JP3891743B2 - 半導体部品実装済部品の製造方法、半導体部品実装済完成品の製造方法、及び半導体部品実装済完成品 - Google Patents

半導体部品実装済部品の製造方法、半導体部品実装済完成品の製造方法、及び半導体部品実装済完成品 Download PDF

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Publication number
JP3891743B2
JP3891743B2 JP26539599A JP26539599A JP3891743B2 JP 3891743 B2 JP3891743 B2 JP 3891743B2 JP 26539599 A JP26539599 A JP 26539599A JP 26539599 A JP26539599 A JP 26539599A JP 3891743 B2 JP3891743 B2 JP 3891743B2
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Japan
Prior art keywords
semiconductor component
component mounted
base material
manufacturing
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP26539599A
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English (en)
Japanese (ja)
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JP2001093934A (ja
JP2001093934A5 (enExample
Inventor
法人 塚原
尚士 秋口
秀規 宮川
慎司 村上
豊 原田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP26539599A priority Critical patent/JP3891743B2/ja
Publication of JP2001093934A publication Critical patent/JP2001093934A/ja
Publication of JP2001093934A5 publication Critical patent/JP2001093934A5/ja
Application granted granted Critical
Publication of JP3891743B2 publication Critical patent/JP3891743B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP26539599A 1999-09-20 1999-09-20 半導体部品実装済部品の製造方法、半導体部品実装済完成品の製造方法、及び半導体部品実装済完成品 Expired - Fee Related JP3891743B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26539599A JP3891743B2 (ja) 1999-09-20 1999-09-20 半導体部品実装済部品の製造方法、半導体部品実装済完成品の製造方法、及び半導体部品実装済完成品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26539599A JP3891743B2 (ja) 1999-09-20 1999-09-20 半導体部品実装済部品の製造方法、半導体部品実装済完成品の製造方法、及び半導体部品実装済完成品

Publications (3)

Publication Number Publication Date
JP2001093934A JP2001093934A (ja) 2001-04-06
JP2001093934A5 JP2001093934A5 (enExample) 2005-05-19
JP3891743B2 true JP3891743B2 (ja) 2007-03-14

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ID=17416583

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26539599A Expired - Fee Related JP3891743B2 (ja) 1999-09-20 1999-09-20 半導体部品実装済部品の製造方法、半導体部品実装済完成品の製造方法、及び半導体部品実装済完成品

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JP (1) JP3891743B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6780668B1 (en) 1999-07-16 2004-08-24 Matsushita Electric Industrial Co., Ltd. Package of semiconductor device and method of manufacture thereof
JP4186756B2 (ja) * 2003-08-29 2008-11-26 松下電器産業株式会社 回路基板及びその製造方法
JP4666296B2 (ja) * 2001-01-31 2011-04-06 トッパン・フォームズ株式会社 Ｉｃチップを実装したアンテナの形成方法
JP4228677B2 (ja) 2002-12-06 2009-02-25 パナソニック株式会社 回路基板
JP3835460B2 (ja) 2004-04-08 2006-10-18 セイコーエプソン株式会社 電子部品実装体の製造方法、及び電気光学装置
JP4285339B2 (ja) 2004-06-15 2009-06-24 パナソニック株式会社 回路モジュールおよび回路モジュールの製造方法
KR102061342B1 (ko) * 2012-06-13 2020-01-02 에스케이하이닉스 주식회사 강화된 범프 체결 구조를 포함하는 전자 소자의 패키지 및 제조 방법
US9516749B2 (en) * 2012-07-04 2016-12-06 Panasonic Intellectual Property Management Co., Ltd. Electronic component-mounted structure, IC card and COF package

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JP2001093934A (ja) 2001-04-06

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