JP2003007901A5 - - Google Patents

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Publication number
JP2003007901A5
JP2003007901A5 JP2001193744A JP2001193744A JP2003007901A5 JP 2003007901 A5 JP2003007901 A5 JP 2003007901A5 JP 2001193744 A JP2001193744 A JP 2001193744A JP 2001193744 A JP2001193744 A JP 2001193744A JP 2003007901 A5 JP2003007901 A5 JP 2003007901A5
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JP
Japan
Prior art keywords
circuit board
line conductor
semiconductor element
conductor layer
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001193744A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003007901A (ja
JP3652278B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2001193744A priority Critical patent/JP3652278B2/ja
Priority claimed from JP2001193744A external-priority patent/JP3652278B2/ja
Publication of JP2003007901A publication Critical patent/JP2003007901A/ja
Application granted granted Critical
Publication of JP3652278B2 publication Critical patent/JP3652278B2/ja
Publication of JP2003007901A5 publication Critical patent/JP2003007901A5/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2001193744A 2001-06-26 2001-06-26 半導体素子収納用パッケージおよび半導体装置 Expired - Fee Related JP3652278B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001193744A JP3652278B2 (ja) 2001-06-26 2001-06-26 半導体素子収納用パッケージおよび半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001193744A JP3652278B2 (ja) 2001-06-26 2001-06-26 半導体素子収納用パッケージおよび半導体装置

Publications (3)

Publication Number Publication Date
JP2003007901A JP2003007901A (ja) 2003-01-10
JP3652278B2 JP3652278B2 (ja) 2005-05-25
JP2003007901A5 true JP2003007901A5 (https=) 2005-08-11

Family

ID=19031968

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001193744A Expired - Fee Related JP3652278B2 (ja) 2001-06-26 2001-06-26 半導体素子収納用パッケージおよび半導体装置

Country Status (1)

Country Link
JP (1) JP3652278B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3690656B2 (ja) * 2001-04-20 2005-08-31 京セラ株式会社 半導体素子収納用パッケージおよび半導体装置
JP3720726B2 (ja) * 2001-04-20 2005-11-30 京セラ株式会社 半導体素子収納用パッケージおよび半導体装置
JP7666175B2 (ja) * 2021-06-30 2025-04-22 住友電気工業株式会社 半導体装置およびパッケージ

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