JP3881730B2 - ヒートシンク及び放熱シート - Google Patents
ヒートシンク及び放熱シート Download PDFInfo
- Publication number
- JP3881730B2 JP3881730B2 JP26543896A JP26543896A JP3881730B2 JP 3881730 B2 JP3881730 B2 JP 3881730B2 JP 26543896 A JP26543896 A JP 26543896A JP 26543896 A JP26543896 A JP 26543896A JP 3881730 B2 JP3881730 B2 JP 3881730B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- composite magnetic
- magnetic body
- heat sink
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims description 19
- 239000002131 composite material Substances 0.000 claims description 56
- 239000000696 magnetic material Substances 0.000 claims description 17
- 239000000843 powder Substances 0.000 claims description 14
- 239000011230 binding agent Substances 0.000 claims description 10
- 239000006247 magnetic powder Substances 0.000 claims description 9
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims description 5
- 239000012779 reinforcing material Substances 0.000 claims description 5
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 5
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 5
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 claims description 4
- 229910052582 BN Inorganic materials 0.000 claims description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 230000005672 electromagnetic field Effects 0.000 description 13
- 230000005855 radiation Effects 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 10
- 230000008878 coupling Effects 0.000 description 7
- 238000010168 coupling process Methods 0.000 description 7
- 238000005859 coupling reaction Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910021364 Al-Si alloy Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000006249 magnetic particle Substances 0.000 description 1
- 230000005415 magnetization Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26543896A JP3881730B2 (ja) | 1996-09-12 | 1996-09-12 | ヒートシンク及び放熱シート |
| DE1997627207 DE69727207T2 (de) | 1996-09-09 | 1997-09-09 | Hoch warmeleitendes magnetisches mischmaterial |
| CNB97191222XA CN1179619C (zh) | 1996-09-09 | 1997-09-09 | 高导热性复合磁体 |
| US09/074,012 US6962753B1 (en) | 1996-09-09 | 1997-09-09 | Highly heat-conductive composite magnetic material |
| EP97939237A EP0866649B1 (en) | 1996-09-09 | 1997-09-09 | Highly heat-conductive composite magnetic material |
| TW086113017A TW345667B (en) | 1996-09-09 | 1997-09-09 | High thermal conductivity composite magnetic substance |
| KR10-1998-0703424A KR100510921B1 (ko) | 1996-09-09 | 1997-09-09 | 고열전도성복합자성체 |
| PCT/JP1997/003175 WO1998010632A1 (fr) | 1996-09-09 | 1997-09-09 | Materiau magnetique, composite et fortement thermoconducteur |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26543896A JP3881730B2 (ja) | 1996-09-12 | 1996-09-12 | ヒートシンク及び放熱シート |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH1092988A JPH1092988A (ja) | 1998-04-10 |
| JPH1092988A5 JPH1092988A5 (enExample) | 2004-08-26 |
| JP3881730B2 true JP3881730B2 (ja) | 2007-02-14 |
Family
ID=17417159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26543896A Expired - Fee Related JP3881730B2 (ja) | 1996-09-09 | 1996-09-12 | ヒートシンク及び放熱シート |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3881730B2 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000349481A (ja) * | 1999-03-31 | 2000-12-15 | Internatl Business Mach Corp <Ibm> | コンピューター冷却装置、コンピューター、及びコンピューターアッセンブリ |
| JP4631877B2 (ja) * | 2007-07-02 | 2011-02-16 | スターライト工業株式会社 | 樹脂製ヒートシンク |
| JP2009158658A (ja) * | 2007-12-26 | 2009-07-16 | Murata Mfg Co Ltd | 放熱装置 |
| JP6645487B2 (ja) | 2017-10-30 | 2020-02-14 | セイコーエプソン株式会社 | プリント回路板 |
| JP2022012179A (ja) * | 2020-07-01 | 2022-01-17 | キヤノン電子管デバイス株式会社 | 放射線検出器 |
| WO2023238171A1 (ja) * | 2022-06-06 | 2023-12-14 | 三菱電機株式会社 | 電力配線構造 |
-
1996
- 1996-09-12 JP JP26543896A patent/JP3881730B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH1092988A (ja) | 1998-04-10 |
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