JP3376731B2 - 高周波用のプリント基板及びこれを用いたプローブカード - Google Patents

高周波用のプリント基板及びこれを用いたプローブカード

Info

Publication number
JP3376731B2
JP3376731B2 JP30025994A JP30025994A JP3376731B2 JP 3376731 B2 JP3376731 B2 JP 3376731B2 JP 30025994 A JP30025994 A JP 30025994A JP 30025994 A JP30025994 A JP 30025994A JP 3376731 B2 JP3376731 B2 JP 3376731B2
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
insulating material
material layer
high frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP30025994A
Other languages
English (en)
Japanese (ja)
Other versions
JPH08136582A (ja
Inventor
國夫 佐野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP30025994A priority Critical patent/JP3376731B2/ja
Priority to US08/555,286 priority patent/US5748006A/en
Priority to KR1019950040537A priority patent/KR100373155B1/ko
Priority to TW084112242A priority patent/TW285814B/zh
Publication of JPH08136582A publication Critical patent/JPH08136582A/ja
Application granted granted Critical
Publication of JP3376731B2 publication Critical patent/JP3376731B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
JP30025994A 1994-11-09 1994-11-09 高周波用のプリント基板及びこれを用いたプローブカード Expired - Fee Related JP3376731B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP30025994A JP3376731B2 (ja) 1994-11-09 1994-11-09 高周波用のプリント基板及びこれを用いたプローブカード
US08/555,286 US5748006A (en) 1994-11-09 1995-11-08 High-frequency-transmission printed wiring board, probe card, and probe apparatus
KR1019950040537A KR100373155B1 (ko) 1994-11-09 1995-11-09 고주파용의프린트배선판,프로우브카드및프로우브장치
TW084112242A TW285814B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1994-11-09 1995-11-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30025994A JP3376731B2 (ja) 1994-11-09 1994-11-09 高周波用のプリント基板及びこれを用いたプローブカード

Publications (2)

Publication Number Publication Date
JPH08136582A JPH08136582A (ja) 1996-05-31
JP3376731B2 true JP3376731B2 (ja) 2003-02-10

Family

ID=17882638

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30025994A Expired - Fee Related JP3376731B2 (ja) 1994-11-09 1994-11-09 高周波用のプリント基板及びこれを用いたプローブカード

Country Status (4)

Country Link
US (1) US5748006A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP3376731B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR100373155B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW (1) TW285814B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11344510A (ja) * 1998-06-02 1999-12-14 Advantest Corp プローブカード、プローブ及び半導体試験装置
JP2000088920A (ja) * 1998-09-08 2000-03-31 Hitachi Electronics Eng Co Ltd 検査装置用インターフェイスユニット
FR2790096B1 (fr) * 1999-02-18 2001-04-13 St Microelectronics Sa Structure etalon elementaire a faibles pertes pour l'etalonnage d'une sonde de circuit integre
FR2790097B1 (fr) * 1999-02-18 2001-04-27 St Microelectronics Sa Procede d'etalonnage d'une sonde de circuit integre rf
JP4388620B2 (ja) * 1999-04-16 2009-12-24 株式会社アドバンテスト プローブカード及びプローブカード製造方法
US6801869B2 (en) * 2000-02-22 2004-10-05 Mccord Don Method and system for wafer and device-level testing of an integrated circuit
JP2002094195A (ja) * 2000-09-12 2002-03-29 Sony Corp 信号配線基板及び信号配線基板の製造方法
US6927591B2 (en) * 2000-09-22 2005-08-09 Mccord Don Method and system for wafer and device level testing of an integrated circuit
US7024947B2 (en) * 2002-03-07 2006-04-11 Alps Electric Co., Ltd. Detection device including circuit component
US7102367B2 (en) * 2002-07-23 2006-09-05 Fujitsu Limited Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereof
US6994897B2 (en) * 2002-11-15 2006-02-07 General Electric Company Method of processing high-resolution flex circuits with low distortion
EP2012131A4 (en) * 2006-04-21 2012-11-28 Nat Inst Of Advanced Ind Scien CONTACT PROBE AND METHOD FOR MANUFACTURING THE SAME
US7683645B2 (en) * 2006-07-06 2010-03-23 Mpi Corporation High-frequency probe card and transmission line for high-frequency probe card
CN101266262B (zh) * 2007-03-13 2010-09-01 旺矽科技股份有限公司 高速测试卡
JP2012233723A (ja) * 2011-04-28 2012-11-29 Micronics Japan Co Ltd プローブ装置及びプローブユニット
GB2545496B (en) 2015-12-18 2020-06-03 Teraview Ltd A Test System
CN108352363B (zh) * 2016-01-27 2022-01-21 京瓷株式会社 布线基板、光半导体元件封装体以及光半导体装置
TWI620940B (zh) * 2016-11-14 2018-04-11 旺矽科技股份有限公司 探針卡及其多重訊號傳輸板
TWI705255B (zh) * 2019-09-20 2020-09-21 中華精測科技股份有限公司 用於檢測晶片的測試裝置
NL2024052B1 (en) * 2019-10-18 2021-06-22 Delft Circuits B V Flexible transmission line for communication with cryogenic circuits
TWI750912B (zh) * 2020-11-20 2021-12-21 萬旭電業股份有限公司 高頻量測線結構

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4757256A (en) * 1985-05-10 1988-07-12 Micro-Probe, Inc. High density probe card
US4891612A (en) * 1988-11-04 1990-01-02 Cascade Microtech, Inc. Overlap interfaces between coplanar transmission lines which are tolerant to transverse and longitudinal misalignment
US5003273A (en) * 1989-12-04 1991-03-26 Itt Corporation Multilayer printed circuit board with pseudo-coaxial transmission lines
US5148103A (en) * 1990-10-31 1992-09-15 Hughes Aircraft Company Apparatus for testing integrated circuits
US5225037A (en) * 1991-06-04 1993-07-06 Texas Instruments Incorporated Method for fabrication of probe card for testing of semiconductor devices
US5311406A (en) * 1991-10-30 1994-05-10 Honeywell Inc. Microstrip printed wiring board and a method for making same
JP2963603B2 (ja) * 1993-05-31 1999-10-18 東京エレクトロン株式会社 プローブ装置のアライメント方法

Also Published As

Publication number Publication date
KR100373155B1 (ko) 2003-05-01
US5748006A (en) 1998-05-05
TW285814B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1996-09-11
JPH08136582A (ja) 1996-05-31
KR960018607A (ko) 1996-06-17

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