TWI255000B - Bonding apparatus - Google Patents

Bonding apparatus Download PDF

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Publication number
TWI255000B
TWI255000B TW091133247A TW91133247A TWI255000B TW I255000 B TWI255000 B TW I255000B TW 091133247 A TW091133247 A TW 091133247A TW 91133247 A TW91133247 A TW 91133247A TW I255000 B TWI255000 B TW I255000B
Authority
TW
Taiwan
Prior art keywords
lens
tool
reference member
camera
position detecting
Prior art date
Application number
TW091133247A
Other languages
English (en)
Other versions
TW200408018A (en
Inventor
Shigeru Hayata
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200408018A publication Critical patent/TW200408018A/zh
Application granted granted Critical
Publication of TWI255000B publication Critical patent/TWI255000B/zh

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00Details of cameras or camera bodies; Accessories therefor
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
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    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554External layer
    • H01L2224/0555Shape
    • H01L2224/05552Shape in top view
    • H01L2224/05554Shape in top view being square
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    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
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    • H01L2224/859Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
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    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/11Device type
    • H01L2924/14Integrated circuits

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Wire Bonding (AREA)

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1255000 玖、發明說明 【發明所屬之技術領域】 本發明係關於一種打線裝置,特別是關於能正確地算 出用以拍攝工件的位置檢測用攝影機以及工具兩者的偏位 量的打線裝置。 【先前技術】 在ic等之半導體組裝裝置的製程中有打線製程。如第 7圖所示,利用這種製程,將引線4連接到工件3的半導體 晶片1的焊墊(第一接合點)la及導線架2的引腳(第二接合 點)2a上。 該打線製程,係利用第8圖所示的打線裝置1〇來進行 。首先,利用檢測位置用攝影機11,來檢測半導體晶片1 上的至少二個定點以及導線架2上的至少二個定點相對於 正規位置的偏移,根據此檢測値,以運算部來修正預先記 憶的打線座標。這種利用位置檢測用攝影機11檢測的情形 ,係驅動X軸馬達12及Y軸馬達13,俾使位置檢測用攝 影機11的光軸11a位於測定點的正上方。如上述將打線座 標修正後,使工具5沿X、Y軸方向及Z軸方向移動,把 插通於工具5的引線4接合於第一接合點la及第二接合點 2a ° 這種情形,由於位置檢測用攝影機11的光軸11a與工 具5的軸心5a偏位距離W。藉由位置檢測用攝影機11檢 測定點的偏位量而將打線座標修正之後,藉由X軸馬達12 與Y軸馬達13使XY台15移動偏位量W,使工具5位在 1255000 第一接合點1 a上方。然後,藉由χ軸馬達12及γ軸馬達 13使ΧΥ台15沿χγ軸方向移動,以及藉由ζ軸馬達14 使打線臂16上下移動(或擺動)而使工具5沿Ζ軸方向移動 ,藉此,將引線4接合在上述修正後之打線座標上。第8 圖中’打線臂16以可自由擺動的方式設在打線頭17,位置 檢測用攝影機11透過攝影機保持臂18固定在打線頭17上 。又,Xw表示偏位量W的X軸分量,Yw表示偏位量w的 Y軸分量。 由於是用位置檢測用攝影機11來求出基準點以得知工 具5待移動的位置,因此掌握檢測用攝影機n與工具5間 之偏位量係非常重要。然而,實際上的偏位量,由於來自 高溫的打線台來的輻射熱及來自受熱空氣的熱傳導所造成 之攝影機保持臂18及打線臂16的熱膨脹,而時時刻刻在 變化,因此在打線作業開始時以及作業期間的適當時點, 須將偏位量作修正。 習知,要求出正確的偏位量的手段,舉例而言,如曰 本專利第2982000號所揭示者。然而,這種手段,係有別 於爲了檢測接合點的位置之位置檢測用攝影機Η,而需要 另外設置偏位修正專用的偏位修正用攝影機。因此,會有 構造複雜及價格偏高的問題。 爲了解決上述問題,如在特開2001-203234號公報所 示,其係提出一種設置有光學機構的技術’該光學機構係 用以將配置於既定位置的基準構件與工具5的像光導引至 位置檢測用攝影機11。藉此,可將用以檢測工件位置的位 1255000 置檢測用攝影機11兼用在工件5與基準構件的攝影,而在 使用基準構件的情形,也不必使用專用的偏位修正用攝影 機就可完成。 【發明內容】 特開2001-203234號公報中揭示了各種實施形態。其 中有一種實施形態,係使用遠心透鏡(telecentric lens)於位 置檢測用攝影機11的透鏡。所謂遠心透鏡,係遠心光學系 統,亦即以成像的主光線通過透鏡後方側焦點的方式而構 成的光學系統。遠心透鏡,對於與成像面對向方向的位置 偏移的容許範圍很大,特別是在以平行光的透過光照射的 情形,即使物體位置有變動,但像的大小(亦即,距光軸的 距離)不會產生變化。 位置檢測用攝影機11的光學系統雖然近似遠心光學系 統,但嚴格說來不算是遠心光學系統,故在以平行光照射 的場合時,若物體從焦點位置偏移,則像會有些模糊。 本發明的目的係提供一種打線裝置,可在以平行光照 射的場合,不受焦點位置的影響而簡單地得到鮮明的影像 〇 爲達成上述目的,本發明之申請專利範圍第1項,係 一種打線裝置,具備:插通有引線而在工件上進行打線之 工具、用來拍攝工件之位置檢測用攝影機、設置在既定位 置之基準構件、及將該工具及基準構件的像導引到該位置 檢測用攝影機之光學機構,其特徵在於: 藉由設在該位置檢測用攝影機上的透鏡以及設在該光 1255000 學機構上的透鏡兩者的組合,而構成無焦(afocal)系統。 爲達成上述目的之本發明申請專利範圍第2項,係在 上述申請專利範圍第1項的打線裝置,其中,該無焦系統 係克卜勒(Kepler)型者。 爲達成上述目的之本發明申請專利範圍第3項,係在 申請專利範圍第1項的打線裝置,其中,該非焦點系統係 伽利略型。 【實施方式】 茲利用第1圖說明本發明之第一實施形態。又,與第7 圖及第8圖相同或相當的構件用同一符號表示,其詳細說 明省略。位置檢測用攝影機11係具備攝影構件(CCD或 CMOS等)的光電轉換式的攝影機,該位置檢測用攝影機11 的光學系統的透鏡20的焦點位置係形成於工件水平面20a 。在用以將第7圖及第8圖中所示的導線架2定位載置的 打線台(未圖示)附近,設置光學機構支持板21。在光學機 構支持板21上固定基準構件30、光學機構40、及照明機 構50。 