JP3323601B2 - 工作物を真空雰囲気で搬送するためのチャンバ、複合チャンバ、及び工作物を真空設備内部で搬送する方法 - Google Patents

工作物を真空雰囲気で搬送するためのチャンバ、複合チャンバ、及び工作物を真空設備内部で搬送する方法

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Publication number
JP3323601B2
JP3323601B2 JP25038793A JP25038793A JP3323601B2 JP 3323601 B2 JP3323601 B2 JP 3323601B2 JP 25038793 A JP25038793 A JP 25038793A JP 25038793 A JP25038793 A JP 25038793A JP 3323601 B2 JP3323601 B2 JP 3323601B2
Authority
JP
Japan
Prior art keywords
chamber
workpiece
axis
opening
transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP25038793A
Other languages
English (en)
Japanese (ja)
Other versions
JPH06267069A (ja
Inventor
シェルトラー ロマン
Original Assignee
ウンアクシス バルツェルス アクチェンゲゼルシャフト
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Publication date
Application filed by ウンアクシス バルツェルス アクチェンゲゼルシャフト filed Critical ウンアクシス バルツェルス アクチェンゲゼルシャフト
Publication of JPH06267069A publication Critical patent/JPH06267069A/ja
Application granted granted Critical
Publication of JP3323601B2 publication Critical patent/JP3323601B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Automatic Assembly (AREA)
  • Manufacturing Optical Record Carriers (AREA)
JP25038793A 1992-10-06 1993-10-06 工作物を真空雰囲気で搬送するためのチャンバ、複合チャンバ、及び工作物を真空設備内部で搬送する方法 Expired - Fee Related JP3323601B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH03121/92-4 1992-10-06
CH03121/92A CH691377A5 (de) 1992-10-06 1992-10-06 Kammeranordnung für den Transport von Werkstücken und deren Verwendung.

Publications (2)

Publication Number Publication Date
JPH06267069A JPH06267069A (ja) 1994-09-22
JP3323601B2 true JP3323601B2 (ja) 2002-09-09

Family

ID=4249064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25038793A Expired - Fee Related JP3323601B2 (ja) 1992-10-06 1993-10-06 工作物を真空雰囲気で搬送するためのチャンバ、複合チャンバ、及び工作物を真空設備内部で搬送する方法

Country Status (6)

Country Link
US (1) US6818108B2 (OSRAM)
JP (1) JP3323601B2 (OSRAM)
KR (1) KR940009030A (OSRAM)
CH (1) CH691377A5 (OSRAM)
FR (1) FR2696428A1 (OSRAM)
GB (2) GB2296698B (OSRAM)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI874121A7 (fi) * 1986-09-24 1988-03-25 Sumitomo Chemical Co Heterocykliska foereningar, och deras framstaellning och anvaendning.
US6264804B1 (en) 2000-04-12 2001-07-24 Ske Technology Corp. System and method for handling and masking a substrate in a sputter deposition system
US6413381B1 (en) 2000-04-12 2002-07-02 Steag Hamatech Ag Horizontal sputtering system
US8408858B2 (en) * 2007-08-30 2013-04-02 Ascentool International Limited Substrate processing system having improved substrate transport system
US7806641B2 (en) * 2007-08-30 2010-10-05 Ascentool, Inc. Substrate processing system having improved substrate transport system
KR102103477B1 (ko) * 2009-03-18 2020-06-01 에바텍 아크티엔게젤샤프트 진공처리 장치
DE102009037290A1 (de) * 2009-04-24 2010-11-11 Singulus Technologies Ag Transporteinrichtung mit einem auslenkbaren Dichtrahmen
US8567340B2 (en) * 2009-08-12 2013-10-29 Abbott Cardiovascular Systems Inc. System and method for coating a medical device
EP2445003A1 (en) * 2010-10-25 2012-04-25 Applied Materials, Inc. Apparatus for providing a rotation carrier magazine, and method of operating thereof

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3968885A (en) 1973-06-29 1976-07-13 International Business Machines Corporation Method and apparatus for handling workpieces
JPS5350224Y2 (OSRAM) 1973-09-25 1978-12-01
CH573985A5 (OSRAM) * 1973-11-22 1976-03-31 Balzers Patent Beteilig Ag
GB2054345B (en) 1979-06-19 1984-02-22 Peanuts Ltd Q Fluidised bed
US4433951A (en) * 1981-02-13 1984-02-28 Lam Research Corporation Modular loadlock
JPS6052574A (ja) * 1983-09-02 1985-03-25 Hitachi Ltd 連続スパツタ装置
DE3716498C2 (de) 1987-05-16 1994-08-04 Leybold Ag Vorrichtung zum Ein- und Ausschleusen von Werkstücken in eine Beschichtungskammer
US4851101A (en) * 1987-09-18 1989-07-25 Varian Associates, Inc. Sputter module for modular wafer processing machine
DE3912295C2 (de) * 1989-04-14 1997-05-28 Leybold Ag Katodenzerstäubungsanlage
JPH03109727A (ja) * 1989-09-25 1991-05-09 Fujitsu Ltd 半導体製造装置
DE4110490C2 (de) * 1991-03-30 2002-02-28 Unaxis Deutschland Holding Kathodenzerstäubungsanlage
DE4117969C2 (de) * 1991-05-31 2000-11-09 Balzers Ag Liechtenstein Vakuumkammer
EP1179611B1 (de) * 1992-10-06 2004-09-15 Unaxis Balzers Aktiengesellschaft Kammer für den Transport von Werkstücken
CH686445A5 (de) * 1992-10-06 1996-03-29 Balzers Hochvakuum Kammer und Kammerkombination fuer eine Vakuumanlage und Verfahren zum Durchreichen mindestens eines Werkstueckes.
JP3109727B2 (ja) 1997-04-28 2000-11-20 セイコーエプソン株式会社 文字処理方法及び文字処理装置

Also Published As

Publication number Publication date
GB2296698A (en) 1996-07-10
KR940009030A (ko) 1994-05-16
GB9604252D0 (en) 1996-05-01
FR2696428B1 (OSRAM) 1997-02-21
GB9320452D0 (en) 1993-11-24
JPH06267069A (ja) 1994-09-22
US20030106789A1 (en) 2003-06-12
FR2696428A1 (fr) 1994-04-08
CH691377A5 (de) 2001-07-13
US6818108B2 (en) 2004-11-16
GB2296698B (en) 1996-12-18
GB2271332B (en) 1996-12-18
GB2271332A (en) 1994-04-13

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