JP3140605U - 放熱フィンを備えた柱形状放熱器 - Google Patents
放熱フィンを備えた柱形状放熱器 Download PDFInfo
- Publication number
- JP3140605U JP3140605U JP2008000251U JP2008000251U JP3140605U JP 3140605 U JP3140605 U JP 3140605U JP 2008000251 U JP2008000251 U JP 2008000251U JP 2008000251 U JP2008000251 U JP 2008000251U JP 3140605 U JP3140605 U JP 3140605U
- Authority
- JP
- Japan
- Prior art keywords
- column
- base plate
- radiating
- heat
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005855 radiation Effects 0.000 claims abstract description 102
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 4
- 230000001788 irregular Effects 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 35
- 230000000694 effects Effects 0.000 abstract description 13
- 238000010586 diagram Methods 0.000 description 13
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW096147379A TW200926945A (en) | 2007-12-12 | 2007-12-12 | Cylindrical heat dissipater equipped with cooling fins |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP3140605U true JP3140605U (ja) | 2008-04-03 |
Family
ID=39326888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008000251U Expired - Fee Related JP3140605U (ja) | 2007-12-12 | 2008-01-21 | 放熱フィンを備えた柱形状放熱器 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20090151900A1 (enrdf_load_stackoverflow) |
| JP (1) | JP3140605U (enrdf_load_stackoverflow) |
| DE (1) | DE202008002041U1 (enrdf_load_stackoverflow) |
| TW (1) | TW200926945A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011038702A (ja) * | 2009-08-11 | 2011-02-24 | 崇賢 ▲黄▼ | 排熱効率を増進する排熱器 |
| JP2014045136A (ja) * | 2012-08-28 | 2014-03-13 | Mitsubishi Electric Corp | 発熱体と放熱体との接合体 |
| JP2019192780A (ja) * | 2018-04-25 | 2019-10-31 | かがつう株式会社 | ヒートシンク及び電子部品パッケージ並びにヒートシンクの製造方法 |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200919160A (en) * | 2007-10-26 | 2009-05-01 | Delta Electronics Inc | Heat dissipation module and base and manufacturing method thereof |
| TW200942145A (en) * | 2008-03-20 | 2009-10-01 | Jun-Guang Luo | Heat-dissipating device with multiple heat sources |
| US20090255658A1 (en) * | 2008-04-10 | 2009-10-15 | Asia Vital Components Co., Ltd. | Heat dissipation module |
| CN101852564A (zh) * | 2009-03-30 | 2010-10-06 | 富准精密工业(深圳)有限公司 | 散热装置 |
| CN101909415A (zh) * | 2009-06-02 | 2010-12-08 | 鸿富锦精密工业（深圳）有限公司 | 散热装置及其固定支架 |
| CN201518567U (zh) * | 2009-08-26 | 2010-06-30 | 富准精密工业(深圳)有限公司 | 散热模组 |
| US20110085304A1 (en) * | 2009-10-14 | 2011-04-14 | Irvine Sensors Corporation | Thermal management device comprising thermally conductive heat spreader with electrically isolated through-hole vias |
| US10103089B2 (en) * | 2010-03-26 | 2018-10-16 | Hamilton Sundstrand Corporation | Heat transfer device with fins defining air flow channels |
| USD662897S1 (en) * | 2011-01-04 | 2012-07-03 | Technicolor S.A. | Heat sink |
| USD678852S1 (en) * | 2011-11-01 | 2013-03-26 | Astral Pool Australia Pty Ltd | Heat sink |
| US20150216079A1 (en) * | 2012-09-28 | 2015-07-30 | Hitachi, Ltd. | Cooling system and electric apparatus using the same |
| US9627599B2 (en) | 2013-07-08 | 2017-04-18 | Lg Electronics Inc. | LED lighting apparatus and heat dissipation module |
| KR20150009039A (ko) | 2013-07-10 | 2015-01-26 | 엘지전자 주식회사 | 엘이디 조명기구 및 그 제조방법 |
| USD822625S1 (en) * | 2016-04-26 | 2018-07-10 | Showa Denko K.K. | Fin for heat exchanger |
| US9913411B2 (en) * | 2016-04-27 | 2018-03-06 | General Electric Company | Thermal capacitance system |
| JP6692417B2 (ja) * | 2016-05-10 | 2020-05-13 | 三菱電機株式会社 | ヒートシンク |
| US9831153B1 (en) | 2016-12-09 | 2017-11-28 | Metal Industries Research & Development Centre | Heat dissipating device |
| CN108925102B (zh) * | 2018-06-22 | 2024-05-10 | 江苏英杰铝业有限公司 | 一种高性能铝板散热器 |
| CN108717938B (zh) * | 2018-07-16 | 2024-08-02 | 上海克拉索富电子有限公司 | 一种风机调速模块辐射式散热结构 |
| US20200236806A1 (en) * | 2019-01-18 | 2020-07-23 | United Arab Emirates University | Heat sink with internal chamber for phase change material |
| US11260953B2 (en) | 2019-11-15 | 2022-03-01 | General Electric Company | System and method for cooling a leading edge of a high speed vehicle |
| US11427330B2 (en) | 2019-11-15 | 2022-08-30 | General Electric Company | System and method for cooling a leading edge of a high speed vehicle |
| US11260976B2 (en) | 2019-11-15 | 2022-03-01 | General Electric Company | System for reducing thermal stresses in a leading edge of a high speed vehicle |