在光學機構40的盒體41內設有:反射鏡42,係配設 成相對於透鏡20的工件水平面20a的水平方向以45°的角 度交叉;反射鏡43,係配設成在此反射鏡42上方側相對於 水平方向以一 45°的角度交叉;透鏡44,係設在反射鏡43 的左側;及反射鏡45,係配設成在此透鏡44的左側相對於 水平方向以45°的角度交叉。在盒體41,於反射鏡42的 右側設有窗部41a,在反射鏡45的上方側設有窗部41b。 1255000 又,設有照明機構50,與反射鏡42對向,照射平行的照明 光;在反射鏡42與照明機構50之間設有基準構件30。此 處,反射鏡45的反射面的中心與基準構件30的距離d係 設定爲:和位置檢測用攝影機11的光軸11a與工具5的軸 心5a兩者的X軸方向的偏位量Xw大致相等。 本實施形態,係以透鏡20與透鏡44的組合來構成克 卜勒型的無焦系統。第2圖係表示簡化的光程圖。透鏡20 的合成焦距爲fl,前側主平面爲H11,後側主平面爲H12 。透鏡44之合成焦距爲f2,前側主平面爲H21,後側主平 面爲H22。又,從透鏡20的前側主平面H11到透鏡44的 後側主平面H22的距離爲L。要構成無焦系統,可設成L = fl + f2。又,由於倍率係以fl/f2來表示,因此可選擇f2 的値以得到適當的倍率。 其次,就第8圖中所示之偏位量W的修正方法作說明 。這種修正方法本身與習知相同。又,第1圖表示將Y軸 方向的偏位量Yw修正的情形。首先,將第8圖所示之XY 台15驅動,使工具5的軸心5a位在基準構件30的上方, 接著驅動Z軸馬達14,使工具5下降到幾乎接觸到基準構 件30程度的高度,此處,工具5可位於使位置檢測用攝影 機11能將工具5及基準構件30攝影的位置,並沒有必要 使基準構件30的軸心和工具5的軸心5a —致。 接著,將工具5及基準構件30兩者攝影。工具5及基 準構件30的像被反射鏡42、43反射,通過透鏡44後,以 反射鏡45反射,利用透鏡20以位置檢測用攝影機11拍攝 1255000 成第4圖(a)所示的影像。藉著將此影像作適當的影像處理 ,來算出工具5的軸心5a與基準構件30的軸心30a兩者 的Y軸方向的偏位量△ Y1。 其次,利用預儲存在記憶體(未圖示)中的偏位量Xw、 Yw將XY台15驅動,俾將位置檢測用攝影機Η移動至基 準構件30附近。接著,在此狀態將基準構件30攝影,藉 著將其影像作適當的影像處理,來算出基準構件30的軸心 3〇a與位置檢測用攝影機11的光軸lla兩者的偏位量AY2 。利用測定値ΛΥ1及ΛΥ2,與習知同樣地,可利用式1算 出偏位修正量△Y。 ΔΥ=ΔΥ1-ΔΥ2 (式 1) 如此,由於本實施形態係用透鏡20與透鏡44的組合 構成克卜勒型無焦系統,因此當以照明機構50的平行光照 射時,如果工具5及基準構件30的像的平行光射入到透鏡 44的話,則利用透鏡20呈完全平行光的形式射出到位置檢 測用攝影機11。因此不須利用透鏡44的焦點位置,亦即不 需藉由工具5與基準構件30的水平方向的位置,即可得到 鮮明的影像。 茲利用第3圖說明本發明之第二實施形態。本實施形 態,係在第1圖的實施形態中,採取可從ΧΥ軸兩個方向 觀察對象物(工具5與基準構件30)的方式。本實施形態, 係在第1圖的第一實施形態中的光學機構40設置半反射鏡 46、反射鏡47、48及照明機構51。 半反射鏡46係設在前述實施形態的反射鏡42的右側 1255000 ,照明機構50設成隔著基準構件30而與此半反射鏡46對 向。反射鏡47係設在相對於半反射鏡46爲第3圖下側, 反射鏡48係設在反射鏡47的右側。反射鏡47的反射面與 半反射鏡46的反射面互相平行,兩者都相對於X軸方向以 45°的角度交叉。反射鏡48的反射面相對於X軸方向以-45°的角度交叉。 其次,就偏位量W(Yw,Yw)的修正作說明。進行與前 述實施形態同樣的操作,將工具5下降到幾乎接觸到基準 構件30的高度爲止。接著,利用位置檢測用攝影機11將 工具5與基準構件30兩者攝影,測定兩者的位置關係,亦 即 ΛΧ1、ΔΥ1。 首先,當將照明機構51熄滅,並使照明機構50成點 亮的狀態時,則將工具5與基準構件30之Y軸方向的像, 作爲對來自照明機構50來的光所形成的影像,通過半反射 鏡46後,以反射鏡42、43反射,通過透鏡44,再以反射 鏡45反射,利用第1圖所示的透鏡20以位置檢測用攝影 機Π拍攝出Y軸方向之第4圖(b)所示的影像。藉由將此 影像作適當的影像處理,來算出工具5的軸心5a與基準構 件30的軸心30a兩者的Y軸方向的偏位量ΛΥ1。 