TWI255000B - Bonding apparatus - Google Patents
Bonding apparatus Download PDFInfo
- Publication number
- TWI255000B TWI255000B TW091133247A TW91133247A TWI255000B TW I255000 B TWI255000 B TW I255000B TW 091133247 A TW091133247 A TW 091133247A TW 91133247 A TW91133247 A TW 91133247A TW I255000 B TWI255000 B TW I255000B
- Authority
- TW
- Taiwan
- Prior art keywords
- lens
- tool
- reference member
- camera
- position detecting
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 35
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims 1
- 238000001514 detection method Methods 0.000 abstract description 4
- 238000003384 imaging method Methods 0.000 abstract description 2
- 238000005286 illumination Methods 0.000 description 17
- 238000000034 method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 240000005702 Galium aparine Species 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
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- H01L2224/05554—Shape in top view being square
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Wire Bonding (AREA)
Description
1255000 玖、發明說明 【發明所屬之技術領域】 本發明係關於一種打線裝置,特別是關於能正確地算 出用以拍攝工件的位置檢測用攝影機以及工具兩者的偏位 量的打線裝置。 【先前技術】 在ic等之半導體組裝裝置的製程中有打線製程。如第 7圖所示,利用這種製程,將引線4連接到工件3的半導體 晶片1的焊墊(第一接合點)la及導線架2的引腳(第二接合 點)2a上。 該打線製程,係利用第8圖所示的打線裝置1〇來進行 。首先,利用檢測位置用攝影機11,來檢測半導體晶片1 上的至少二個定點以及導線架2上的至少二個定點相對於 正規位置的偏移,根據此檢測値,以運算部來修正預先記 憶的打線座標。這種利用位置檢測用攝影機11檢測的情形 ,係驅動X軸馬達12及Y軸馬達13,俾使位置檢測用攝 影機11的光軸11a位於測定點的正上方。如上述將打線座 標修正後,使工具5沿X、Y軸方向及Z軸方向移動,把 插通於工具5的引線4接合於第一接合點la及第二接合點 2a ° 這種情形,由於位置檢測用攝影機11的光軸11a與工 具5的軸心5a偏位距離W。藉由位置檢測用攝影機11檢 測定點的偏位量而將打線座標修正之後,藉由X軸馬達12 與Y軸馬達13使XY台15移動偏位量W,使工具5位在 1255000 第一接合點1 a上方。然後,藉由χ軸馬達12及γ軸馬達 13使ΧΥ台15沿χγ軸方向移動,以及藉由ζ軸馬達14 使打線臂16上下移動(或擺動)而使工具5沿Ζ軸方向移動 ,藉此,將引線4接合在上述修正後之打線座標上。第8 圖中’打線臂16以可自由擺動的方式設在打線頭17,位置 檢測用攝影機11透過攝影機保持臂18固定在打線頭17上 。又,Xw表示偏位量W的X軸分量,Yw表示偏位量w的 Y軸分量。 