JP3916405B2 - 電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び半導体部品実装済完成品 - Google Patents

電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び半導体部品実装済完成品 Download PDF

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Publication number
JP3916405B2
JP3916405B2 JP2001061797A JP2001061797A JP3916405B2 JP 3916405 B2 JP3916405 B2 JP 3916405B2 JP 2001061797 A JP2001061797 A JP 2001061797A JP 2001061797 A JP2001061797 A JP 2001061797A JP 3916405 B2 JP3916405 B2 JP 3916405B2
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JP
Japan
Prior art keywords
electronic component
base material
circuit pattern
manufacturing
finished product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001061797A
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English (en)
Japanese (ja)
Other versions
JP2002261421A5 (enrdf_load_stackoverflow
JP2002261421A (ja
Inventor
法人 塚原
尚士 秋口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2001061797A priority Critical patent/JP3916405B2/ja
Publication of JP2002261421A publication Critical patent/JP2002261421A/ja
Publication of JP2002261421A5 publication Critical patent/JP2002261421A5/ja
Application granted granted Critical
Publication of JP3916405B2 publication Critical patent/JP3916405B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]

Landscapes

  • Credit Cards Or The Like (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2001061797A 2001-03-06 2001-03-06 電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び半導体部品実装済完成品 Expired - Fee Related JP3916405B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001061797A JP3916405B2 (ja) 2001-03-06 2001-03-06 電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び半導体部品実装済完成品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001061797A JP3916405B2 (ja) 2001-03-06 2001-03-06 電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び半導体部品実装済完成品

Publications (3)

Publication Number Publication Date
JP2002261421A JP2002261421A (ja) 2002-09-13
JP2002261421A5 JP2002261421A5 (enrdf_load_stackoverflow) 2005-05-19
JP3916405B2 true JP3916405B2 (ja) 2007-05-16

Family

ID=18921029

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001061797A Expired - Fee Related JP3916405B2 (ja) 2001-03-06 2001-03-06 電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び半導体部品実装済完成品

Country Status (1)

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JP (1) JP3916405B2 (enrdf_load_stackoverflow)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4916087B2 (ja) * 2002-12-05 2012-04-11 ミッドトロニクス インコーポレイテッド 一体型バッテリテスタを備えた蓄電池
JP4228677B2 (ja) 2002-12-06 2009-02-25 パナソニック株式会社 回路基板
JP4200285B2 (ja) 2003-04-02 2008-12-24 パナソニック株式会社 回路基板の製造方法
JP4602208B2 (ja) * 2004-12-15 2010-12-22 新光電気工業株式会社 電子部品実装構造体及びその製造方法
US9122968B2 (en) 2012-04-03 2015-09-01 X-Card Holdings, Llc Information carrying card comprising a cross-linked polymer composition, and method of making the same
WO2014159026A1 (en) * 2013-03-14 2014-10-02 X-Card Holdings, Llc Information carrying card for displaying one time passcodes, and method of making the same
WO2014149926A1 (en) 2013-03-15 2014-09-25 X-Card Holdings, Llc Methods of making a core layer for an information carrying card, and resulting products
KR102281468B1 (ko) * 2014-07-16 2021-07-27 삼성전기주식회사 칩 내장형 기판 및 이의 제조 방법
WO2018030134A1 (ja) 2016-08-12 2018-02-15 株式会社村田製作所 Ｌｃフィルタおよびｌｃフィルタの製造方法
JP6658607B2 (ja) 2017-02-22 2020-03-04 オムロン株式会社 製品の製造方法、外装部品およびアンテナパターン選択装置
EP3762871B1 (en) 2018-03-07 2024-08-07 X-Card Holdings, LLC Metal card
CN112969284B (zh) * 2021-02-19 2022-06-24 深圳市众芯诺科技有限公司 一种嵌入式光学字符智能识别芯片
US12220897B2 (en) 2022-10-20 2025-02-11 X-Card Holdings, Llc Core layer for information carrying card, resulting information carrying card, and methods of making the same

Also Published As

Publication number Publication date
JP2002261421A (ja) 2002-09-13

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