JP3652278B2 - 半導体素子収納用パッケージおよび半導体装置 - Google Patents

半導体素子収納用パッケージおよび半導体装置 Download PDF

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Publication number
JP3652278B2
JP3652278B2 JP2001193744A JP2001193744A JP3652278B2 JP 3652278 B2 JP3652278 B2 JP 3652278B2 JP 2001193744 A JP2001193744 A JP 2001193744A JP 2001193744 A JP2001193744 A JP 2001193744A JP 3652278 B2 JP3652278 B2 JP 3652278B2
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Japan
Prior art keywords
line conductor
conductor layer
semiconductor element
circuit board
conductor
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Expired - Fee Related
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JP2001193744A
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Japanese (ja)
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JP2003007901A (ja
JP2003007901A5 (https=
Inventor
努 杉本
信幸 田中
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Kyocera Corp
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Kyocera Corp
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Priority to JP2001193744A priority Critical patent/JP3652278B2/ja
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Publication of JP3652278B2 publication Critical patent/JP3652278B2/ja
Publication of JP2003007901A5 publication Critical patent/JP2003007901A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Waveguides (AREA)
  • Non-Reversible Transmitting Devices (AREA)
JP2001193744A 2001-06-26 2001-06-26 半導体素子収納用パッケージおよび半導体装置 Expired - Fee Related JP3652278B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001193744A JP3652278B2 (ja) 2001-06-26 2001-06-26 半導体素子収納用パッケージおよび半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001193744A JP3652278B2 (ja) 2001-06-26 2001-06-26 半導体素子収納用パッケージおよび半導体装置

Publications (3)

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JP2003007901A JP2003007901A (ja) 2003-01-10
JP3652278B2 true JP3652278B2 (ja) 2005-05-25
JP2003007901A5 JP2003007901A5 (https=) 2005-08-11

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ID=19031968

Family Applications (1)

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JP2001193744A Expired - Fee Related JP3652278B2 (ja) 2001-06-26 2001-06-26 半導体素子収納用パッケージおよび半導体装置

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JP (1) JP3652278B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3690656B2 (ja) * 2001-04-20 2005-08-31 京セラ株式会社 半導体素子収納用パッケージおよび半導体装置
JP3720726B2 (ja) * 2001-04-20 2005-11-30 京セラ株式会社 半導体素子収納用パッケージおよび半導体装置
JP7666175B2 (ja) * 2021-06-30 2025-04-22 住友電気工業株式会社 半導体装置およびパッケージ

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Publication number Publication date
JP2003007901A (ja) 2003-01-10

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