JP3727622B2 - ワイヤボンディング装置用放電電極 - Google Patents

ワイヤボンディング装置用放電電極 Download PDF

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Publication number
JP3727622B2
JP3727622B2 JP2002282935A JP2002282935A JP3727622B2 JP 3727622 B2 JP3727622 B2 JP 3727622B2 JP 2002282935 A JP2002282935 A JP 2002282935A JP 2002282935 A JP2002282935 A JP 2002282935A JP 3727622 B2 JP3727622 B2 JP 3727622B2
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Japan
Prior art keywords
discharge
discharge electrode
wire bonding
electrode
film
Prior art date
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Expired - Fee Related
Application number
JP2002282935A
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English (en)
Japanese (ja)
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JP2004119799A5 (enExample
JP2004119799A (ja
Inventor
前田　　徹
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Shinkawa Ltd
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Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2002282935A priority Critical patent/JP3727622B2/ja
Priority to TW092121464A priority patent/TWI267928B/zh
Priority to KR1020030058816A priority patent/KR100559943B1/ko
Priority to US10/671,089 priority patent/US6818861B2/en
Publication of JP2004119799A publication Critical patent/JP2004119799A/ja
Publication of JP2004119799A5 publication Critical patent/JP2004119799A5/ja
Application granted granted Critical
Publication of JP3727622B2 publication Critical patent/JP3727622B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
    • H—ELECTRICITY
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/01006—Carbon [C]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01011—Sodium [Na]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01028—Nickel [Ni]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01033—Arsenic [As]
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
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    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
JP2002282935A 2002-09-27 2002-09-27 ワイヤボンディング装置用放電電極 Expired - Fee Related JP3727622B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002282935A JP3727622B2 (ja) 2002-09-27 2002-09-27 ワイヤボンディング装置用放電電極
TW092121464A TWI267928B (en) 2002-09-27 2003-08-06 Discharge electrode for wire bonding apparatus
KR1020030058816A KR100559943B1 (ko) 2002-09-27 2003-08-25 와이어본딩 장치용 방전전극
US10/671,089 US6818861B2 (en) 2002-09-27 2003-09-25 Discharge electrode for a wire bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002282935A JP3727622B2 (ja) 2002-09-27 2002-09-27 ワイヤボンディング装置用放電電極

Publications (3)

Publication Number Publication Date
JP2004119799A JP2004119799A (ja) 2004-04-15
JP2004119799A5 JP2004119799A5 (enExample) 2005-07-07
JP3727622B2 true JP3727622B2 (ja) 2005-12-14

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Family Applications (1)

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JP2002282935A Expired - Fee Related JP3727622B2 (ja) 2002-09-27 2002-09-27 ワイヤボンディング装置用放電電極

Country Status (4)

Country Link
US (1) US6818861B2 (enExample)
JP (1) JP3727622B2 (enExample)
KR (1) KR100559943B1 (enExample)
TW (1) TWI267928B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050067382A1 (en) * 2003-09-26 2005-03-31 Gary Gillotti Fine pitch electronic flame-off wand electrode
JP4974986B2 (ja) * 2007-09-28 2012-07-11 富士フイルム株式会社 太陽電池用基板および太陽電池
WO2010138494A1 (en) * 2009-05-26 2010-12-02 Inentec Llc Regenerator for syngas cleanup and energy recovery in gasifier systems
US20150196977A1 (en) 2014-01-13 2015-07-16 Camarc Llc Electrode and method changing an electrode to a welding torch
WO2015111244A1 (ja) 2014-01-27 2015-07-30 株式会社日立産機システム カートリッジ式インクジェット記録装置
WO2025178200A1 (ko) * 2024-02-22 2025-08-28 국립부경대학교 산학협력단 헬스 케어를 위한 생화학적 센서용 와이어 전극 제조 방법 및 이를 통하여 제조된 와이어 전극을 구비하는 헬스 케어용 생화학적 센서

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61279140A (ja) 1985-06-04 1986-12-09 Sumitomo Electric Ind Ltd Ｉｃボンダ−用放電電極
JP2798515B2 (ja) 1991-02-18 1998-09-17 ローム株式会社 電子部品におけるワイヤーボンディング装置
JPH07263480A (ja) * 1994-03-18 1995-10-13 Shinkawa Ltd ワイヤボンデイング方法及び装置
US5527441A (en) * 1994-05-04 1996-06-18 General Electric Company Welding electrode with flat blade

Also Published As

Publication number Publication date
US20040060915A1 (en) 2004-04-01
US6818861B2 (en) 2004-11-16
TWI267928B (en) 2006-12-01
KR20040027312A (ko) 2004-04-01
KR100559943B1 (ko) 2006-03-13
TW200405494A (en) 2004-04-01
JP2004119799A (ja) 2004-04-15

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