JP 2001061797 A JP2001061797 A JP 2001061797A JP 3916405 B2 JP3916405 B2 JP 3916405B2
Authority
JP
Japan
Prior art keywords
electronic component
base material
circuit pattern
manufacturing
finished product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001061797A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002261421A (ja
JP2002261421A5 (https=
Inventor
法人 塚原
尚士 秋口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2001061797A priority Critical patent/JP3916405B2/ja
Publication of JP2002261421A publication Critical patent/JP2002261421A/ja
Publication of JP2002261421A5 publication Critical patent/JP2002261421A5/ja
Application granted granted Critical
Publication of JP3916405B2 publication Critical patent/JP3916405B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
    • H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping

Landscapes

  • Credit Cards Or The Like (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2001061797A 2001-03-06 2001-03-06 電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び半導体部品実装済完成品 Expired - Fee Related JP3916405B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001061797A JP3916405B2 (ja) 2001-03-06 2001-03-06 電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び半導体部品実装済完成品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001061797A JP3916405B2 (ja) 2001-03-06 2001-03-06 電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び半導体部品実装済完成品

Publications (3)

Publication Number Publication Date
JP2002261421A JP2002261421A (ja) 2002-09-13
JP2002261421A5 JP2002261421A5 (https=) 2005-05-19
JP3916405B2 true JP3916405B2 (ja) 2007-05-16

Family

ID=18921029

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001061797A Expired - Fee Related JP3916405B2 (ja) 2001-03-06 2001-03-06 電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び半導体部品実装済完成品

Country Status (1)

Country Link
JP (1) JP3916405B2 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4916087B2 (ja) * 2002-12-05 2012-04-11 ミッドトロニクス インコーポレイテッド 一体型バッテリテスタを備えた蓄電池
JP4228677B2 (ja) 2002-12-06 2009-02-25 パナソニック株式会社 回路基板
JP4200285B2 (ja) * 2003-04-02 2008-12-24 パナソニック株式会社 回路基板の製造方法
JP4602208B2 (ja) * 2004-12-15 2010-12-22 新光電気工業株式会社 電子部品実装構造体及びその製造方法
US9122968B2 (en) 2012-04-03 2015-09-01 X-Card Holdings, Llc Information carrying card comprising a cross-linked polymer composition, and method of making the same
US20170243104A1 (en) * 2013-03-14 2017-08-24 X-Card Holdings, Llc Information carrying card for displaying one time passcodes, and method of making the same
WO2014149926A1 (en) 2013-03-15 2014-09-25 X-Card Holdings, Llc Methods of making a core layer for an information carrying card, and resulting products
KR102281468B1 (ko) * 2014-07-16 2021-07-27 삼성전기주식회사 칩 내장형 기판 및 이의 제조 방법
CN208753080U (zh) 2016-08-12 2019-04-16 株式会社村田制作所 Lc滤波器
JP6658607B2 (ja) 2017-02-22 2020-03-04 オムロン株式会社 製品の製造方法、外装部品およびアンテナパターン選択装置
CN111819577B (zh) 2018-03-07 2024-08-13 X卡控股有限公司 金属卡
CN112969284B (zh) * 2021-02-19 2022-06-24 深圳市众芯诺科技有限公司 一种嵌入式光学字符智能识别芯片
US12528279B2 (en) 2022-10-20 2026-01-20 X-Card Holdings, Llc Core layer for information carrying card, resulting information carrying card, and methods of making the same
US12220897B2 (en) 2022-10-20 2025-02-11 X-Card Holdings, Llc Core layer for information carrying card, resulting information carrying card, and methods of making the same

Also Published As

Publication number Publication date
JP2002261421A (ja) 2002-09-13

Similar Documents

Publication Publication Date Title
JP3916405B2 (ja) 電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び半導体部品実装済完成品
US6664645B2 (en) Method of mounting a semiconductor chip, circuit board for flip-chip connection and method of manufacturing the same, electromagnetic wave readable data carrier and method of manufacturing the same, and electronic component module for an electromagnetic wave readable data carrier
US6780668B1 (en) Package of semiconductor device and method of manufacture thereof
US7229293B2 (en) Connecting structure of circuit board and method for manufacturing the same
JP4334996B2 (ja) 多層配線板用基材、両面配線板およびそれらの製造方法
US7122087B2 (en) Method of manufacturing RFID
JP2007110010A (ja) フレキシブルプリント配線板、フレキシブルプリント回路板、およびそれらの製造方法
JP3529657B2 (ja) 熱可塑性樹脂基板に半導体素子を取付ける方法、非接触ｉｃカードの製造方法及び半導体素子を取付けた熱可塑性樹脂基板
JP3891743B2 (ja) 半導体部品実装済部品の製造方法、半導体部品実装済完成品の製造方法、及び半導体部品実装済完成品
US7375421B2 (en) High density multilayer circuit module
JP3916407B2 (ja) 積層型電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び電子部品実装済完成品
JP4179736B2 (ja) 半導体素子実装済部品の製造方法及び半導体素子実装済完成品の製造方法
JPH11250214A (ja) 部品の実装方法とｉｃカード及びその製造方法
JP4209574B2 (ja) 半導体部品実装済部品の製造方法
JP3661482B2 (ja) 半導体装置
JP2004514291A (ja) シリコンチップ上の集積回路のスマートラベルへの取付け方法
JP3979797B2 (ja) 電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び半導体部品実装済完成品
JP3881195B2 (ja) 半導体部品実装済部品の製造方法、半導体部品実装済部品、半導体部品実装済完成品の製造方法、及び半導体部品実装済完成品
JP4285347B2 (ja) 電子部品実装済基板および回路モジュール
JP2008235838A (ja) 半導体装置、その製造方法、その実装方法およびこれを用いたｉｃカード
JP4702820B2 (ja) Ｉｃタグラベルの製造方法
JP2823667B2 (ja) 半導体素子の実装方法
JP2008235839A (ja) 半導体装置およびその製造方法
TWI336223B (en) Electronic device and method of manufacturing same
JP2006019606A (ja) 電子部品の製造方法および電子部品ならびにｉｃカード

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040706

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040706

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060704

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060828

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20061031

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20061213

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20070130

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20070206

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100216

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110216

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120216

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130216

Year of fee payment: 6

LAPS Cancellation because of no payment of annual fees