| US11352120B2 (en) | 2019-11-15 | 2022-06-07 | General Electric Company | System and method for cooling a leading edge of a high speed vehicle |
| US11267551B2 (en) | 2019-11-15 | 2022-03-08 | General Electric Company | System and method for cooling a leading edge of a high speed vehicle |
| CN112332588B (zh) * | 2020-10-26 | 2022-12-27 | 中车大连机车研究所有限公司 | 一种电机端盖散热器 |
| US11745847B2 (en) | 2020-12-08 | 2023-09-05 | General Electric Company | System and method for cooling a leading edge of a high speed vehicle |
| US11407488B2 (en) | 2020-12-14 | 2022-08-09 | General Electric Company | System and method for cooling a leading edge of a high speed vehicle |
| US11577817B2 (en) | 2021-02-11 | 2023-02-14 | General Electric Company | System and method for cooling a leading edge of a high speed vehicle |
| JP7574734B2 (ja) * | 2021-05-10 | 2024-10-29 | 日本軽金属株式会社 | ヒートシンク及びヒートシンクの製造方法 |
| US20240237277A9 (en) * | 2022-10-24 | 2024-07-11 | Strategic Thermal Labs, Llc | Stacked-fin cold plate with a 3d vapor chamber |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05243441A (ja) * | 1992-03-03 | 1993-09-21 | Ito Gijutsu Kenkiyuushitsu:Kk | 放熱装置 |
| US5784255A (en) * | 1995-12-04 | 1998-07-21 | Integrated Device Technology, Inc. | Device and method for convective cooling of an electronic component |
| EP0889524A3 (en) * | 1997-06-30 | 1999-03-03 | Sun Microsystems, Inc. | Scalable and modular heat sink-heat pipe cooling system |
| US6125920A (en) * | 1997-10-16 | 2000-10-03 | Herbert; Edward | Fan with heat sink using stamped heat sink fins |
| US6163073A (en) * | 1998-04-17 | 2000-12-19 | International Business Machines Corporation | Integrated heatsink and heatpipe |
| US5926370A (en) * | 1998-10-29 | 1999-07-20 | Hewlett-Packard Company | Method and apparatus for a modular integrated apparatus for multi-function components |
| TW539393U (en) * | 2000-03-15 | 2003-06-21 | Tw | 089204149 |
| US6550529B1 (en) * | 2002-04-17 | 2003-04-22 | Sunonwealth Electric Machine Industry Co., Ltd. | Heatsink device |
| US6830098B1 (en) * | 2002-06-14 | 2004-12-14 | Thermal Corp. | Heat pipe fin stack with extruded base |
| US6625021B1 (en) * | 2002-07-22 | 2003-09-23 | Intel Corporation | Heat sink with heat pipes and fan |
| TW587902U (en) * | 2002-07-26 | 2004-05-11 | Hon Hai Prec Ind Co Ltd | Heat sink |
| JP2004125381A (ja) * | 2002-08-02 | 2004-04-22 | Mitsubishi Alum Co Ltd | ヒートパイプユニット及びヒートパイプ冷却器 |
| TW553371U (en) * | 2002-12-02 | 2003-09-11 | Tai Sol Electronics Co Ltd | Liquid/vapor phase heat dissipation apparatus |
| TW557350B (en) * | 2003-01-06 | 2003-10-11 | Jiun-Guang Luo | One-way airstream hollow cavity energy transferring device |
| US7106589B2 (en) * | 2003-12-23 | 2006-09-12 | Aall Power Heatsinks, Inc. | Heat sink, assembly, and method of making |
| US6945318B2 (en) * | 2004-01-26 | 2005-09-20 | Giga-Byte Technology Co., Ltd. | Heat-dissipating device |
| TWM259945U (en) * | 2004-07-23 | 2005-03-21 | Inventec Corp | Heat sink with fluid medium |
| US7227752B2 (en) * | 2005-05-23 | 2007-06-05 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
| TW200743945A (en) * | 2006-05-19 | 2007-12-01 | Foxconn Tech Co Ltd | Heat dissipation apparatus |
| US7694718B2 (en) * | 2006-10-02 | 2010-04-13 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink with heat pipes |
| TWM319519U (en) * | 2007-04-25 | 2007-09-21 | Acpa Energy Conversion Devices | Heat sink for multi-layer thermal-conducting plate of light-emitting diode |
-
2007
- 2007-12-12 TW TW096147379A patent/TW200926945A/zh unknown
-
2008
- 2008-01-21 JP JP2008000251U patent/JP3140605U/ja not_active Expired - Fee Related
- 2008-01-22 US US12/018,187 patent/US20090151900A1/en not_active Abandoned
- 2008-02-14 DE DE202008002041U patent/DE202008002041U1/de not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011038702A (ja) * | 2009-08-11 | 2011-02-24 | 崇賢 ▲黄▼ | 排熱効率を増進する排熱器 |
| JP2014045136A (ja) * | 2012-08-28 | 2014-03-13 | Mitsubishi Electric Corp | 発熱体と放熱体との接合体 |
| JP2019192780A (ja) * | 2018-04-25 | 2019-10-31 | かがつう株式会社 | ヒートシンク及び電子部品パッケージ並びにヒートシンクの製造方法 |
| JP7022426B2 (ja) | 2018-04-25 | 2022-02-18 | かがつう株式会社 | ヒートシンク及び電子部品パッケージ並びにヒートシンクの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20090151900A1 (en) | 2009-06-18 |
| DE202008002041U1 (de) | 2008-04-24 |
| TW200926945A (en) | 2009-06-16 |
| TWI411383B (enrdf_load_stackoverflow) | 2013-10-01 |
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