JP3693007B2 - Electronic component mounting method - Google Patents

Electronic component mounting method Download PDF

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Publication number
JP3693007B2
JP3693007B2 JP2001354518A JP2001354518A JP3693007B2 JP 3693007 B2 JP3693007 B2 JP 3693007B2 JP 2001354518 A JP2001354518 A JP 2001354518A JP 2001354518 A JP2001354518 A JP 2001354518A JP 3693007 B2 JP3693007 B2 JP 3693007B2
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JP
Japan
Prior art keywords
resin
electronic component
substrate
electrode
component mounting
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Expired - Fee Related
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JP2001354518A
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JP2003158154A (en
Inventor
忠彦 境
俊和 松尾
憲 前田
省二 酒見
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/118—Post-treatment of the bump connector
    • H01L2224/1182—Applying permanent coating, e.g. in-situ coating
    • H01L2224/11822—Applying permanent coating, e.g. in-situ coating by dipping, e.g. in a solder bath
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/1354—Coating
    • H01L2224/1356—Disposition
    • H01L2224/13563—Only on parts of the surface of the core, i.e. partial coating
    • H01L2224/13564—Only on the bonding interface of the bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/1354—Coating
    • H01L2224/13599—Material
    • H01L2224/1369—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy

Description

【０００１】
【発明の属する技術分野】
本発明は、電子部品を基板に実装する電子部品実装方法に関するものである。
【０００２】
【従来の技術】
フリップチップなど半導体素子に接続用電極であるバンプが設けられた電子部品の実装方法として、バンプを基板の電極に半田接合する方法が広く用いられている。この実装方法において、バンプと基板との半田接合部を補強する目的で電子部品と基板との間に補強樹脂部を設けることが行われる。この補強樹脂部の形成は、半田接合後に電子部品と基板との間に補強用の樹脂を注入することによって行うか、もしくは電子部品の搭載に先立って実装位置全面に予め補強用樹脂を塗布する方法が用いられていた。
【０００３】
後者の場合には、補強用樹脂としてバンプ表面の半田酸化膜を除去する能力を有する活性成分を含む熱硬化性の樹脂が用いられ、電子部品搭載後に基板をリフローにより加熱してバンプと電極とを半田接合するとともに、樹脂を熱硬化させて樹脂補強部を形成するようにしていた。このとき、活性成分を含む樹脂を用いることにより、樹脂がバンプと電極との接合界面に進入しても半田接合を阻害することがなく、半田接合と補強樹脂部形成が同一工程で行え、工程が簡略されるという利点がある。
【０００４】
【発明が解決しようとする課題】
しかしながら、上記補強用樹脂を予め塗布する方法では、電子部品と基板との空間が樹脂でほぼ完全に充填されるので、リフロー工程において発生するボイドに起因して電子部品が持ち上げられるという不具合が生じやすい。すなわち、リフローにおいて基板が加熱されると基板に含まれた水分や有機成分がガス化して基板の上面から補強用樹脂内に進入し、内部で空孔状のボイドを形成する。
【０００５】
このボイドが温度上昇によって電子部品と基板との間でさらに成長すると電子部品が下方から持ち上げられ、バンプと電極との間に隙間を生じて正常な半田接合が阻害される。このように、補強用樹脂を予め塗布する従来の電子部品実装方法には、基板から発生した気体が補強用樹脂内にボイドを形成することに起因して、実装不良を生じるという問題点があった。