其次,當將照明機構50熄滅,並使照明機構51成爲 點亮的狀態時,則工具5與基準構件30的X軸方向的像, 作爲對來自照明機構51的光所形成的影像,利用反射鏡48 、47以半反射鏡46的反射面反射後,再以反射鏡42、43 反射,通過透鏡44後,以反射鏡45反射,利用透鏡20以 1255000 位置fe測用攝影機11拍攝出Y軸方向之第4圖(b)所示的 影像。藉由將此影像作適當的影像處理,來算出工具5的 軸心5a及基準構件30的軸心30a兩者的X軸方向的偏位 量 ΛΧ1。 如此,當將工具5與基準構件30的位置關係進行測定 ,即測定ΛΧ1、△ Y1,然後藉由未圖示的記憶體中預先儲 存的偏位量Xw、Yw,將XY台15驅動,俾使位置檢測用 攝影機11移動至基準構件30附近。其次,在這種狀態下 將基準構件30攝影,藉由將此影像作適當的影像處理,來 算出基準構件30的軸心30a以及位置檢測用攝影機11的 光軸11a兩者的偏位量ΛΧ2、ΛΥ2。可利用測定値Λχι、 △ Y1以及測定値ΛΧ2、ΛΥ2,與習知同樣地,以式2算 出偏位修正量△ X、△ Y。 ΔΧ= ΔΧ1 - ΔΧ2 ΔΥ=ΔΥ1-ΔΥ2 (式 2) 本實施形態係形成無焦系統,因此,由χγ軸的兩個 方向觀察的場合,不必使藉由照明機構50從基準構件30 到透鏡44的光程與藉由照明機構51從基準單元30到透鏡 44的光程的路徑(path)相等。換言之,就半反射鏡48、反 射鏡47、48等的間隔而言,也沒有限制,故對於搭載在打 線裝置上的場合非常有利。 茲利用第5圖說明本發明第三實施形態,本實施形態 係取代第一實施形態的透鏡44,而採用透鏡56,以透鏡20 與透鏡56的組合來構成伽利略型無焦系統者,第6圖係表 12 ,1255000 示簡化的光程圖,透鏡20的合成焦距爲fl,前側主平面爲 H11,後側主平面爲H12。透鏡56的合成焦距爲f3,前側 主平面爲H31,後側主平面爲H32。,又,從透鏡20的前 側主平面H11到透鏡56的後側主平面H32爲止的距離爲L 。要構成無焦系統,可設成L=fl-f3。又,由於倍率係以 fl/f3來表示,因此可選擇f3的値俾能得到適當的倍率。 如此構成也能得到與第1圖的第一實施形態同樣的效 果。又,在本實施形態中,要使對象物(工具5及基準構件 30)能從XY軸的二方向觀察,則可在第5圖所示的光學機 構40,如第3圖的場合般,設置半反射鏡46、反射鏡47、 48及照明機構51。 又,在第1、第3、第5圖之上述各實施形態中,也可 取代反射鏡42、43、45、47、48,而採用稜鏡。 發明效果 由於本發明之打線裝置,係具備:工具,插通有引線 而在工件上進行打線;位置檢測用攝影機,用以將工件攝 影;基準構件,係設置在既定位置;及光學機構,將該工 具及基準構件的像導引到該位置檢測用攝影機;藉由設在 該位置檢測用攝影機上的透鏡以及設在該光學機構上的透 鏡兩者的組合,而構成無焦系統,因此,在以平行光照射 的場合,可以不受焦點位置的影響,而簡單地得到鮮明的 影像。 【圖式簡單說明】 (一)圖式部分 13 !255〇〇〇 第1圖係表示本發明之打線裝置的第一實施形態的局 部剖面要部前視圖。 第2圖係表示第i圖簡化的光程圖。 胃3圖係表示本發明之打線裝置的第二實施形態的俯 視示意圖。 胃4圖(a)、(b)係表示將工具近接於基準構件的狀態的 影像示意圖。 第5圖係表示本發明之打線裝置的第三實施形態的局 部剖面要部前視圖。 第6圖係第5圖簡化之光程圖。 第7圖係打線後之工件的俯視圖。 第8圖係打線裝置的立體圖。 (二)元件代表符號 5 工具 5a 軸心 11 位置檢測用攝影機 11a 光軸 20 透鏡 22 光學機構 30 基準構件 40 光學機構 42、43 反射鏡 44 透鏡 45 、 47 、 48 反射鏡 1255000 46 50、 5 6 半反射鏡 51 照明機構 透鏡
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Claims (1)

1255000 拾、申請專利範圍 1.一種打線裝置,係具備:插通有引線而在工件上進 行打線之工具、用來拍攝工件之位置檢測用攝影機、設置 在既定位置之基準構件、及將該工具及基準構件的像導引 到該位置檢測用攝影機之光學機構,其特徵在於·· 藉由設在該位置檢測用攝影機上的透鏡以及設在該光 學機構上的透鏡兩者的組合,而構成無焦系統。 2·如申請專利範圍第1項之打線裝置,其中, 該無焦系統爲克卜勒型者。 > 3·如申請專利範圍第1項之打線裝置,其中, 該無焦系統爲伽利略型者。 拾壹、圖式 如次頁
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