JP3906215B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP3906215B2 JP3906215B2 JP2004147725A JP2004147725A JP3906215B2 JP 3906215 B2 JP3906215 B2 JP 3906215B2 JP 2004147725 A JP2004147725 A JP 2004147725A JP 2004147725 A JP2004147725 A JP 2004147725A JP 3906215 B2 JP3906215 B2 JP 3906215B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- capacitor
- hydrogen barrier
- barrier film
- ferroelectric capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/55—Capacitors with a dielectric comprising a perovskite structure material
- H01L28/57—Capacitors with a dielectric comprising a perovskite structure material comprising a barrier layer to prevent diffusion of hydrogen or oxygen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
- H01L28/65—Electrodes comprising a noble metal or a noble metal oxide, e.g. platinum (Pt), ruthenium (Ru), ruthenium dioxide (RuO2), iridium (Ir), iridium dioxide (IrO2)
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
- H10B53/30—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors characterised by the memory core region
Description
31、32…キャパシタ
100…シリコン基板 101…ソース/ドレイン拡散層
102…ゲート絶縁膜 103…ゲート側壁膜
104…ポリシリコン膜 105…タングステンシリサイド膜
106…ゲートキャップ膜
107、109、110、113、121…層間絶縁膜
108…ポリシリコンプラグ 111…バリアメタル膜
112…タングステンプラグ 114…導電性水素バリア膜
115…下部電極 116…誘電体膜
117…上部電極 118…アルミニウム酸化物膜
119…シリコン酸化膜 120…絶縁性水素バリア膜
122…ヴィアプラグ 123…配線
Claims (3)
- 半導体基板と、
前記半導体基板上に設けられた絶縁領域と、
前記絶縁領域の上方に設けられた第1の強誘電体キャパシタと、
前記絶縁領域の上方に設けられ、前記第1の強誘電体キャパシタに隣接する第2の強誘電体キャパシタと、
前記第1及び第2の強誘電体キャパシタへの水素の拡散を防止するものであって、前記絶縁領域と前記第1の強誘電体キャパシタとの間及び前記絶縁領域と前記第2の強誘電体キャパシタとの間に介在した第1の部分と、前記第1の部分の外側に位置する第2の部分とを有し、前記第1の強誘電体キャパシタの下部電極と前記第2の強誘電体キャパシタの下部電極とを接続する導電性水素バリア膜と、
前記第1及び第2の強誘電体キャパシタへの水素の拡散を防止するものであって、前記第1の強誘電体キャパシタ、前記第2の強誘電体キャパシタ及び前記導電性水素バリア膜の第2の部分を覆う絶縁性水素バリア膜と、
を備え、
前記導電性水素バリア膜の前記第2の部分は前記第1の部分よりも薄く、
前記絶縁性水素バリア膜は、前記第1の強誘電体キャパシタの下部電極と前記導電性水素バリア膜との境界及び前記第2の強誘電体キャパシタの下部電極と前記導電性水素バリア膜との境界を覆う
ことを特徴とする半導体装置。 - 前記絶縁領域には、前記導電性水素バリア膜に接続されたプラグが含まれる
ことを特徴とする請求項1に記載の半導体装置。 - 前記導電性水素バリア膜は、酸素の拡散を防止する酸素バリア性を有する
ことを特徴とする請求項1又は2に記載の半導体装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004147725A JP3906215B2 (ja) | 2004-05-18 | 2004-05-18 | 半導体装置 |
US10/924,854 US6995417B2 (en) | 2004-05-18 | 2004-08-25 | Semiconductor device having ferroelectric capacitors |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004147725A JP3906215B2 (ja) | 2004-05-18 | 2004-05-18 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005332865A JP2005332865A (ja) | 2005-12-02 |
JP3906215B2 true JP3906215B2 (ja) | 2007-04-18 |
Family
ID=35374399
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004147725A Expired - Fee Related JP3906215B2 (ja) | 2004-05-18 | 2004-05-18 | 半導体装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US6995417B2 (ja) |
JP (1) | JP3906215B2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2007063573A1 (ja) * | 2005-11-29 | 2009-05-07 | 富士通マイクロエレクトロニクス株式会社 | 半導体装置とその製造方法 |
US7592273B2 (en) * | 2007-04-19 | 2009-09-22 | Freescale Semiconductor, Inc. | Semiconductor device with hydrogen barrier and method therefor |
JP2009267063A (ja) * | 2008-04-24 | 2009-11-12 | Toshiba Corp | 半導体装置 |
JP2009272319A (ja) * | 2008-04-30 | 2009-11-19 | Rohm Co Ltd | 強誘電体メモリ装置およびその製造方法 |
CN108550576B (zh) * | 2018-04-18 | 2020-09-11 | 湘潭大学 | 一种非易失性铁电随机存储器及制备工艺 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100269306B1 (ko) | 1997-07-31 | 2000-10-16 | 윤종용 | 저온처리로안정화되는금속산화막으로구성된완충막을구비하는집적회로장치및그제조방법 |
US6635528B2 (en) | 1999-12-22 | 2003-10-21 | Texas Instruments Incorporated | Method of planarizing a conductive plug situated under a ferroelectric capacitor |
US6576546B2 (en) | 1999-12-22 | 2003-06-10 | Texas Instruments Incorporated | Method of enhancing adhesion of a conductive barrier layer to an underlying conductive plug and contact for ferroelectric applications |
JP4280006B2 (ja) | 2001-08-28 | 2009-06-17 | パナソニック株式会社 | 半導体装置 |
US6828161B2 (en) | 2001-12-31 | 2004-12-07 | Texas Instruments Incorporated | Method of forming an FeRAM having a multi-layer hard mask and patterning thereof |
KR100522756B1 (ko) | 2002-09-17 | 2005-10-24 | 주식회사 하이닉스반도체 | 크롬이 함유된 확산장벽층을 구비하는 반도체소자 및 그제조 방법 |
US6876021B2 (en) | 2002-11-25 | 2005-04-05 | Texas Instruments Incorporated | Use of amorphous aluminum oxide on a capacitor sidewall for use as a hydrogen barrier |
US6841396B2 (en) | 2003-05-19 | 2005-01-11 | Texas Instruments Incorporated | VIA0 etch process for FRAM integration |
-
2004
- 2004-05-18 JP JP2004147725A patent/JP3906215B2/ja not_active Expired - Fee Related
- 2004-08-25 US US10/924,854 patent/US6995417B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6995417B2 (en) | 2006-02-07 |
US20050258497A1 (en) | 2005-11-24 |
JP2005332865A (ja) | 2005-12-02 |
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