【０００６】
そこで本発明は、補強用樹脂を予め塗布して補強樹脂部形成工程を簡略化するとともに、基板から発生した気体に起因する実装不良を防止することができる電子部品実装方法を提供することを目的とする。
【００１１】
【課題を解決するための手段】
請求項１記載の電子部品実装方法は、電子部品に設けられた接続用電極を基板の電極に半田接合することにより電子部品を基板に実装する電子部品実装方法であって、前記基板の上面に設定された電子部品固着点に熱硬化性の第１の樹脂を供給する第１の樹脂供給工程と、前記電子部品の接続用電極に酸化膜除去能力を有する第２の樹脂を供給する第２の樹脂供給工程と、第２の樹脂供給工程後の前記電子部品を第１の樹脂供給工程後の基板に搭載して前記接続用電極を前記第２の樹脂を介して基板の電極に着地させる部品搭載工程と、部品搭載工程後の基板を加熱することにより接続用電極を前記電極に半田接合するとともに前記第１の樹脂を熱硬化させる加熱工程とを含み、前記第１の樹脂供給工程および第２の樹脂供給工程において部品搭載工程後の基板と電子部品との間に脱気用隙間が確保されるように第１の樹脂および第２の樹脂を供給することにより、前記加熱工程において基板から発生する気体を前記脱気用隙間から外部へ排出する。
【００１２】
請求項２記載の電子部品実装方法は、請求項１記載の電子部品実装方法であって、前記第２の樹脂は熱硬化性樹脂であり、第２の樹脂が熱硬化することにより、電子部品の接続用電極と基板の電極との半田接合部を補強する樹脂補強部が形成される。
【００１３】
請求項３記載の電子部品実装方法は、請求項１記載の電子部品実装方法であって、前記第２の樹脂は、半田接合用のフラックスである。
【００１４】
本発明によれば、補強用の熱硬化性樹脂を予め基板上に供給する樹脂供給工程において部品搭載工程後の基板と電子部品との間に脱気用隙間が確保されるように熱硬化性樹脂を供給することにより、加熱工程において基板から発生する気体を脱気用隙間から外部へ排出することができ、基板から発生した気体に起因する実装不良を防止することができる。
【００１５】
【発明の実施の形態】
（実施の形態１）
図１、図２は本発明の実施の形態１の電子部品実装方法の工程説明図である。図１（ａ）において、電子部品１の下面（バンプ形成面）には接続用電極としてのバンプ２が、半田を形成材料として設けられている。図１（ａ）は、バンプ２に樹脂を塗布するための樹脂供給工程を示しており、電子部品１は樹脂塗布部５上に位置している。樹脂塗布部５は樹脂６の塗膜が形成された樹脂転写容器５ａを備えており、樹脂転写容器５ａに対して電子部品１を上下動させることにより、バンプ２の下面側に所定量の樹脂６が転写により供給される。樹脂６は、エポキシ樹脂などの熱硬化性樹脂を主成分とする基剤に、酸化膜除去能力を有する活性成分を含有させたものである。
【００１６】
この樹脂供給工程における樹脂供給量は、電子部品１が後工程で基板３に搭載された状態で、基板３の上面と電子部品１の下面との間を過度に密封してリフロー時に基板３から放出されるガスの外部への排出を阻害しないよう、かつ樹脂６が熱硬化した後の補強効果が確保されるための下限量以上となるよう、調整される。供給量の調整は、樹脂転写容器５ａに形成される樹脂６の塗膜の厚みを調整、もしくは塗膜に対する電子部品１の下降高さを調整することにより行われる。要は、樹脂６がバンプ形成面全面に付着しないようにすればよく、好ましくはバンプ２にのみ樹脂６を付着させる。
【００１７】
図１（ｂ）、（ｃ）は、樹脂供給工程後の電子部品１を基板３に搭載する部品搭載工程を示している。ここでは、バンプ２を基板３の上面に形成された電極４に位置合わせして電子部品１を基板３に対して下降させて、バンプ２を樹脂６を介して電極４に着地させる。これにより、バンプ２の下面に転写された樹脂６は電極４に付着しさらに電極４を覆った形で基板３の上面に拡がるが、このとき樹脂６の供給量が上述のように管理されることから、樹脂６は基板３の上面と電子部品１の下面との間を充填するには至らない。
【００１８】
次いで基板３はリフロー装置に送られ、ここで図１（ｄ）に示すように部品搭載工程後の基板３を加熱する加熱工程が行われる。この加熱により、バンプ２が溶融して電極４に半田接合される。この半田接合において、バンプ２の表面に生成した酸化膜は酸化膜除去能力を有する樹脂６によって除去されることから、接合性のよい良好な半田接合が行われる。またこのとき樹脂６の熱硬化反応が並行して進行し、バンプ２と電極４との半田接合部を周囲から包み込んで補強する。なお、このリフロー時においては、樹脂６の硬化は完全硬化まで至る必要はなく、半硬化の状態でよい。
【００１９】
上記加熱工程において、基板３の内部に含有されていた有機成分や水分が加熱によりガス化して表面から放出されるが、上述のように基板３の上面と電子部品１の下面との間の隙間は樹脂６によって充填された状態とはなっておらず、これらのガス（気体）を外部に排出するための脱気用隙間がバンプとバンプの間に確保されている。このためこれらのガスが樹脂６の内部に気泡状態で閉じこめられることによるボイドが発生してもある程度の大きさまで成長すると脱気用隙間と連通して消滅する。
【００２０】
