JP3655979B2 - 熱可塑性樹脂組成物 - Google Patents
熱可塑性樹脂組成物 Download PDFInfo
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- JP3655979B2 JP3655979B2 JP30404796A JP30404796A JP3655979B2 JP 3655979 B2 JP3655979 B2 JP 3655979B2 JP 30404796 A JP30404796 A JP 30404796A JP 30404796 A JP30404796 A JP 30404796A JP 3655979 B2 JP3655979 B2 JP 3655979B2
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- thermoplastic resin
- polymer
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- inorganic filler
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- HTDJPCNNEPUOOQ-UHFFFAOYSA-N hexamethylcyclotrisiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O1 HTDJPCNNEPUOOQ-UHFFFAOYSA-N 0.000 description 1
- 150000004677 hydrates Chemical class 0.000 description 1
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- 230000001771 impaired effect Effects 0.000 description 1
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- ADFPJHOAARPYLP-UHFFFAOYSA-N methyl 2-methylprop-2-enoate;styrene Chemical compound COC(=O)C(C)=C.C=CC1=CC=CC=C1 ADFPJHOAARPYLP-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
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- SEEYREPSKCQBBF-UHFFFAOYSA-N n-methylmaleimide Chemical compound CN1C(=O)C=CC1=O SEEYREPSKCQBBF-UHFFFAOYSA-N 0.000 description 1
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- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
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- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
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- AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical compound [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 description 1
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- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
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- IKXFIBBKEARMLL-UHFFFAOYSA-N triphenoxy(sulfanylidene)-$l^{5}-phosphane Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=S)OC1=CC=CC=C1 IKXFIBBKEARMLL-UHFFFAOYSA-N 0.000 description 1
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30404796A JP3655979B2 (ja) | 1996-10-30 | 1996-10-30 | 熱可塑性樹脂組成物 |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30404796A JP3655979B2 (ja) | 1996-10-30 | 1996-10-30 | 熱可塑性樹脂組成物 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003306733A Division JP2004002896A (ja) | 2003-08-29 | 2003-08-29 | ハウジング用熱可塑性樹脂組成物 |
| JP2003306734A Division JP2004002897A (ja) | 2003-08-29 | 2003-08-29 | トレー用熱可塑性樹脂組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH10130485A JPH10130485A (ja) | 1998-05-19 |
| JPH10130485A5 JPH10130485A5 (enExample) | 2004-09-09 |
| JP3655979B2 true JP3655979B2 (ja) | 2005-06-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP30404796A Expired - Lifetime JP3655979B2 (ja) | 1996-10-30 | 1996-10-30 | 熱可塑性樹脂組成物 |
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Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP4019508B2 (ja) * | 1998-07-17 | 2007-12-12 | 松下電工株式会社 | 電子部品封止用樹脂組成物およびその製造方法、ならびにこの電子部品封止用樹脂組成物を用いた封止電子部品 |
| ES2268878T3 (es) * | 1998-08-28 | 2007-03-16 | Teijin Chemicals, Ltd. | Una composicion de resina de policarbonato y articulo moldeado. |
| DE19856484A1 (de) * | 1998-12-08 | 2000-06-15 | Bayer Ag | Polycarbonat-Formmassen mit verbesserten mechanischen Eigenschaften |
| DE19962929A1 (de) * | 1999-12-24 | 2001-06-28 | Bayer Ag | Polycarbonat-Formmassen mit speziellem Talk |
| JP4870272B2 (ja) * | 2001-03-12 | 2012-02-08 | 出光興産株式会社 | レーザーマーキング用樹脂組成物及び成形品 |
| JP4936601B2 (ja) * | 2001-03-08 | 2012-05-23 | 出光興産株式会社 | レーザーマーキング用樹脂及び樹脂組成物並びに成形品 |
| JP4907776B2 (ja) * | 2001-03-28 | 2012-04-04 | 帝人化成株式会社 | 透明難燃性ポリカーボネート樹脂シートの製造方法 |
| JP5031949B2 (ja) * | 2001-03-29 | 2012-09-26 | 帝人化成株式会社 | 難燃性芳香族ポリカーボネート樹脂組成物 |
| TWI298341B (enExample) * | 2001-05-31 | 2008-07-01 | Mitsubishi Rayon Co | |
| JP2006336101A (ja) * | 2005-06-06 | 2006-12-14 | Polymatech Co Ltd | 金属調加飾樹脂成形体およびキーシート並びに金属調加飾樹脂成形体の製造方法 |
| JP5371393B2 (ja) * | 2008-11-27 | 2013-12-18 | ユーエムジー・エービーエス株式会社 | めっき用樹脂組成物、及び樹脂めっき製品 |
| CN103154135B (zh) * | 2011-03-18 | 2014-10-15 | 三菱化学欧洲合资公司 | 生产电路载体的方法 |
| US8933161B2 (en) | 2011-03-18 | 2015-01-13 | Mitsubishi Chemical Europe Gmbh | Thermoplastic resin composition, resin molded article, and method of manufacturing resin molded article with plated layer |
| JP5599914B1 (ja) * | 2013-05-13 | 2014-10-01 | 三菱エンジニアリングプラスチックス株式会社 | レーザーダイレクトストラクチャリング用樹脂組成物、樹脂成形品、およびメッキ層付樹脂成形品の製造方法 |
| JP5599928B1 (ja) * | 2013-10-07 | 2014-10-01 | 三菱エンジニアリングプラスチックス株式会社 | 樹脂組成物、樹脂成形品、および樹脂成形品の製造方法 |
| JP5599929B1 (ja) * | 2013-10-07 | 2014-10-01 | 三菱エンジニアリングプラスチックス株式会社 | 樹脂組成物、樹脂成形品、および樹脂成形品の製造方法 |
| WO2014185217A1 (ja) * | 2013-05-13 | 2014-11-20 | 三菱エンジニアリングプラスチックス株式会社 | レーザーダイレクトストラクチャリング用樹脂組成物、樹脂成形品、およびメッキ層付樹脂成形品の製造方法 |
| JP6413427B2 (ja) * | 2014-07-23 | 2018-10-31 | 日油株式会社 | Ｐｃ／ａｂｓ樹脂組成物およびその樹脂成形品 |
| JP6694657B2 (ja) * | 2015-12-22 | 2020-05-20 | 株式会社カネカ | ポリオルガノシロキサン粒子含有グラフト共重合体およびその熱可塑性樹脂組成物 |
| JP7779163B2 (ja) * | 2022-02-04 | 2025-12-03 | Ａｇｃ株式会社 | 組成物 |
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- 1996-10-30 JP JP30404796A patent/JP3655979B2/ja not_active Expired - Lifetime
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| JPH10130485A (ja) | 1998-05-19 |
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