US20090151900A1 - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
US20090151900A1
US20090151900A1 US12/018,187 US1818708A US2009151900A1 US 20090151900 A1 US20090151900 A1 US 20090151900A1 US 1818708 A US1818708 A US 1818708A US 2009151900 A1 US2009151900 A1 US 2009151900A1
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US
United States
Prior art keywords
heat dissipation
mounting
radiation fins
heat sink
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/018,187
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English (en)
Inventor
Tsung-Hsien Huang
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Individual
Original Assignee
Individual
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Publication date
Application filed by Individual filed Critical Individual
Publication of US20090151900A1 publication Critical patent/US20090151900A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat sink for dissipation of heat from a semiconductor heat source and more particularly to a heat sink, which comprises a base panel having upright heat dissipation columns, and radiation fins with mounting through holes mounted on the heat dissipation columns at different elevations.
  • the base panel of the heat sink may be provided with a fan and/or heat pipes to enhance heat dissipation efficiency.
  • Conventional heat sinks are commonly comprised of a flat base panel and a plurality of radiation fins directly bonded to the base panel. Heat pipes may be bonded to the base panel to enhance heat dissipation performance.
  • the base panel and the radiation fins are commonly extruded from aluminum or copper.
  • the radiation fins are arranged on the base panel and spaced from one another at a distance.
  • the base panel transfers heat energy from the semiconductor heat source to which the heat sink is attached to the radiation fins for dissipation into the outside open air.
  • the heat sink comprises a thermal conductive base panel and radiation fins.
  • the base panel has a plurality of heat dissipation columns perpendicularly upwardly extending from the top wall.
  • the radiation fins are mounted on the heat dissipation columns at different elevations.
  • Each radiation fin has a plurality of mounting through holes respectively press-fitted onto the heat dissipation columns.
  • the number of the radiation fins can be adjusted subject to different heat dissipation requirements.
  • the number of the radiation fins is increased.
  • the number of the radiation fins is reduced.
  • the heat dissipation columns and the mounting through holes of the radiation fins are made in any of a variety of shapes, for example, rectangular, circular, cross-shaped, hexagonal, triangular or elongated rectangular cross section.
  • the heat dissipation columns are stepped columns, and the size of the mounting through holes of the radiation fins is relatively modified to fit the stepped columns.
  • the base panel is extruded from aluminum or copper, and the bottom wall of the base panel is mounted with a metal block that has a relatively higher heat transfer coefficient.
  • the mounting through holes of the radiation fins are stepped mounting through holes such that the flanges that extend around each stepped mounting through hole of one radiation fin can be fitted into the stepped mounting through holes of another radiation fin.
  • each heat dissipation column is chamfered in a taperedly chamfered form, convexly chamfered form or concavely chamfered form.
  • the chambered foot of each heat dissipation column facilitates transfer of heat energy from the base panel to the body of the respective heat dissipation column and then to the radiation fins.
  • the chambered top end of each heat dissipation column facilitates insertion of the heat dissipation columns into the mounting through holes of the radiation fins.
  • the base panel has a fan mounting region (either at one side or at the center) for the mounting of a fan that is controlled to cause currents of air toward the heat dissipation columns and the radiation fins.
  • heat pipes may be fastened to the base panel and the radiation fins to enhance heat dissipation performance.
  • the heat pipes can be directly press-fitted in bottom pipe grooves on the bottom wall of the base panel.
  • FIG. 1 is an exploded view of a heat sink in accordance with one embodiment of the present invention.
  • FIG. 2 is an elevational assembly view of the heat sink shown in FIG. 1 .
  • FIG. 3 is an elevational assembly view of a heat sink in accordance with another embodiment of the present invention.
  • FIG. 4 is a schematic top view of a part of the heat sink shown in FIG. 3 .
  • FIGS. 5 ⁇ 9 illustrate matching of radiation fins with different configurations of heat dissipation columns according to the present invention.
  • FIGS. 10 ⁇ 12 illustrate different shapes of the roots of the heat dissipation columns according to the present invention.
  • FIG. 13 is a side plan view of one embodiment of the heat sink according to the present invention.
  • FIG. 14 is a schematic drawing of the present invention, showing a bi-metal design of the base panel of the heat sink.
  • FIG. 15 is a schematic drawing of the present invention, showing different heights of heat dissipation columns matched with different sizes of radiation fins.
  • FIG. 16 is a schematic drawing of the present invention, showing stepped form of heat dissipation columns matched with different sizes of radiation fins.
  • FIG. 17 is a schematic drawing of the present invention, showing the radiation fins provided with stepped mounting through holes.
  • FIGS. 18 ⁇ 21 illustrate the top ends of the heat dissipation columns of the base panel of the heat sink chamfered differently according to the present invention.
  • FIG. 22 is an oblique elevation, showing a fan mounted on the top wall of the base panel beyond the area of the heat dissipation columns and the radiation fins according to the present invention.
  • FIG. 23 illustrates another form of heat sink equipped with a fan on the base panel according to the present invention.
  • FIG. 24 is an elevational view of a rectangular heat sink with a fan mounted on the base panel at the center and surrounded by the radiation fins according to the present invention.
  • FIG. 25 is an elevational view of a circular heat sink with a fan mounted on the base panel at the center and surrounded by the radiation fins according to the present invention.
  • FIG. 26 is a schematic top view of a rectangular heat sink with heat pipes installed in the base panel and extended through the radiation fins.
  • FIG. 27 is a sectional view taken along line A-A of FIG. 26 .
  • FIG. 28 is a sectional view taken along line B-B of FIG. 26 .
  • a heat sink in accordance with the present invention comprises a base panel 1 and a plurality of radiation fins 2 .
  • the base panel 1 is a flat metal member made of an excellent heat conduction metal material (for example, aluminum or copper, i.e., the so-called aluminum base or copper base), having a plurality of heat dissipation columns 11 perpendicularly upwardly extending from its top wall.