従って、樹脂を電子部品と基板との間に充填した状態で半田接合する従来の電子部品実装においてこのようなボイドに起因して発生していた不具合、すなわち電子部品がボイドによって持ち上げられて、バンプが電極から浮き上がってしまうことによる半田接合不良が発生しない。
【００２１】
次にこの加熱工程後の基板３は樹脂封止工程に送られる。なお、この樹脂封止はより高い補強効果を確保するために行われるものであり、求められる補強レベルによっては必ずしも行う必要はない。図２（ａ）に示すように、電子部品１の下面と基板３の上面の間の隙間には、ディスペンサ７によって補強用樹脂８が注入される。そして図２（ｂ）に示すように、基板３と電子部品１との間を完全に補強用樹脂８によって充填した後、図２（ｃ）に示すように基板３は再度加熱される。この加熱によって補強用樹脂８が熱硬化することにより、電子部品１と基板３との間が樹脂封止される。そしてこの加熱で樹脂６も完全硬化し、バンプ２と電極４との半田接合部の周囲を強固に補強する。
【００２２】
上記方法により実現される電子部品実装構造においては、樹脂６中の活性成分の酸化膜除去能力によりバンプ２と電極４との半田接合性が確保される。また半田接合後に樹脂６が熱硬化することにより半田接合部を補強するとともに、基板３と電子部品１との間を封止した補強用樹脂８によって、実装後において基板３と電子部品１との間に発生する熱応力を緩和することができ、信頼性に優れた実装構造が実現される。
【００２３】
さらに樹脂６は活性成分を含有していることから、従来の電子部品実装において半田接合に際して必要とされたフラックスの塗布を行う必要がない。そして樹脂６中の活性成分は、熱効果過程において硬化剤として大部分が消費され、また活性成分の残留分も硬化した樹脂中に閉じこめられるため、実装後に回路パターンが活性成分によって腐食するマイグレーションの発生がない。従って、フラックスを用いる従来の方法において必要とされた洗浄処理が不要となる。また前述の樹脂封止工程を省略する場合には、半田接合と補強樹脂部の形成が同一工程で完了することになり、工程の簡略化・低コスト化が実現される。
【００２４】
なお、補強用樹脂８を硬化させるための加熱温度は、基板３から新たなガスが発生するのを抑制するために、半田接合時の加熱温度よりも低くすることが望ましいが、半田接合時の加熱で基板３からの脱ガスが十分行われる場合は、半田接合時の加熱温度以上で加熱して硬化させてよい。
【００２５】
（実施の形態２）
図３は本発明の実施の形態２の電子部品実装方法の工程説明図である。本実施の形態２は、実施の形態１と同様の電子部品１を基板３に実装するに際し、樹脂６を予め基板３の電極４上に供給するようにしたものである。
【００２６】
図３（ａ）において、基板３の電極４上には実施の形態１に示すものと同様の樹脂６が供給される。この樹脂供給工程における樹脂供給量も、実施の形態１と同様に調整され、電子部品１が後工程で基板に搭載された状態で、基板上面と電子部品１の下面との間を過度に密封してリフロー時に基板３から放出されるガスの外部への排出を阻害しないよう、かつ樹脂６が熱硬化した後の補強効果が確保されるための下限量以上となるよう設定されている。
【００２７】
図３（ｂ）、（ｃ）は、樹脂供給工程後の基板３に対して電子部品１を搭載する部品搭載工程を示しており、電子部品１を下降させることによりバンプ２は樹脂６を介して電極４に着地する。これにより、バンプ２の下面に転写された樹脂６は電極４に付着しさらに電極４を覆った形で基板３の上面に拡がるが、このとき樹脂６の供給量が上述のように管理されることから、樹脂６は基板３の上面と電子部品１の下面との間を充填するには至らない。すなわち、バンプとバンプの間には脱気用隙間が確保される。
【００２８】
次いで基板３はリフロー装置に送られ、ここで図３（ｄ）に示すように部品搭載工程後の基板３を加熱する加熱工程が行われる。この加熱により、実施の形態１と同様にバンプ２が溶融して電極４に半田接合される。この加熱工程においても実施の形態１と同様に基板３から放出されるガスを外部に排出するための脱気用隙間が確保されてため、このようなボイドに起因する不具合が発生しない。この後、加熱工程後の基板３は実施の形態１と同様に、図２に示す樹脂封止工程に送られ、同様に補強用樹脂８による樹脂封止が行われる。
【００２９】
なお、補強用樹脂８を硬化させるための加熱温度は、基板３から新たなガスが発生するのを抑制するために、半田接合時の加熱温度よりも低くすることが望ましいが、半田接合時の加熱で基板３からの脱ガスが十分行われる場合は、半田接合時の加熱温度以上で加熱して硬化させてよい。そしてこのようにして実現される実装構造も、実施の形態１と同様の特性を備えている。
【００３０】
（実施の形態３）
図４は本発明の実施の形態３の電子部品実装方法の工程説明図である。本実施の形態３は、実施の形態１、２と同様の電子部品１の基板３への実装において、電子部品１と基板３との間を樹脂封止する代わりに、補強樹脂によって電子部品１と基板３とを局部的に固着させることによって補強効果を得るものである。
【００３１】
図４（ａ）において、基板３の電極４のうち、最外縁に位置する電極４上には予め熱硬化性の補強用樹脂９（第１の樹脂）が供給される（第１の樹脂供給工程）。最外縁の電極４は、電子部品１を基板３に固着させるために基板３の上面に設定された電子部品固着点となっている。また電子部品１のバンプ２には、実施の形態１の図１（ａ）に示す樹脂供給と同様に、酸化膜除去能力を有する熱硬化性の樹脂６（第２の樹脂）が供給される（第２の樹脂供給工程）。