由於是用位置檢測用攝影機11來求出基準點以得知工 具5待移動的位置,因此掌握檢測用攝影機n與工具5間 之偏位量係非常重要。然而,實際上的偏位量,由於來自 高溫的打線台來的輻射熱及來自受熱空氣的熱傳導所造成 之攝影機保持臂18及打線臂16的熱膨脹,而時時刻刻在 變化,因此在打線作業開始時以及作業期間的適當時點, 須將偏位量作修正。 習知,要求出正確的偏位量的手段,舉例而言,如曰 本專利第2982000號所揭示者。然而,這種手段,係有別 於爲了檢測接合點的位置之位置檢測用攝影機Η,而需要 另外設置偏位修正專用的偏位修正用攝影機。因此,會有 構造複雜及價格偏高的問題。 爲了解決上述問題,如在特開2001-203234號公報所 示,其係提出一種設置有光學機構的技術’該光學機構係 用以將配置於既定位置的基準構件與工具5的像光導引至 位置檢測用攝影機11。藉此,可將用以檢測工件位置的位 1255000 置檢測用攝影機11兼用在工件5與基準構件的攝影,而在 使用基準構件的情形,也不必使用專用的偏位修正用攝影 機就可完成。 【發明內容】 特開2001-203234號公報中揭示了各種實施形態。其 中有一種實施形態,係使用遠心透鏡(telecentric lens)於位 置檢測用攝影機11的透鏡。所謂遠心透鏡,係遠心光學系 統,亦即以成像的主光線通過透鏡後方側焦點的方式而構 成的光學系統。遠心透鏡,對於與成像面對向方向的位置 偏移的容許範圍很大,特別是在以平行光的透過光照射的 情形,即使物體位置有變動,但像的大小(亦即,距光軸的 距離)不會產生變化。 位置檢測用攝影機11的光學系統雖然近似遠心光學系 統,但嚴格說來不算是遠心光學系統,故在以平行光照射 的場合時,若物體從焦點位置偏移,則像會有些模糊。 本發明的目的係提供一種打線裝置,可在以平行光照 射的場合,不受焦點位置的影響而簡單地得到鮮明的影像 〇 爲達成上述目的,本發明之申請專利範圍第1項,係 一種打線裝置,具備:插通有引線而在工件上進行打線之 工具、用來拍攝工件之位置檢測用攝影機、設置在既定位 置之基準構件、及將該工具及基準構件的像導引到該位置 檢測用攝影機之光學機構,其特徵在於: 藉由設在該位置檢測用攝影機上的透鏡以及設在該光 1255000 學機構上的透鏡兩者的組合,而構成無焦(afocal)系統。 爲達成上述目的之本發明申請專利範圍第2項,係在 上述申請專利範圍第1項的打線裝置,其中,該無焦系統 係克卜勒(Kepler)型者。 爲達成上述目的之本發明申請專利範圍第3項,係在 申請專利範圍第1項的打線裝置,其中,該非焦點系統係 伽利略型。 【實施方式】 茲利用第1圖說明本發明之第一實施形態。又,與第7 圖及第8圖相同或相當的構件用同一符號表示,其詳細說 明省略。位置檢測用攝影機11係具備攝影構件(CCD或 CMOS等)的光電轉換式的攝影機,該位置檢測用攝影機11 的光學系統的透鏡20的焦點位置係形成於工件水平面20a 。在用以將第7圖及第8圖中所示的導線架2定位載置的 打線台(未圖示)附近,設置光學機構支持板21。在光學機 構支持板21上固定基準構件30、光學機構40、及照明機 構50。 在光學機構40的盒體41內設有:反射鏡42,係配設 成相對於透鏡20的工件水平面20a的水平方向以45°的角 度交叉;反射鏡43,係配設成在此反射鏡42上方側相對於 水平方向以一 45°的角度交叉;透鏡44,係設在反射鏡43 的左側;及反射鏡45,係配設成在此透鏡44的左側相對於 水平方向以45°的角度交叉。在盒體41,於反射鏡42的 右側設有窗部41a,在反射鏡45的上方側設有窗部41b。 1255000 又,設有照明機構50,與反射鏡42對向,照射平行的照明 光;在反射鏡42與照明機構50之間設有基準構件30。此 處,反射鏡45的反射面的中心與基準構件30的距離d係 設定爲:和位置檢測用攝影機11的光軸11a與工具5的軸 心5a兩者的X軸方向的偏位量Xw大致相等。 本實施形態,係以透鏡20與透鏡44的組合來構成克 卜勒型的無焦系統。第2圖係表示簡化的光程圖。透鏡20 的合成焦距爲fl,前側主平面爲H11,後側主平面爲H12 。透鏡44之合成焦距爲f2,前側主平面爲H21,後側主平 面爲H22。又,從透鏡20的前側主平面H11到透鏡44的 後側主平面H22的距離爲L。