  • the heat dissipation columns 11 are arranged on the top side of the base panel 1 either in a regular or irregular manner. According to this embodiment, the heat dissipation columns 11 are arranged in an array.
  • the radiation fins 2 have mounting through holes 21 respectively and tightly fastened to the heat dissipation columns 11 in such a manner that the radiation fins 2 are firmly supported on the heat dissipation columns 11 at different elevations in a parallel manner.
  • the base panel 1 By tightly fastening the mounting through holes 21 of the radiation fins 2 to the heat dissipation columns 11 of the base panel 1 to constitute the heat sink, the base panel 1 absorbs heat energy from the attached semiconductor heat source (not shown) for quick dissipation into the outside open air through the radiation fins 2 via the heat dissipation columns 11 .
  • the heat dissipation columns 11 are press-fitted into the mounting through holes 21 of each radiation fin 2 .
  • the diameter of the mounting through holes 21 of the radiation fins 2 is slightly smaller than the diameter of the heat dissipation columns 11 so that the heat dissipation columns 11 can be tightly fitted into the mounting through holes 21 of each radiation fin 2 .
  • the number of the radiation fins 2 is determined according to the heat dissipation power required. When a relatively higher heat dissipation power is required, the number of the radiation fins 2 is increased. On the contrary, when a relatively lower heat dissipation power is required, the number of the radiation fins 2 is reduced. This arrangement fits different heat dissipation requirements for different applications, therefore it is able to provide the optimal heat dissipation effect while simplifying the structure and saving the cost.
  • the heat dissipation columns 11 and the mounting through holes 21 of the radiation fins 2 There is no special limitation on the shape of the heat dissipation columns 11 and the mounting through holes 21 of the radiation fins 2 .
  • the heat dissipation columns 11 a and the mounting through holes 21 a of the radiation fins 2 a have a cross-shaped cross section.
  • the heat dissipation columns 11 b and the mounting through holes 21 b of the radiation fins 2 b have a rectangular cross section.
  • the heat dissipation columns 11 c and the mounting through holes 21 c of the radiation fins 2 c have a circular cross section.
  • the heat dissipation columns 11 d and the mounting through holes 21 d of the radiation fins 2 d have a hexagonal cross section.
  • the heat dissipation columns 11 e and the mounting through holes 21 e of the radiation fins 2 e have a triangular cross section.
  • the heat dissipation columns 11 f and the mounting through holes 21 f of the radiation fins 2 f have an elongated cross section.
  • the roots 121 , 122 or 123 of the heat dissipation columns 11 ( 11 a ⁇ 11 f ) that are bonded to the top wall of the base panel 1 are made in any of a variety of shapes, for example, taperedly chamfered, convexly chamfered, or concavely chamfered, to allow heat energy to be rapidly transferred from the base panel 1 through the roots 121 , 122 or 123 to the heat dissipation columns 11 ( 11 a ⁇ 11 f ) and then to the radiation fins 2 for quick dissipation.
  • each radiation fin 2 (or 2 a ⁇ 2 f ) has a flange 211 protruding from the top surface around each mounting through hole 21 (or 21 a ⁇ 21 f ).
  • the flanges 211 increase the contact surface area between the radiation fins 2 and the heat dissipation columns 11 (or 11 a ⁇ 11 f ) to enhance heat transfer speed.
  • the base panel 1 b has a metal block 13 embedded in its bottom side in a flash manner for direct contact with the semiconductor heat source (not shown).
  • the metal block 13 is made of a metal material having a heat transfer coefficient higher than the metal material (copper or aluminum) of the base panel 1 b.
  • the heat dissipation columns 11 (or 11 a ⁇ 11 f ) can be made having different heights and mounted with different sizes of radiation fins 2 .
  • each heat dissipation column 11 (or 11 a ⁇ 11 f ) of the base panel 1 can be stepped columns. As shown in FIG. 16 , each heat dissipation column 11 (or 11 a ⁇ 11 f ) has an upper section 111 , a middle section 112 , and a lower section 113 .
  • the middle section 112 has a diameter greater than the upper section 111 but smaller than the lower section 113 .
  • the sizes of the mounting through holes 21 of the respective radiation fins 2 fit the diameters of the sections 111 , 112 and 113 of the heat dissipation columns 11 (or 11 a ⁇ 11 f ) respectively.
  • the mounting through holes 21 g of the radiation fins 2 g are stepped through holes so that the radiation fins 2 g can be fastened together in a stack (by means of fitting the stepped flanges that extend around each mounting through hole of one radiation fin into the stepped flanges of another radiation fin).
  • This stepped mounting through hole design can also be used in the design where the base panel is provided with stepped heat dissipation columns.
  • each heat dissipation column 11 is taperedly, convexly or concavely chamfered to facilitate insertion of the heat dissipation columns 11 through the mounting through holes of the radiation fins 2 .
  • the heat dissipation columns 11 a , 11 c , 11 d shown in FIGS. 19 ⁇ 21 have the respective top ends 114 a , 114 c , 114 d taperedly, convexly or concavely chamfered.
  • the heat sink may be provided with a fan at the base panel 1 .
  • FIGS. 22 and 23 show a fan 3 or 3 a mounted on a blank area at the top wall of the base panel 1 at one side relative to the heat dissipation columns 11 and the radiation fins 2 .
  • the heat sink has a rectangular profile with a fan 3 b mounted on the top wall of the base panel 1 at the center and surrounded by the radiation fins 2 .
  • the heat sink has a circular profile with a fan 3 c mounted on the top wall of the base panel 1 at the center and surrounded by the radiation fins 2 .
  • the heat sink can be mounted with a fan 3 , 3 a or 3 b , and can also be provided with one or a number of heat pipes 4 .
  • the base panel 1 has a plurality of bottom pipe grooves 14 on the bottom wall, and heat pipes 4 are respectively press-fitted in the bottom pipe grooves 14 of the base panel 1 with the flat bottom side of each heat pipe 4 kept in flush with the bottom wall of the base panel 1 for direct contact with the semiconductor heat source (not shown) to enhance heat dissipation performance.
  • the arrangement of the base panel 1 , the radiation fins 2 , the fan 3 ( 3 a , 3 b . 3 c ) and the heat pipes 4 is not limited to the aforesaid embodiments.
  • the heat pipes 4 can be fastened to the radiation fins 2 with only their one end respectively extended to the bottom side of the base panel 1 and embedded in the bottom pipe grooves 14 .
  • FIGS. 1 ⁇ 28 A prototype of heat sink has been constructed with the features of FIGS. 1 ⁇ 28 .
  • the heat sink functions smoothly to provide all of the features discussed earlier.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
US12/018,187 2007-12-12 2008-01-22 Heat sink Abandoned US20090151900A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW096147379A TW200926945A (en) 2007-12-12 2007-12-12 Cylindrical heat dissipater equipped with cooling fins
TW096147379 2007-12-12