【００３２】
この第１の樹脂供給工程における補強用樹脂９の供給量および第２の樹脂供給工程における樹脂６の供給量も、実施の形態１、２と同様に、電子部品１が後工程で基板３に搭載された状態で、基板３の上面と電子部品１の下面との間を過度に密封してリフロー時に基板３から放出されるガスの外部への排出を阻害しないよう、かつ樹脂６が熱硬化した後の補強効果が確保されるための下限量以上となるよう調整される。
【００３３】
図４（ｂ）、（ｃ）は、第１の樹脂供給工程後の基板３に対して第２の樹脂供給工程後の電子部品１を搭載する部品搭載工程を示しており、電子部品１を下降させることによりバンプ２は樹脂６を介して電極４に着地する。このとき下面に樹脂６が塗布されたバンプ２は、最外縁の電極４においては補強用樹脂９中に埋入した状態で電極４に着地する。この搭載状態において、樹脂６、補強用樹脂９の供給量が上述のように管理されることから、樹脂６や補強用樹脂９は基板３の上面と電子部品１の下面との間を充填するには至らない。
【００３４】
次いで基板３はリフロー装置に送られ、ここで図４（ｄ）に示すように部品搭載工程後の基板３を加熱する加熱工程が行われる。この加熱により、実施の形態１、２と同様にバンプ２が溶融して電極４に半田接合される。この半田接合とともに樹脂６と補強用樹脂９がともに熱硬化し、熱硬化した樹脂６がバンプ２と電極４との半田接合部を周囲から補強する樹脂補強部が形成されるとともに、熱硬化した補強用樹脂９が電子部品１の本体部を基板３に直接固着する。この加熱工程においても実施の形態１、２と同様に基板３から放出されるガスを外部に排出するための脱気用隙間が確保されてため、このようなボイドに起因する不具合が発生しない。
【００３５】
なお、上記実施の形態３において、バンプ２の下面に樹脂６を供給する代わりに、活性作用を有するフラックスを塗布するようにしてもよい。これにより、バンプ２と電極４との半田接合においてバンプ２の酸化膜がフラックスにより除去され、良好な半田接合性が確保される。この例では、バンプ２と電極４との半田接合部を周囲から補強する効果はないが、電子部品１は補強用樹脂９によって基板３に直接固着されていることから、十分な補強強度を有する実装構造となっている。
【００３６】
また、上記実施の形態１、２、３において、接続用電極として半田を形成材料とするバンプ２が設けられた電子部品１を対象とした例を示したが、本発明は半田バンプ形式の電極に限定されず、電子部品１と基板３との間に隙間を保った形で半田接合によって実装する形態であれば、その他の形状の接続用電極を用いた場合にあっても本発明を適用することができる。
【００３７】
【発明の効果】
本発明によれば、補強用の熱硬化性樹脂を予め基板上に供給する樹脂供給工程において部品搭載工程後の基板と電子部品との間に脱気用隙間が確保されるように熱硬化性樹脂を供給するようにしたので、加熱工程において基板から発生する気体を脱気用隙間から外部へ排出することができ、基板から発生した気体に起因する実装不良を防止することができる。
【図面の簡単な説明】
【図１】本発明の実施の形態１の電子部品実装方法の工程説明図
【図２】本発明の実施の形態１の電子部品実装方法の工程説明図
【図３】本発明の実施の形態２の電子部品実装方法の工程説明図
【図４】本発明の実施の形態３の電子部品実装方法の工程説明図
【符号の説明】
１ 電子部品
２ バンプ
３ 基板
４ 電極
６ 樹脂
８、９ 補強用樹脂[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting method for mounting an electronic component on a substrate.
[0002]
[Prior art]
As a mounting method of an electronic component in which a bump as a connection electrode is provided on a semiconductor element such as a flip chip, a method of soldering a bump to an electrode on a substrate is widely used. In this mounting method, a reinforcing resin portion is provided between the electronic component and the substrate for the purpose of reinforcing the solder joint portion between the bump and the substrate. The reinforcing resin portion is formed by injecting a reinforcing resin between the electronic component and the substrate after soldering, or by applying a reinforcing resin in advance to the entire mounting position prior to mounting the electronic component. The method was used.
[0003]
In the latter case, a thermosetting resin containing an active component having the ability to remove the solder oxide film on the bump surface is used as the reinforcing resin, and after mounting the electronic components, the substrate is heated by reflow to form the bumps and electrodes. In addition, the resin is thermally cured and the resin reinforcing portion is formed. At this time, by using a resin containing an active component, even if the resin enters the bonding interface between the bump and the electrode, the solder bonding is not hindered, and the solder bonding and the reinforcing resin portion can be formed in the same process. Has the advantage of being simplified.
[0004]
[Problems to be solved by the invention]
However, in the method of applying the reinforcing resin in advance, since the space between the electronic component and the substrate is almost completely filled with the resin, there is a problem that the electronic component is lifted due to a void generated in the reflow process. Cheap. That is, when the substrate is heated in reflow, moisture and organic components contained in the substrate are gasified and enter the reinforcing resin from the upper surface of the substrate to form void-like voids therein.
[0005]
When the void further grows between the electronic component and the substrate due to the temperature rise, the electronic component is lifted from below, and a gap is formed between the bump and the electrode, thereby preventing normal solder bonding. As described above, the conventional electronic component mounting method in which the reinforcing resin is applied in advance has a problem in that mounting defects occur due to the gas generated from the substrate forming voids in the reinforcing resin. It was.
[0006]
Accordingly, an object of the present invention is to provide an electronic component mounting method that can preliminarily apply a reinforcing resin to simplify the reinforcing resin portion forming process and prevent mounting defects caused by gas generated from a substrate. And
[0011]
[Means for Solving the Problems]
The electronic component mounting method according to claim 1 is an electronic component mounting method for mounting an electronic component on a substrate by soldering a connection electrode provided on the electronic component to an electrode of the substrate, on the upper surface of the substrate. A first resin supplying step of supplying a thermosetting first resin to the set electronic component fixing point, and a second resin supplying a second resin having an oxide film removing capability to the connection electrode of the electronic component The electronic component after the second resin supply step and the electronic component after the second resin supply step are mounted on the substrate after the first resin supply step, and the connection electrode is landed on the electrode of the substrate via the second resin. A component mounting step, and a heating step of soldering the connection electrode to the electrode by heating the substrate after the component mounting step and thermosetting the first resin, the first resin supplying step, Part in the second resin supply process By supplying the first resin and the second resin so as to ensure a degassing gap between the substrate and the electronic component after the mounting process, the gas generated from the substrate in the heating process is degassed. Discharge to the outside through the clearance.
[0012]
The electronic component mounting method according to claim 2 is the electronic component mounting method according to claim 1 , wherein the second resin is a thermosetting resin, and the second resin is thermally cured, whereby the electronic component is mounted. A resin reinforcing portion is formed to reinforce the solder joint between the connecting electrode and the substrate electrode.
[0013]
Electronic component mounting method according to claim 3 is an electronic component mounting method according to claim 1, wherein the second resin is a flux for solder bonding.
[0014]
According to the present invention, in the resin supply process in which the reinforcing thermosetting resin is supplied onto the substrate in advance, the thermosetting property is ensured so that a deaeration gap is ensured between the substrate and the electronic component after the component mounting process. By supplying the resin, the gas generated from the substrate in the heating step can be discharged to the outside through the deaeration gap, and mounting defects due to the gas generated from the substrate can be prevented.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
(Embodiment 1)
1 and 2 are process explanatory diagrams of the electronic component mounting method according to the first embodiment of the present invention. In FIG. 1A, bumps 2 as connection electrodes are provided on the lower surface (bump formation surface) of an electronic component 1 with solder as a forming material. FIG. 1A shows a resin supply process for applying a resin to the bump 2, and the electronic component 1 is located on the resin application part 5. The resin application unit 5 includes a resin transfer container 5a on which a coating film of the resin 6 is formed. By moving the electronic component 1 up and down with respect to the resin transfer container 5a, a predetermined amount of resin is formed on the lower surface side of the bump 2. 6 is supplied by transfer. The resin 6 is obtained by adding an active component having an ability to remove an oxide film to a base mainly composed of a thermosetting resin such as an epoxy resin.
[0016]
The resin supply amount in this resin supply process is such that the electronic component 1 is mounted on the substrate 3 in a subsequent process and the space between the upper surface of the substrate 3 and the lower surface of the electronic component 1 is excessively sealed and the substrate 3 is reflowed. Adjustment is made so as not to hinder the discharge of the released gas to the outside and to be equal to or more than the lower limit amount for ensuring the reinforcing effect after the resin 6 is thermally cured. The supply amount is adjusted by adjusting the thickness of the coating film of the resin 6 formed on the resin transfer container 5a or by adjusting the descending height of the electronic component 1 with respect to the coating film. In short, it is sufficient that the resin 6 does not adhere to the entire bump forming surface, and the resin 6 is preferably attached only to the bump 2.
[0017]
FIGS. 1B and 1C show a component mounting process for mounting the electronic component 1 on the substrate 3 after the resin supply process. Here, the bump 2 is aligned with the electrode 4 formed on the upper surface of the substrate 3, the electronic component 1 is lowered with respect to the substrate 3, and the bump 2 is landed on the electrode 4 through the resin 6. Thereby, the resin 6 transferred to the lower surface of the bump 2 adheres to the electrode 4 and further spreads on the upper surface of the substrate 3 so as to cover the electrode 4. At this time, the supply amount of the resin 6 is managed as described above. Therefore, the resin 6 does not fill between the upper surface of the substrate 3 and the lower surface of the electronic component 1.
[0018]
Next, the substrate 3 is sent to a reflow apparatus, where a heating step for heating the substrate 3 after the component mounting step is performed as shown in FIG. By this heating, the bump 2 is melted and soldered to the electrode 4. In this solder bonding, the oxide film formed on the surface of the bump 2 is removed by the resin 6 having an oxide film removing capability, so that good solder bonding with good bondability is performed. At this time, the thermosetting reaction of the resin 6 proceeds in parallel, and the solder joint between the bump 2 and the electrode 4 is wrapped around and reinforced from the periphery. At the time of this reflow, the resin 6 does not need to be completely cured, and may be in a semi-cured state.
[0019]
In the heating step, organic components and moisture contained in the substrate 3 are gasified by heating and released from the surface. As described above, the gap between the upper surface of the substrate 3 and the lower surface of the electronic component 1 Is not filled with the resin 6, and a deaeration gap for discharging these gases to the outside is secured between the bumps. For this reason, even if a void is generated by confining these gases inside the resin 6 in the form of bubbles, if the gas grows to a certain size, it disappears in communication with the deaeration gap.
[0020]
Therefore, in the conventional electronic component mounting in which the resin is soldered between the electronic component and the substrate in a state where it is soldered, a defect occurred due to such a void, that is, the electronic component is lifted by the void, and the bump Does not cause poor solder joints due to floating from the electrodes.
[0021]
Next, the substrate 3 after this heating step is sent to a resin sealing step. In addition, this resin sealing is performed in order to ensure a higher reinforcement effect, and does not necessarily need to be performed depending on the required reinforcement level. As shown in FIG. 2A, the reinforcing resin 8 is injected by the dispenser 7 into the gap between the lower surface of the electronic component 1 and the upper surface of the substrate 3. As shown in FIG. 2B, after the space between the substrate 3 and the electronic component 1 is completely filled with the reinforcing resin 8, the substrate 3 is heated again as shown in FIG. The reinforcing resin 8 is thermally cured by this heating, so that the resin component is sealed between the electronic component 1 and the substrate 3. By this heating, the resin 6 is also completely cured, and the periphery of the solder joint portion between the bump 2 and the electrode 4 is strongly reinforced.
[0022]
In the electronic component mounting structure realized by the above method, the solder bonding property between the bump 2 and the electrode 4 is ensured by the ability of the active component in the resin 6 to remove the oxide film. Further, the resin 6 is thermally cured after the solder bonding, so that the solder joint is reinforced, and the reinforcing resin 8 that seals between the substrate 3 and the electronic component 1 is used to connect the substrate 3 and the electronic component 1 after mounting. Thermal stress generated between them can be relaxed, and a highly reliable mounting structure is realized.
[0023]
Furthermore, since the resin 6 contains an active component, it is not necessary to apply a flux required for solder joining in conventional electronic component mounting. The active component in the resin 6 is mostly consumed as a curing agent in the thermal effect process, and the residual component of the active component is confined in the cured resin, so that the circuit pattern is corroded by the active component after mounting. There is no occurrence. Therefore, the cleaning process required in the conventional method using a flux becomes unnecessary. Further, when the above-described resin sealing step is omitted, the solder bonding and the formation of the reinforcing resin portion are completed in the same step, so that the process can be simplified and the cost can be reduced.
[0024]
Note that the heating temperature for curing the reinforcing resin 8 is preferably lower than the heating temperature at the time of solder bonding in order to suppress the generation of new gas from the substrate 3. When the degassing from the substrate 3 is sufficiently performed by heating, it may be cured by heating at a temperature equal to or higher than the heating temperature at the time of solder bonding.
[0025]
(Embodiment 2)
FIG. 3 is a process explanatory diagram of the electronic component mounting method according to the second embodiment of the present invention. In the second embodiment, when the same electronic component 1 as in the first embodiment is mounted on the substrate 3, the resin 6 is supplied in advance onto the electrodes 4 of the substrate 3.
[0026]
In FIG. 3A, the same resin 6 as that shown in the first embodiment is supplied onto the electrode 4 of the substrate 3. The resin supply amount in this resin supply process is also adjusted in the same manner as in the first embodiment, and the electronic component 1 is mounted on the substrate in a subsequent process, and the space between the upper surface of the substrate and the lower surface of the electronic component 1 is excessively sealed. Thus, the amount of gas released from the substrate 3 during reflow is not hindered to the outside, and is set to be equal to or more than the lower limit for ensuring the reinforcing effect after the resin 6 is thermally cured.
[0027]
FIGS. 3B and 3C show a component mounting process in which the electronic component 1 is mounted on the substrate 3 after the resin supply process, and the bump 2 passes through the resin 6 by lowering the electronic component 1. And land on the electrode 4. Thereby, the resin 6 transferred to the lower surface of the bump 2 adheres to the electrode 4 and further spreads on the upper surface of the substrate 3 so as to cover the electrode 4. At this time, the supply amount of the resin 6 is managed as described above. Therefore, the resin 6 does not fill between the upper surface of the substrate 3 and the lower surface of the electronic component 1. That is, a deaeration gap is secured between the bumps.
[0028]
Next, the substrate 3 is sent to a reflow apparatus, where a heating step for heating the substrate 3 after the component mounting step is performed as shown in FIG. By this heating, the bump 2 is melted and soldered to the electrode 4 as in the first embodiment. Also in this heating step, a deaeration gap for discharging the gas released from the substrate 3 to the outside is ensured as in the first embodiment, so that a problem due to such a void does not occur. Thereafter, the substrate 3 after the heating step is sent to the resin sealing step shown in FIG. 2 similarly to the first embodiment, and the resin sealing with the reinforcing resin 8 is similarly performed.
[0029]
Note that the heating temperature for curing the reinforcing resin 8 is preferably lower than the heating temperature at the time of solder bonding in order to suppress the generation of new gas from the substrate 3. When the degassing from the substrate 3 is sufficiently performed by heating, it may be cured by heating at a temperature equal to or higher than the heating temperature at the time of solder bonding. The mounting structure realized in this way also has the same characteristics as those of the first embodiment.
[0030]
(Embodiment 3)
FIG. 4 is a process explanatory diagram of the electronic component mounting method according to the third embodiment of the present invention. In the third embodiment, in mounting the electronic component 1 on the substrate 3 as in the first and second embodiments, instead of resin-sealing between the electronic component 1 and the substrate 3, the electronic component 1 is made of reinforcing resin. And the substrate 3 are locally fixed to obtain a reinforcing effect.
[0031]
4A, a thermosetting reinforcing resin 9 (first resin) is supplied in advance onto the electrode 4 located on the outermost edge among the electrodes 4 of the substrate 3 (first resin supply). Process). The outermost electrode 4 is an electronic component fixing point set on the upper surface of the substrate 3 in order to fix the electronic component 1 to the substrate 3. Similarly to the resin supply shown in FIG. 1A of the first embodiment, a thermosetting resin 6 (second resin) having an oxide film removal capability is supplied to the bumps 2 of the electronic component 1. (Second resin supply step).
[0032]
Similarly to the first and second embodiments, the supply amount of the reinforcing resin 9 in the first resin supply step and the supply amount of the resin 6 in the second resin supply step are the same as those of the first and second embodiments. In a mounted state, the resin 6 is thermally cured so that the space between the upper surface of the substrate 3 and the lower surface of the electronic component 1 is not excessively sealed to prevent the discharge of gas released from the substrate 3 during reflow. It adjusts so that it may become more than the lower limit amount for ensuring the reinforcement effect after doing.
[0033]
4B and 4C show a component mounting process for mounting the electronic component 1 after the second resin supply process on the substrate 3 after the first resin supply process. By lowering, the bump 2 is landed on the electrode 4 through the resin 6. At this time, the bump 2 having the lower surface coated with the resin 6 lands on the electrode 4 while being embedded in the reinforcing resin 9 in the outermost electrode 4. In this mounted state, since the supply amounts of the resin 6 and the reinforcing resin 9 are managed as described above, the resin 6 and the reinforcing resin 9 fill the space between the upper surface of the substrate 3 and the lower surface of the electronic component 1. It does not lead to.
[0034]
Next, the substrate 3 is sent to a reflow apparatus, where a heating step of heating the substrate 3 after the component mounting step is performed as shown in FIG. By this heating, the bump 2 is melted and soldered to the electrode 4 as in the first and second embodiments. The resin 6 and the reinforcing resin 9 are both thermoset together with the solder bonding, and the thermoset resin 6 forms a resin reinforcing portion that reinforces the solder joint portion between the bump 2 and the electrode 4 from the periphery, and is thermoset. The reinforcing resin 9 directly fixes the main body of the electronic component 1 to the substrate 3. Also in this heating step, a degassing gap for discharging the gas released from the substrate 3 to the outside is ensured as in the first and second embodiments, so that a problem due to such voids does not occur.
[0035]
In the third embodiment, instead of supplying the resin 6 to the lower surface of the bump 2, a flux having an active action may be applied. Thereby, the oxide film of the bump 2 is removed by the flux in the solder joint between the bump 2 and the electrode 4, and a good solder joint property is secured. In this example, there is no effect of reinforcing the solder joint portion between the bump 2 and the electrode 4 from the surroundings, but the electronic component 1 has a sufficient reinforcing strength because it is directly fixed to the substrate 3 by the reinforcing resin 9. It has a mounting structure.
[0036]
Further, in the first, second, and third embodiments, the example in which the electronic component 1 provided with the bump 2 made of solder as the connection electrode is shown, but the present invention is an electrode of the solder bump type. The present invention is not limited to this, and the present invention can be applied even when connection electrodes having other shapes are used as long as they are mounted by solder bonding in a form that maintains a gap between the electronic component 1 and the substrate 3. can do.
[0037]
【The invention's effect】
According to the present invention, in the resin supply process in which the thermosetting resin for reinforcement is supplied onto the substrate in advance, the thermosetting is ensured so that a deaeration gap is secured between the substrate and the electronic component after the component mounting process. Since the resin is supplied, the gas generated from the substrate in the heating process can be discharged to the outside through the deaeration gap, and mounting defects due to the gas generated from the substrate can be prevented.
[Brief description of the drawings]
FIG. 1 is a process explanatory diagram of an electronic component mounting method according to a first embodiment of the present invention. FIG. 2 is a process explanatory diagram of an electronic component mounting method according to a first embodiment of the present invention. FIG. 4 is a process explanatory diagram of the electronic component mounting method according to the second embodiment of the present invention.
1 Electronic component 2 Bump 3 Substrate 4 Electrode 6 Resin 8, 9 Resin for reinforcement

Claims (3)

電子部品に設けられた接続用電極を基板の電極に半田接合することにより電子部品を基板に実装する電子部品実装方法であって、前記基板の上面に設定された電子部品固着点に熱硬化性の第１の樹脂を供給する第１の樹脂供給工程と、前記電子部品の接続用電極に酸化膜除去能力を有する第２の樹脂を供給する第２の樹脂供給工程と、第２の樹脂供給工程後の前記電子部品を第１の樹脂供給工程後の基板に搭載して前記接続用電極を前記第２の樹脂を介して基板の電極に着地させる部品搭載工程と、部品搭載工程後の基板を加熱することにより接続用電極を前記電極に半田接合するとともに前記第１の樹脂を熱硬化させる加熱工程とを含み、前記第１の樹脂供給工程および第２の樹脂供給工程において部品搭載工程後の基板と電子部品との間に脱気用隙間が確保されるように第１の樹脂および第２の樹脂を供給することにより、前記加熱工程において基板から発生する気体を前記脱気用隙間から外部へ排出することを特徴とする電子部品実装方法。An electronic component mounting method for mounting an electronic component on a substrate by soldering a connection electrode provided on the electronic component to an electrode on the substrate, wherein the electronic component fixing point set on the upper surface of the substrate is thermosetting A first resin supply step of supplying the first resin, a second resin supply step of supplying a second resin having an oxide film removing ability to the connection electrode of the electronic component, and a second resin supply A component mounting step of mounting the electronic component after the process on the substrate after the first resin supply step and landing the connection electrode on the electrode of the substrate through the second resin, and a substrate after the component mounting step A heating step of soldering the connection electrode to the electrode by heating and heat-curing the first resin, and after the component mounting step in the first resin supply step and the second resin supply step Between PCB and electronic components By supplying the first resin and the second resin so as to ensure a deaeration gap, the gas generated from the substrate in the heating step is discharged to the outside from the deaeration gap. Electronic component mounting method. 前記第２の樹脂は熱硬化性樹脂であり、第２の樹脂が熱硬化することにより、電子部品の接続用電極と基板の電極との半田接合部を補強する樹脂補強部が形成されることを特徴とする請求項１記載の電子部品実装方法。The second resin is a thermosetting resin, and when the second resin is thermoset, a resin reinforcing portion that reinforces the solder joint between the connection electrode of the electronic component and the electrode of the substrate is formed. The electronic component mounting method according to claim 1 . 前記第２の樹脂は、半田接合用のフラックスであることを特徴とする請求項１記載の電子部品実装方法。The second resin, the electronic component mounting method according to claim 1, characterized in that it is a flux for solder bonding.
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