JP3603056B2 - 固体撮像装置及びその製造方法 - Google Patents

固体撮像装置及びその製造方法 Download PDF

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Publication number
JP3603056B2
JP3603056B2 JP2001210353A JP2001210353A JP3603056B2 JP 3603056 B2 JP3603056 B2 JP 3603056B2 JP 2001210353 A JP2001210353 A JP 2001210353A JP 2001210353 A JP2001210353 A JP 2001210353A JP 3603056 B2 JP3603056 B2 JP 3603056B2
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JP
Japan
Prior art keywords
solid
state imaging
imaging device
circuit board
back surface
Prior art date
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Expired - Fee Related
Application number
JP2001210353A
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English (en)
Japanese (ja)
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JP2003032557A (ja
Inventor
高 土屋
Original Assignee
美▲キ▼科技股▲フン▼有限公司
高 土屋
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美▲キ▼科技股▲フン▼有限公司, 高 土屋 filed Critical 美▲キ▼科技股▲フン▼有限公司
Priority to JP2001210353A priority Critical patent/JP3603056B2/ja
Priority to CN02140959A priority patent/CN1396763A/zh
Priority to TW091115396A priority patent/TW567717B/zh
Priority to KR1020020040251A priority patent/KR20030007117A/ko
Publication of JP2003032557A publication Critical patent/JP2003032557A/ja
Application granted granted Critical
Publication of JP3603056B2 publication Critical patent/JP3603056B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14634—Assemblies, i.e. Hybrid structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/1469—Assemblies, i.e. hybrid integration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
JP2001210353A 2001-07-11 2001-07-11 固体撮像装置及びその製造方法 Expired - Fee Related JP3603056B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2001210353A JP3603056B2 (ja) 2001-07-11 2001-07-11 固体撮像装置及びその製造方法
CN02140959A CN1396763A (zh) 2001-07-11 2002-07-11 固体摄像装置及其制造方法
TW091115396A TW567717B (en) 2001-07-11 2002-07-11 Solid-state camera device and its manufacture method
KR1020020040251A KR20030007117A (ko) 2001-07-11 2002-07-11 고체촬상장치 및 그 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001210353A JP3603056B2 (ja) 2001-07-11 2001-07-11 固体撮像装置及びその製造方法

Publications (2)

Publication Number Publication Date
JP2003032557A JP2003032557A (ja) 2003-01-31
JP3603056B2 true JP3603056B2 (ja) 2004-12-15

Family

ID=19045840

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001210353A Expired - Fee Related JP3603056B2 (ja) 2001-07-11 2001-07-11 固体撮像装置及びその製造方法

Country Status (4)

Country Link
JP (1) JP3603056B2 (ko)
KR (1) KR20030007117A (ko)
CN (1) CN1396763A (ko)
TW (1) TW567717B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7005310B2 (en) 2002-08-14 2006-02-28 Renesas Technology Corporation Manufacturing method of solid-state image sensing device
JP4204368B2 (ja) * 2003-03-28 2009-01-07 シャープ株式会社 光学装置用モジュール及び光学装置用モジュールの製造方法
JP4405208B2 (ja) 2003-08-25 2010-01-27 株式会社ルネサステクノロジ 固体撮像装置の製造方法
JP2006081008A (ja) * 2004-09-10 2006-03-23 Olympus Corp 光学機器
TW201104747A (en) * 2009-07-29 2011-02-01 Kingpak Tech Inc Image sensor package structure
WO2013118501A1 (ja) * 2012-02-07 2013-08-15 株式会社ニコン 撮像ユニットおよび撮像装置
US20130258474A1 (en) * 2012-04-03 2013-10-03 Cheng-Ta Chen Optoelectronic device with improved lens cap
CN107835354B (zh) * 2017-12-15 2020-12-18 信利光电股份有限公司 应用于电子设备的摄像模组及电子设备
CN107995398A (zh) * 2017-12-15 2018-05-04 信利光电股份有限公司 应用于电子设备的摄像模组及电子设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2843464B2 (ja) * 1992-09-01 1999-01-06 シャープ株式会社 固体撮像装置
JPH0961239A (ja) * 1995-08-29 1997-03-07 Kyocera Corp 光量検出部材およびこの光量検出部材を搭載した画像入力装置
JP3417225B2 (ja) * 1996-05-17 2003-06-16 ソニー株式会社 固体撮像装置とそれを用いたカメラ
KR19980034899U (ko) * 1996-12-11 1998-09-15 김광호 감시용 카메라

Also Published As

Publication number Publication date
CN1396763A (zh) 2003-02-12
TW567717B (en) 2003-12-21
KR20030007117A (ko) 2003-01-23
JP2003032557A (ja) 2003-01-31

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