要構成無焦系統,可設成L = fl + f2。又,由於倍率係以fl/f2來表示,因此可選擇f2 的値以得到適當的倍率。 其次,就第8圖中所示之偏位量W的修正方法作說明 。這種修正方法本身與習知相同。又,第1圖表示將Y軸 方向的偏位量Yw修正的情形。首先,將第8圖所示之XY 台15驅動,使工具5的軸心5a位在基準構件30的上方, 接著驅動Z軸馬達14,使工具5下降到幾乎接觸到基準構 件30程度的高度,此處,工具5可位於使位置檢測用攝影 機11能將工具5及基準構件30攝影的位置,並沒有必要 使基準構件30的軸心和工具5的軸心5a —致。 接著,將工具5及基準構件30兩者攝影。工具5及基 準構件30的像被反射鏡42、43反射,通過透鏡44後,以 反射鏡45反射,利用透鏡20以位置檢測用攝影機11拍攝 1255000 成第4圖(a)所示的影像。藉著將此影像作適當的影像處理 ,來算出工具5的軸心5a與基準構件30的軸心30a兩者 的Y軸方向的偏位量△ Y1。 其次,利用預儲存在記憶體(未圖示)中的偏位量Xw、 Yw將XY台15驅動,俾將位置檢測用攝影機Η移動至基 準構件30附近。接著,在此狀態將基準構件30攝影,藉 著將其影像作適當的影像處理,來算出基準構件30的軸心 3〇a與位置檢測用攝影機11的光軸lla兩者的偏位量AY2 。利用測定値ΛΥ1及ΛΥ2,與習知同樣地,可利用式1算 出偏位修正量△Y。 ΔΥ=ΔΥ1-ΔΥ2 (式 1) 如此,由於本實施形態係用透鏡20與透鏡44的組合 構成克卜勒型無焦系統,因此當以照明機構50的平行光照 射時,如果工具5及基準構件30的像的平行光射入到透鏡 44的話,則利用透鏡20呈完全平行光的形式射出到位置檢 測用攝影機11。因此不須利用透鏡44的焦點位置,亦即不 需藉由工具5與基準構件30的水平方向的位置,即可得到 鮮明的影像。 茲利用第3圖說明本發明之第二實施形態。本實施形 態,係在第1圖的實施形態中,採取可從ΧΥ軸兩個方向 觀察對象物(工具5與基準構件30)的方式。本實施形態, 係在第1圖的第一實施形態中的光學機構40設置半反射鏡 46、反射鏡47、48及照明機構51。 半反射鏡46係設在前述實施形態的反射鏡42的右側 1255000 ,照明機構50設成隔著基準構件30而與此半反射鏡46對 向。反射鏡47係設在相對於半反射鏡46爲第3圖下側, 反射鏡48係設在反射鏡47的右側。反射鏡47的反射面與 半反射鏡46的反射面互相平行,兩者都相對於X軸方向以 45°的角度交叉。反射鏡48的反射面相對於X軸方向以-45°的角度交叉。 其次,就偏位量W(Yw,Yw)的修正作說明。進行與前 述實施形態同樣的操作,將工具5下降到幾乎接觸到基準 構件30的高度爲止。接著,利用位置檢測用攝影機11將 工具5與基準構件30兩者攝影,測定兩者的位置關係,亦 即 ΛΧ1、ΔΥ1。 首先,當將照明機構51熄滅,並使照明機構50成點 亮的狀態時,則將工具5與基準構件30之Y軸方向的像, 作爲對來自照明機構50來的光所形成的影像,通過半反射 鏡46後,以反射鏡42、43反射,通過透鏡44,再以反射 鏡45反射,利用第1圖所示的透鏡20以位置檢測用攝影 機Π拍攝出Y軸方向之第4圖(b)所示的影像。藉由將此 影像作適當的影像處理,來算出工具5的軸心5a與基準構 件30的軸心30a兩者的Y軸方向的偏位量ΛΥ1。 其次,當將照明機構50熄滅,並使照明機構51成爲 點亮的狀態時,則工具5與基準構件30的X軸方向的像, 作爲對來自照明機構51的光所形成的影像,利用反射鏡48 、47以半反射鏡46的反射面反射後,再以反射鏡42、43 反射,通過透鏡44後,以反射鏡45反射,利用透鏡20以 1255000 位置fe測用攝影機11拍攝出Y軸方向之第4圖(b)所示的 影像。藉由將此影像作適當的影像處理,來算出工具5的 軸心5a及基準構件30的軸心30a兩者的X軸方向的偏位 量 ΛΧ1。 如此,當將工具5與基準構件30的位置關係進行測定 ,即測定ΛΧ1、△ Y1,然後藉由未圖示的記憶體中預先儲 存的偏位量Xw、Yw,將XY台15驅動,俾使位置檢測用 攝影機11移動至基準構件30附近。其次,在這種狀態下 將基準構件30攝影,藉由將此影像作適當的影像處理,來 算出基準構件30的軸心30a以及位置檢測用攝影機11的 光軸11a兩者的偏位量ΛΧ2、ΛΥ2。