JP3909826B2 - 発光ダイオード - Google Patents

発光ダイオード Download PDF

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Publication number
JP3909826B2
JP3909826B2 JP2002044709A JP2002044709A JP3909826B2 JP 3909826 B2 JP3909826 B2 JP 3909826B2 JP 2002044709 A JP2002044709 A JP 2002044709A JP 2002044709 A JP2002044709 A JP 2002044709A JP 3909826 B2 JP3909826 B2 JP 3909826B2
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JP
Japan
Prior art keywords
light
light emitting
group
emitting diode
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002044709A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002327126A5 (enExample
JP2002327126A (ja
Inventor
克哉 大内
学 津村
晴美 坂本
雅幸 藤田
雅史 蔵本
倫英 三木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Kaneka Corp
Original Assignee
Nichia Corp
Kaneka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp, Kaneka Corp filed Critical Nichia Corp
Priority to JP2002044709A priority Critical patent/JP3909826B2/ja
Publication of JP2002327126A publication Critical patent/JP2002327126A/ja
Publication of JP2002327126A5 publication Critical patent/JP2002327126A5/ja
Application granted granted Critical
Publication of JP3909826B2 publication Critical patent/JP3909826B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
  • Liquid Crystal (AREA)
JP2002044709A 2001-02-23 2002-02-21 発光ダイオード Expired - Fee Related JP3909826B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002044709A JP3909826B2 (ja) 2001-02-23 2002-02-21 発光ダイオード

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001-48550 2001-02-23
JP2001048550 2001-02-23
JP2002044709A JP3909826B2 (ja) 2001-02-23 2002-02-21 発光ダイオード

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2005057012A Division JP4880907B2 (ja) 2001-02-23 2005-03-02 光学材料用組成物、光学材料、その製造方法、並びにそれを用いた液晶表示装置

Publications (3)

Publication Number Publication Date
JP2002327126A JP2002327126A (ja) 2002-11-15
JP2002327126A5 JP2002327126A5 (enExample) 2005-09-02
JP3909826B2 true JP3909826B2 (ja) 2007-04-25

Family

ID=26609993

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002044709A Expired - Fee Related JP3909826B2 (ja) 2001-02-23 2002-02-21 発光ダイオード

Country Status (1)

Country Link
JP (1) JP3909826B2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008023746A1 (fr) 2006-08-22 2008-02-28 Mitsubishi Chemical Corporation ÉLÉMENT DE DISPOSITIF SEMI-CONDUCTEUR, LIQUIDE POUR FORMER UN ÉLÉMENT DE DISPOSITIF SEMI-CONDUCTEUR, PROCÉDÉ DE FABRICATION D'UN ÉLÉMENT DE DISPOSITIF SEMI-CONDUCTEUR ET LIQUIDE POUR FORMER UN ÉLÉMENT DE DISPOSITIF SEMI-CONDUCTEUR UTILISANT LE PROC&Eacute
WO2009119841A1 (ja) 2008-03-28 2009-10-01 三菱化学株式会社 硬化性ポリシロキサン組成物、並びに、それを用いたポリシロキサン硬化物、光学部材、航空宇宙産業用部材、半導体発光装置、照明装置、及び画像表示装置

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4514997B2 (ja) * 2001-07-24 2010-07-28 株式会社カネカ 光学材料用組成物、光学用材料、その製造方法およびそれを用いた液晶表示装置および発光ダイオード
JP2003073549A (ja) * 2001-09-05 2003-03-12 Kanegafuchi Chem Ind Co Ltd 光学材料用硬化性組成物、光学用材料、その製造方法およびそれを用いた発光ダイオード
JP4880837B2 (ja) * 2001-09-05 2012-02-22 株式会社カネカ 硬化性組成物および硬化物
JP5676068B2 (ja) * 2001-09-06 2015-02-25 株式会社カネカ 硬化性組成物、硬化物、その製造方法およびその硬化物により封止された発光ダイオード
TW200427111A (en) 2003-03-12 2004-12-01 Shinetsu Chemical Co Material for coating/protecting light-emitting semiconductor and the light-emitting semiconductor device
TWI373150B (en) 2003-07-09 2012-09-21 Shinetsu Chemical Co Silicone rubber composition, light-emitting semiconductor embedding/protecting material and light-emitting semiconductor device
JP4586967B2 (ja) * 2003-07-09 2010-11-24 信越化学工業株式会社 発光半導体被覆保護材及び発光半導体装置
DE102004039111A1 (de) 2003-08-14 2005-04-14 Shin-Etsu Chemical Co., Ltd. Härtbare Silikonharzzusammensetzung
TW200513483A (en) 2003-10-10 2005-04-16 Shinetsu Chemical Co Curable composition
JP4803339B2 (ja) 2003-11-20 2011-10-26 信越化学工業株式会社 エポキシ・シリコーン混成樹脂組成物及び発光半導体装置
JP4300418B2 (ja) 2004-04-30 2009-07-22 信越化学工業株式会社 エポキシ・シリコーン混成樹脂組成物及び発光半導体装置
DE102005036520A1 (de) * 2005-04-26 2006-11-09 Osram Opto Semiconductors Gmbh Optisches Bauteil, optoelektronisches Bauelement mit dem Bauteil und dessen Herstellung
JP4933797B2 (ja) * 2006-02-24 2012-05-16 昭和電工株式会社 硬化性樹脂組成物およびオプトデバイス
JP2008311477A (ja) * 2007-06-15 2008-12-25 Minami Kk Ｌｅｄディスプレーの製造方法及びその装置
JP5305452B2 (ja) 2009-06-12 2013-10-02 信越化学工業株式会社 光半導体素子封止用樹脂組成物
JP2011009346A (ja) * 2009-06-24 2011-01-13 Shin-Etsu Chemical Co Ltd 光半導体装置
JP5489280B2 (ja) 2010-04-07 2014-05-14 信越化学工業株式会社 光半導体封止用エポキシ組成物
JP5640476B2 (ja) 2010-06-08 2014-12-17 信越化学工業株式会社 光半導体素子封止用樹脂組成物及び発光装置
JP5893874B2 (ja) 2011-09-02 2016-03-23 信越化学工業株式会社 光半導体装置
CN103814448B (zh) 2011-11-29 2015-07-01 夏普株式会社 发光器件的制造方法
JP5583710B2 (ja) 2012-03-22 2014-09-03 信越化学工業株式会社 新規オルガノポリシロキサン、これを含む化粧料及びオルガノポリシロキサンの製造方法
JP6850909B2 (ja) * 2017-12-21 2021-03-31 富士フイルム株式会社 波長変換部材、バックライトユニットおよび液晶表示装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008023746A1 (fr) 2006-08-22 2008-02-28 Mitsubishi Chemical Corporation ÉLÉMENT DE DISPOSITIF SEMI-CONDUCTEUR, LIQUIDE POUR FORMER UN ÉLÉMENT DE DISPOSITIF SEMI-CONDUCTEUR, PROCÉDÉ DE FABRICATION D'UN ÉLÉMENT DE DISPOSITIF SEMI-CONDUCTEUR ET LIQUIDE POUR FORMER UN ÉLÉMENT DE DISPOSITIF SEMI-CONDUCTEUR UTILISANT LE PROC&Eacute
WO2009119841A1 (ja) 2008-03-28 2009-10-01 三菱化学株式会社 硬化性ポリシロキサン組成物、並びに、それを用いたポリシロキサン硬化物、光学部材、航空宇宙産業用部材、半導体発光装置、照明装置、及び画像表示装置

Also Published As

Publication number Publication date
JP2002327126A (ja) 2002-11-15

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