JP3705573B2 - 配線基板の製造方法 - Google Patents

配線基板の製造方法 Download PDF

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Publication number
JP3705573B2
JP3705573B2 JP2000126518A JP2000126518A JP3705573B2 JP 3705573 B2 JP3705573 B2 JP 3705573B2 JP 2000126518 A JP2000126518 A JP 2000126518A JP 2000126518 A JP2000126518 A JP 2000126518A JP 3705573 B2 JP3705573 B2 JP 3705573B2
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JP
Japan
Prior art keywords
electrically insulating
wiring board
wiring
manufacturing
conductive paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000126518A
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English (en)
Japanese (ja)
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JP2001308534A5 (https=
JP2001308534A (ja
Inventor
秀樹 東谷
大蔵 安藤
禎志 中村
俊夫 須川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2000126518A priority Critical patent/JP3705573B2/ja
Publication of JP2001308534A publication Critical patent/JP2001308534A/ja
Publication of JP2001308534A5 publication Critical patent/JP2001308534A5/ja
Application granted granted Critical
Publication of JP3705573B2 publication Critical patent/JP3705573B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2000126518A 2000-04-26 2000-04-26 配線基板の製造方法 Expired - Fee Related JP3705573B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000126518A JP3705573B2 (ja) 2000-04-26 2000-04-26 配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000126518A JP3705573B2 (ja) 2000-04-26 2000-04-26 配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2001308534A JP2001308534A (ja) 2001-11-02
JP2001308534A5 JP2001308534A5 (https=) 2005-07-28
JP3705573B2 true JP3705573B2 (ja) 2005-10-12

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ID=18636287

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000126518A Expired - Fee Related JP3705573B2 (ja) 2000-04-26 2000-04-26 配線基板の製造方法

Country Status (1)

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JP (1) JP3705573B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070073730A (ko) * 2005-07-15 2007-07-10 마쯔시다덴기산교 가부시키가이샤 배선 기판, 배선 재료 및 동장 적층판 및 배선 기판의 제조방법
JP6406598B2 (ja) 2014-07-24 2018-10-17 学校法人福岡大学 プリント配線板及びその製造方法
WO2025109900A1 (ja) * 2023-11-24 2025-05-30 株式会社有沢製作所 回路基板の製造方法

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Publication number Publication date
JP2001308534A (ja) 2001-11-02

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