可利用測定値Λχι、 △ Y1以及測定値ΛΧ2、ΛΥ2,與習知同樣地,以式2算 出偏位修正量△ X、△ Y。 ΔΧ= ΔΧ1 - ΔΧ2 ΔΥ=ΔΥ1-ΔΥ2 (式 2) 本實施形態係形成無焦系統,因此,由χγ軸的兩個 方向觀察的場合,不必使藉由照明機構50從基準構件30 到透鏡44的光程與藉由照明機構51從基準單元30到透鏡 44的光程的路徑(path)相等。換言之,就半反射鏡48、反 射鏡47、48等的間隔而言,也沒有限制,故對於搭載在打 線裝置上的場合非常有利。 茲利用第5圖說明本發明第三實施形態,本實施形態 係取代第一實施形態的透鏡44,而採用透鏡56,以透鏡20 與透鏡56的組合來構成伽利略型無焦系統者,第6圖係表 12 ,1255000 示簡化的光程圖,透鏡20的合成焦距爲fl,前側主平面爲 H11,後側主平面爲H12。透鏡56的合成焦距爲f3,前側 主平面爲H31,後側主平面爲H32。,又,從透鏡20的前 側主平面H11到透鏡56的後側主平面H32爲止的距離爲L 。要構成無焦系統,可設成L=fl-f3。又,由於倍率係以 fl/f3來表示,因此可選擇f3的値俾能得到適當的倍率。 如此構成也能得到與第1圖的第一實施形態同樣的效 果。又,在本實施形態中,要使對象物(工具5及基準構件 30)能從XY軸的二方向觀察,則可在第5圖所示的光學機 構40,如第3圖的場合般,設置半反射鏡46、反射鏡47、 48及照明機構51。 又,在第1、第3、第5圖之上述各實施形態中,也可 取代反射鏡42、43、45、47、48,而採用稜鏡。 發明效果 由於本發明之打線裝置,係具備:工具,插通有引線 而在工件上進行打線;位置檢測用攝影機,用以將工件攝 影;基準構件,係設置在既定位置;及光學機構,將該工 具及基準構件的像導引到該位置檢測用攝影機;藉由設在 該位置檢測用攝影機上的透鏡以及設在該光學機構上的透 鏡兩者的組合,而構成無焦系統,因此,在以平行光照射 的場合,可以不受焦點位置的影響,而簡單地得到鮮明的 影像。 【圖式簡單說明】 (一)圖式部分 13 !255〇〇〇 第1圖係表示本發明之打線裝置的第一實施形態的局 部剖面要部前視圖。 第2圖係表示第i圖簡化的光程圖。 胃3圖係表示本發明之打線裝置的第二實施形態的俯 視示意圖。 胃4圖(a)、(b)係表示將工具近接於基準構件的狀態的 影像示意圖。 第5圖係表示本發明之打線裝置的第三實施形態的局 部剖面要部前視圖。 第6圖係第5圖簡化之光程圖。 第7圖係打線後之工件的俯視圖。 第8圖係打線裝置的立體圖。 (二)元件代表符號 5 工具 5a 軸心 11 位置檢測用攝影機 11a 光軸 20 透鏡 22 光學機構 30 基準構件 40 光學機構 42、43 反射鏡 44 透鏡 45 、 47 、 48 反射鏡 1255000 46 50、 5 6 半反射鏡 51 照明機構 透鏡
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Claims (1)
1255000 拾、申請專利範圍 1.一種打線裝置,係具備:插通有引線而在工件上進 行打線之工具、用來拍攝工件之位置檢測用攝影機、設置 在既定位置之基準構件、及將該工具及基準構件的像導引 到該位置檢測用攝影機之光學機構,其特徵在於·· 藉由設在該位置檢測用攝影機上的透鏡以及設在該光 學機構上的透鏡兩者的組合,而構成無焦系統。 2·如申請專利範圍第1項之打線裝置,其中, 該無焦系統爲克卜勒型者。 > 3·如申請專利範圍第1項之打線裝置,其中, 該無焦系統爲伽利略型者。 拾壹、圖式 如次頁
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JP3827645B2 (ja) * | 2003-02-19 | 2006-09-27 | 株式会社新川 | ボンディング装置及びボンディング外観検査装置 |
JP4547330B2 (ja) * | 2005-12-28 | 2010-09-22 | 株式会社新川 | ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法 |
