JP3813088B2 - ボンディング装置 - Google Patents

ボンディング装置 Download PDF

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Publication number
JP3813088B2
JP3813088B2 JP2001400285A JP2001400285A JP3813088B2 JP 3813088 B2 JP3813088 B2 JP 3813088B2 JP 2001400285 A JP2001400285 A JP 2001400285A JP 2001400285 A JP2001400285 A JP 2001400285A JP 3813088 B2 JP3813088 B2 JP 3813088B2
Authority
JP
Japan
Prior art keywords
tool
reference member
lens
position detection
detection camera
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001400285A
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English (en)
Japanese (ja)
Other versions
JP2003197671A (ja
JP2003197671A5 (enExample
Inventor
滋 早田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2001400285A priority Critical patent/JP3813088B2/ja
Priority to TW091133247A priority patent/TWI255000B/zh
Priority to US10/325,991 priority patent/US6683731B2/en
Priority to KR10-2002-0081622A priority patent/KR100491371B1/ko
Publication of JP2003197671A publication Critical patent/JP2003197671A/ja
Publication of JP2003197671A5 publication Critical patent/JP2003197671A5/ja
Application granted granted Critical
Publication of JP3813088B2 publication Critical patent/JP3813088B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H10W72/071—
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07531—
    • H10W72/5449—
    • H10W72/932—
    • H10W90/756—

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
JP2001400285A 2001-12-28 2001-12-28 ボンディング装置 Expired - Fee Related JP3813088B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2001400285A JP3813088B2 (ja) 2001-12-28 2001-12-28 ボンディング装置
TW091133247A TWI255000B (en) 2001-12-28 2002-11-13 Bonding apparatus
US10/325,991 US6683731B2 (en) 2001-12-28 2002-12-19 Bonding apparatus
KR10-2002-0081622A KR100491371B1 (ko) 2001-12-28 2002-12-20 본딩 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001400285A JP3813088B2 (ja) 2001-12-28 2001-12-28 ボンディング装置

Publications (3)

Publication Number Publication Date
JP2003197671A JP2003197671A (ja) 2003-07-11
JP2003197671A5 JP2003197671A5 (enExample) 2004-12-16
JP3813088B2 true JP3813088B2 (ja) 2006-08-23

Family

ID=19189596

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001400285A Expired - Fee Related JP3813088B2 (ja) 2001-12-28 2001-12-28 ボンディング装置

Country Status (4)

Country Link
US (1) US6683731B2 (enExample)
JP (1) JP3813088B2 (enExample)
KR (1) KR100491371B1 (enExample)
TW (1) TWI255000B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3827645B2 (ja) * 2003-02-19 2006-09-27 株式会社新川 ボンディング装置及びボンディング外観検査装置
JP4547330B2 (ja) * 2005-12-28 2010-09-22 株式会社新川 ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法
US7810698B2 (en) * 2008-11-20 2010-10-12 Asm Assembly Automation Ltd. Vision system for positioning a bonding tool
US9136243B2 (en) * 2013-12-03 2015-09-15 Kulicke And Soffa Industries, Inc. Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
TWI580511B (zh) * 2014-06-10 2017-05-01 新川股份有限公司 A bonding device, and a method of estimating the placement position of the engagement tool
CN108986167B (zh) * 2017-06-05 2022-01-11 梭特科技股份有限公司 置晶设备的校正方法及使用该方法的置晶设备
TWI697656B (zh) * 2017-12-20 2020-07-01 日商新川股份有限公司 線形狀檢查裝置以及線形狀檢查方法
TWI826789B (zh) * 2020-06-05 2023-12-21 日商新川股份有限公司 打線接合裝置
CN112382590A (zh) * 2020-11-11 2021-02-19 华天科技(南京)有限公司 一种编带设备交手校正系统及方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3178567B2 (ja) * 1993-07-16 2001-06-18 株式会社カイジョー ワイヤボンディング装置及びその方法
JP2982000B1 (ja) * 1998-07-03 1999-11-22 株式会社新川 ボンディング方法及びその装置
JP3328878B2 (ja) * 1998-10-26 2002-09-30 澁谷工業株式会社 ボンディング装置
JP3416091B2 (ja) 2000-01-21 2003-06-16 株式会社新川 ボンディング装置およびボンディング方法
JP3802403B2 (ja) * 2001-11-27 2006-07-26 株式会社新川 ワイヤボンディング方法及び装置
JP2003163236A (ja) * 2001-11-27 2003-06-06 Shinkawa Ltd ワイヤボンディング装置

Also Published As

Publication number Publication date
JP2003197671A (ja) 2003-07-11
KR20030057322A (ko) 2003-07-04
US6683731B2 (en) 2004-01-27
US20030123866A1 (en) 2003-07-03
TW200408018A (en) 2004-05-16
KR100491371B1 (ko) 2005-05-25
TWI255000B (en) 2006-05-11

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