JP3554534B2 - 半導体処理装置の基板支持機構及び基板交換方法、並びに半導体処理装置及び基板搬送装置 - Google Patents

半導体処理装置の基板支持機構及び基板交換方法、並びに半導体処理装置及び基板搬送装置 Download PDF

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Publication number
JP3554534B2
JP3554534B2 JP2000316685A JP2000316685A JP3554534B2 JP 3554534 B2 JP3554534 B2 JP 3554534B2 JP 2000316685 A JP2000316685 A JP 2000316685A JP 2000316685 A JP2000316685 A JP 2000316685A JP 3554534 B2 JP3554534 B2 JP 3554534B2
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Japan
Prior art keywords
substrate
support
substrates
transfer
mounting table
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Expired - Fee Related
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JP2000316685A
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English (en)
Japanese (ja)
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JP2001160584A5 (enExample
JP2001160584A (ja
Inventor
勤 広木
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2000316685A priority Critical patent/JP3554534B2/ja
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Publication of JP3554534B2 publication Critical patent/JP3554534B2/ja
Publication of JP2001160584A5 publication Critical patent/JP2001160584A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
JP2000316685A 1995-12-12 2000-10-17 半導体処理装置の基板支持機構及び基板交換方法、並びに半導体処理装置及び基板搬送装置 Expired - Fee Related JP3554534B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000316685A JP3554534B2 (ja) 1995-12-12 2000-10-17 半導体処理装置の基板支持機構及び基板交換方法、並びに半導体処理装置及び基板搬送装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP7-323094 1995-12-12
JP32309495 1995-12-12
JP2000316685A JP3554534B2 (ja) 1995-12-12 2000-10-17 半導体処理装置の基板支持機構及び基板交換方法、並びに半導体処理装置及び基板搬送装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP31342096A Division JP3650495B2 (ja) 1995-12-12 1996-11-25 半導体処理装置、その基板交換機構及び基板交換方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2004062576A Division JP3816929B2 (ja) 1995-12-12 2004-03-05 半導体処理装置

Publications (3)

Publication Number Publication Date
JP2001160584A JP2001160584A (ja) 2001-06-12
JP3554534B2 true JP3554534B2 (ja) 2004-08-18
JP2001160584A5 JP2001160584A5 (enExample) 2004-10-28

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000316685A Expired - Fee Related JP3554534B2 (ja) 1995-12-12 2000-10-17 半導体処理装置の基板支持機構及び基板交換方法、並びに半導体処理装置及び基板搬送装置

Country Status (1)

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JP (1) JP3554534B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100980024B1 (ko) * 2003-06-19 2010-09-03 삼성전자주식회사 기판지지장치
JP4908771B2 (ja) * 2005-04-27 2012-04-04 東京エレクトロン株式会社 処理装置システム
KR20100031681A (ko) 2007-05-18 2010-03-24 브룩스 오토메이션 인코퍼레이티드 빠른 교환 로봇을 가진 컴팩트 기판 운송 시스템
KR101226954B1 (ko) * 2008-08-06 2013-01-28 세메스 주식회사 기판 처리장치 및 이의 기판 이송 방법
JP5037551B2 (ja) 2009-03-24 2012-09-26 東京エレクトロン株式会社 基板交換機構及び基板交換方法
JP4707749B2 (ja) * 2009-04-01 2011-06-22 東京エレクトロン株式会社 基板交換方法及び基板処理装置
WO2019038902A1 (ja) * 2017-08-25 2019-02-28 株式会社日本製鋼所 レーザ照射装置
TWI808489B (zh) * 2020-09-18 2023-07-11 日商斯庫林集團股份有限公司 基板處理裝置及基板處理方法
JP7573403B2 (ja) * 2020-10-06 2024-10-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

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JP2001160584A (ja) 2001-06-12

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