US7810698B2 (en) * | 2008-11-20 | 2010-10-12 | Asm Assembly Automation Ltd. | Vision system for positioning a bonding tool |
US9136243B2 (en) * | 2013-12-03 | 2015-09-15 | Kulicke And Soffa Industries, Inc. | Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements |
TWI580511B (zh) * | 2014-06-10 | 2017-05-01 | Shinkawa Kk | A bonding device, and a method of estimating the placement position of the engagement tool |
CN108986167B (zh) * | 2017-06-05 | 2022-01-11 | 梭特科技股份有限公司 | 置晶设备的校正方法及使用该方法的置晶设备 |
TWI697656B (zh) * | 2017-12-20 | 2020-07-01 | 日商新川股份有限公司 | 線形狀檢查裝置以及線形狀檢查方法 |
CN112382590A (zh) * | 2020-11-11 | 2021-02-19 | 华天科技(南京)有限公司 | 一种编带设备交手校正系统及方法 |
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JP3178567B2 (ja) * | 1993-07-16 | 2001-06-18 | 株式会社カイジョー | ワイヤボンディング装置及びその方法 |
JP2982000B1 (ja) * | 1998-07-03 | 1999-11-22 | 株式会社新川 | ボンディング方法及びその装置 |
JP3328878B2 (ja) * | 1998-10-26 | 2002-09-30 | 澁谷工業株式会社 | ボンディング装置 |
JP3416091B2 (ja) | 2000-01-21 | 2003-06-16 | 株式会社新川 | ボンディング装置およびボンディング方法 |
JP3802403B2 (ja) * | 2001-11-27 | 2006-07-26 | 株式会社新川 | ワイヤボンディング方法及び装置 |
JP2003163236A (ja) * | 2001-11-27 | 2003-06-06 | Shinkawa Ltd | ワイヤボンディング装置 |
-
2001
- 2001-12-28 JP JP2001400285A patent/JP3813088B2/ja not_active Expired - Fee Related
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2002
- 2002-11-13 TW TW091133247A patent/TWI255000B/zh active
- 2002-12-19 US US10/325,991 patent/US6683731B2/en not_active Expired - Fee Related
- 2002-12-20 KR KR10-2002-0081622A patent/KR100491371B1/ko not_active IP Right Cessation
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TW200408018A (en) | 2004-05-16 |
JP2003197671A (ja) | 2003-07-11 |
KR20030057322A (ko) | 2003-07-04 |
US6683731B2 (en) | 2004-01-27 |
US20030123866A1 (en) | 2003-07-03 |
JP3813088B2 (ja) | 2006-08-23 |
KR100491371B1 (ko) | 2005-05-25 |
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