TWI267928B - Discharge electrode for wire bonding apparatus - Google Patents

Discharge electrode for wire bonding apparatus Download PDF

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Publication number
TWI267928B
TWI267928B TW092121464A TW92121464A TWI267928B TW I267928 B TWI267928 B TW I267928B TW 092121464 A TW092121464 A TW 092121464A TW 92121464 A TW92121464 A TW 92121464A TW I267928 B TWI267928 B TW I267928B
Authority
TW
Taiwan
Prior art keywords
discharge
electrode
oxide film
wire
discharge electrode
Prior art date
Application number
TW092121464A
Other languages
English (en)
Chinese (zh)
Other versions
TW200405494A (en
Inventor
Toru Maeda
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200405494A publication Critical patent/TW200405494A/zh
Application granted granted Critical
Publication of TWI267928B publication Critical patent/TWI267928B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
TW092121464A 2002-09-27 2003-08-06 Discharge electrode for wire bonding apparatus TWI267928B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002282935A JP3727622B2 (ja) 2002-09-27 2002-09-27 ワイヤボンディング装置用放電電極

Publications (2)

Publication Number Publication Date
TW200405494A TW200405494A (en) 2004-04-01
TWI267928B true TWI267928B (en) 2006-12-01

Family

ID=32025252

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092121464A TWI267928B (en) 2002-09-27 2003-08-06 Discharge electrode for wire bonding apparatus

Country Status (4)

Country Link
US (1) US6818861B2 (enExample)
JP (1) JP3727622B2 (enExample)
KR (1) KR100559943B1 (enExample)
TW (1) TWI267928B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050067382A1 (en) * 2003-09-26 2005-03-31 Gary Gillotti Fine pitch electronic flame-off wand electrode
JP4974986B2 (ja) * 2007-09-28 2012-07-11 富士フイルム株式会社 太陽電池用基板および太陽電池
WO2010138494A1 (en) * 2009-05-26 2010-12-02 Inentec Llc Regenerator for syngas cleanup and energy recovery in gasifier systems
US20150196977A1 (en) * 2014-01-13 2015-07-16 Camarc Llc Electrode and method changing an electrode to a welding torch
US9738086B2 (en) 2014-01-27 2017-08-22 Hitachi Industrial Equipment Systems Co., Ltd. Cartridge-type inkjet recording device
WO2025178200A1 (ko) * 2024-02-22 2025-08-28 국립부경대학교 산학협력단 헬스 케어를 위한 생화학적 센서용 와이어 전극 제조 방법 및 이를 통하여 제조된 와이어 전극을 구비하는 헬스 케어용 생화학적 센서

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61279140A (ja) 1985-06-04 1986-12-09 Sumitomo Electric Ind Ltd Ｉｃボンダ−用放電電極
JP2798515B2 (ja) 1991-02-18 1998-09-17 ローム株式会社 電子部品におけるワイヤーボンディング装置
JPH07263480A (ja) * 1994-03-18 1995-10-13 Shinkawa Ltd ワイヤボンデイング方法及び装置
US5527441A (en) * 1994-05-04 1996-06-18 General Electric Company Welding electrode with flat blade

Also Published As

Publication number Publication date
KR100559943B1 (ko) 2006-03-13
US20040060915A1 (en) 2004-04-01
US6818861B2 (en) 2004-11-16
KR20040027312A (ko) 2004-04-01
TW200405494A (en) 2004-04-01
JP2004119799A (ja) 2004-04-15
JP3727622B2 (ja) 2005-12-14

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees