JP3660318B2 - 化学反応性研磨材 - Google Patents

化学反応性研磨材 Download PDF

Info

Publication number
JP3660318B2
JP3660318B2 JP2002061724A JP2002061724A JP3660318B2 JP 3660318 B2 JP3660318 B2 JP 3660318B2 JP 2002061724 A JP2002061724 A JP 2002061724A JP 2002061724 A JP2002061724 A JP 2002061724A JP 3660318 B2 JP3660318 B2 JP 3660318B2
Authority
JP
Japan
Prior art keywords
abrasive
silicon wafer
silicon
mica
fluorine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002061724A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003257902A (ja
Inventor
昭次郎 岡田
暢男 安永
Original Assignee
株式会社日本グレーン研究所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日本グレーン研究所 filed Critical 株式会社日本グレーン研究所
Priority to JP2002061724A priority Critical patent/JP3660318B2/ja
Priority to KR10-2002-0057061A priority patent/KR100491812B1/ko
Publication of JP2003257902A publication Critical patent/JP2003257902A/ja
Application granted granted Critical
Publication of JP3660318B2 publication Critical patent/JP3660318B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2002061724A 2002-03-07 2002-03-07 化学反応性研磨材 Expired - Fee Related JP3660318B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2002061724A JP3660318B2 (ja) 2002-03-07 2002-03-07 化学反応性研磨材
KR10-2002-0057061A KR100491812B1 (ko) 2002-03-07 2002-09-18 화학 반응성 연마재

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002061724A JP3660318B2 (ja) 2002-03-07 2002-03-07 化学反応性研磨材

Publications (2)

Publication Number Publication Date
JP2003257902A JP2003257902A (ja) 2003-09-12
JP3660318B2 true JP3660318B2 (ja) 2005-06-15

Family

ID=28670428

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002061724A Expired - Fee Related JP3660318B2 (ja) 2002-03-07 2002-03-07 化学反応性研磨材

Country Status (2)

Country Link
JP (1) JP3660318B2 (ko)
KR (1) KR100491812B1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007123759A (ja) * 2005-10-31 2007-05-17 Nitta Haas Inc 半導体研磨用組成物および研磨方法
JP5476666B2 (ja) * 2007-08-27 2014-04-23 学校法人早稲田大学 切削研削用組成物、切削研削油剤、切削研削用ホイール及び表面改質材
US9254544B2 (en) 2008-08-28 2016-02-09 Corning Incorporated Colloidal silica finishing of metal fluoride optical components

Also Published As

Publication number Publication date
JP2003257902A (ja) 2003-09-12
KR20030074073A (ko) 2003-09-19
KR100491812B1 (ko) 2005-05-27

Similar Documents

Publication Publication Date Title
JP5010675B2 (ja) 合成砥石
JP5283247B2 (ja) ガラス基板用研磨液組成物
JP2006186381A (ja) Ｃｍｐ生成物
JP4667848B2 (ja) ガラス基板用研磨液組成物
Tian et al. Effects of chemical slurries on fixed abrasive chemical-mechanical polishing of optical silicon substrates
EP1043378B1 (en) Molded abrasive product and polishing wheel using it
WO2015118927A1 (ja) 研磨用砥粒とその製造方法と研磨方法と研磨装置とスラリー
CN105817976A (zh) 一种纳米深度损伤层高效超精密磨削方法
CN113414705B (zh) 一种大尺寸双层柔性抛光垫及制备方法与应用
JP3668647B2 (ja) 半導体ウエハ基板の再生法および半導体ウエハ基板再生用研磨液
JP3660318B2 (ja) 化学反応性研磨材
JP6731701B2 (ja) 研磨用砥粒とその製造方法と研磨方法と研磨装置とスラリー
JP4573492B2 (ja) 合成砥石
SG187536A1 (en) Method for manufacturing glass substrate for magnetic disk, and method for manufacturing magnetic disk
CN115662877B (zh) 一种单晶硅表面清洗方法
JPH05156238A (ja) メカノケミカル研摩用研摩剤、および材料片を研摩する方法
CN108098569A (zh) 一种抛光蓝宝石晶片的内含钕化物软质磨料固着磨具及其制作方法
JP4557105B2 (ja) 研磨用組成物
KR100740558B1 (ko) 연마용 성형체 및 그것을 이용한 연마용 정반
JP2000053946A (ja) 研磨材組成物
WO2015115653A1 (ja) 磁気ディスク用基板の製造方法及び磁気ディスクの製造方法
JP2004261942A (ja) 研磨砥石
JPS63114866A (ja) ガラスの加工方法
KR20000047697A (ko) 연마용 성형체, 이것을 이용한 연마용 정반 및 연마방법
JP4159304B2 (ja) 研磨方法

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20040623

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20040928

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20050301

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20050316

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080325

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120325

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130325

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140325

Year of fee payment: 9

LAPS Cancellation because of no payment of annual fees