JP3812800B2 - 封止材料、はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール及び電子回路装置 - Google Patents

封止材料、はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール及び電子回路装置 Download PDF

Info

Publication number
JP3812800B2
JP3812800B2 JP2000094738A JP2000094738A JP3812800B2 JP 3812800 B2 JP3812800 B2 JP 3812800B2 JP 2000094738 A JP2000094738 A JP 2000094738A JP 2000094738 A JP2000094738 A JP 2000094738A JP 3812800 B2 JP3812800 B2 JP 3812800B2
Authority
JP
Japan
Prior art keywords
flux
electronic circuit
solder
circuit module
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2000094738A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001279118A (ja
JP2001279118A5 (enExample
Inventor
稔 高谷
寿之 阿部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP2000094738A priority Critical patent/JP3812800B2/ja
Publication of JP2001279118A publication Critical patent/JP2001279118A/ja
Publication of JP2001279118A5 publication Critical patent/JP2001279118A5/ja
Application granted granted Critical
Publication of JP3812800B2 publication Critical patent/JP3812800B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2000094738A 2000-03-30 2000-03-30 封止材料、はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール及び電子回路装置 Expired - Lifetime JP3812800B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000094738A JP3812800B2 (ja) 2000-03-30 2000-03-30 封止材料、はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール及び電子回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000094738A JP3812800B2 (ja) 2000-03-30 2000-03-30 封止材料、はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール及び電子回路装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006043184A Division JP2006152312A (ja) 2006-02-20 2006-02-20 封止材料、はんだ付け用フラックス、はんだぺースト、電子部品装置、電子回路モジュール及び電子回路装置

Publications (3)

Publication Number Publication Date
JP2001279118A JP2001279118A (ja) 2001-10-10
JP2001279118A5 JP2001279118A5 (enExample) 2005-12-15
JP3812800B2 true JP3812800B2 (ja) 2006-08-23

Family

ID=18609739

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000094738A Expired - Lifetime JP3812800B2 (ja) 2000-03-30 2000-03-30 封止材料、はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール及び電子回路装置

Country Status (1)

Country Link
JP (1) JP3812800B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101077020B1 (ko) * 2006-04-12 2011-10-26 히다치 가세고교 가부시끼가이샤 봉지 충전제용 수지 조성물, 그것을 이용한 플립칩 실장법 및 플립칩 실장품
CN106132086A (zh) * 2016-07-08 2016-11-16 广东小天才科技有限公司 一种电路板结构及电子元件焊接方法

Also Published As

Publication number Publication date
JP2001279118A (ja) 2001-10-10

Similar Documents

Publication Publication Date Title
JP3905100B2 (ja) 半導体装置とその製造方法
KR100545008B1 (ko) 반도체소자와 그 제조방법 및 반도체장치와 그 제조방법
US6574859B2 (en) Interconnection process for module assembly and rework
US20010050181A1 (en) Semiconductor module and circuit substrate
US6915944B1 (en) Soldering flux, solder paste and method of soldering
KR101279291B1 (ko) 납프리 땜납 접속 구조체 및 땜납 볼
JP3849842B2 (ja) はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール、電子回路装置、及び、はんだ付け方法
JP2011040606A (ja) 半導体装置の製造方法
JP4356581B2 (ja) 電子部品実装方法
JP2009099669A (ja) 電子部品の実装構造および実装方法
JP2001170798A (ja) はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール、電子回路装置、及び、はんだ付け方法
JP2002270732A (ja) アンダーフィル材付き電子部品
JP2002190497A (ja) フリップチップ実装用の封止樹脂
JP4366838B2 (ja) 電子回路モジュールの製造方法
JP5541157B2 (ja) 実装基板、及び基板、並びにそれらの製造方法
JP2010232388A (ja) 半導体パッケージ及び半導体部品の実装構造
JP3812800B2 (ja) 封止材料、はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール及び電子回路装置
KR100568496B1 (ko) 주석-인듐 합금층을 갖는 필름 회로 기판
JP2006152312A (ja) 封止材料、はんだ付け用フラックス、はんだぺースト、電子部品装置、電子回路モジュール及び電子回路装置
JP4940662B2 (ja) はんだバンプ、はんだバンプの形成方法及び半導体装置
JP2000151086A (ja) プリント回路ユニット及びその製造方法
JP2018137301A (ja) プリント回路板の製造方法、プリント回路板、および電子機器
JPH11320176A (ja) はんだペースト
JP2001313459A (ja) 電子部品装置、電子回路モジュール、電子回路装置及びその製造方法
KR20100067702A (ko) 접착층이 형성된 솔더볼 및 제조방법

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20051031

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20051031

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20051031

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20051215

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20051221

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060216

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060329

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060421

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20060524

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20060525

R150 Certificate of patent or registration of utility model

Ref document number: 3812800

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090609

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100609

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110609

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120609

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120609

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130609

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140609

Year of fee payment: 8

EXPY Cancellation because of completion of term