Publications (1)

Publication Number Publication Date
US20090151900A1 true US20090151900A1 (en) 2009-06-18

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Application Number Title Priority Date Filing Date
US12/018,187 Abandoned US20090151900A1 (en) 2007-12-12 2008-01-22 Heat sink

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US (1) US20090151900A1 (enrdf_load_stackoverflow)
JP (1) JP3140605U (enrdf_load_stackoverflow)
DE (1) DE202008002041U1 (enrdf_load_stackoverflow)
TW (1) TW200926945A (enrdf_load_stackoverflow)

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090107654A1 (en) * 2007-10-26 2009-04-30 Chin-Ming Chen Heat dissipation module and base and manufacturing method thereof
US20090236078A1 (en) * 2008-03-20 2009-09-24 Chin-Kuang Luo Heat-dissipating device
US20090255658A1 (en) * 2008-04-10 2009-10-15 Asia Vital Components Co., Ltd. Heat dissipation module
US20100243207A1 (en) * 2009-03-30 2010-09-30 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Thermal module
US20100300662A1 (en) * 2009-06-02 2010-12-02 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd Heat dissipating device and fixing bracket thereof
US20110048681A1 (en) * 2009-08-26 2011-03-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20110085304A1 (en) * 2009-10-14 2011-04-14 Irvine Sensors Corporation Thermal management device comprising thermally conductive heat spreader with electrically isolated through-hole vias
USD662897S1 (en) * 2011-01-04 2012-07-03 Technicolor S.A. Heat sink
USD678852S1 (en) * 2011-11-01 2013-03-26 Astral Pool Australia Pty Ltd Heat sink
EP2824389A1 (en) * 2013-07-08 2015-01-14 LG Electronics, Inc. LED Light
US20150216079A1 (en) * 2012-09-28 2015-07-30 Hitachi, Ltd. Cooling system and electric apparatus using the same
US9625104B2 (en) 2013-07-10 2017-04-18 Lg Electronics Inc. LED light and method of manufacturing the same
US9831153B1 (en) 2016-12-09 2017-11-28 Metal Industries Research & Development Centre Heat dissipating device
US9913411B2 (en) * 2016-04-27 2018-03-06 General Electric Company Thermal capacitance system
USD822625S1 (en) * 2016-04-26 2018-07-10 Showa Denko K.K. Fin for heat exchanger
CN108717938A (zh) * 2018-07-16 2018-10-30 上海克拉索富电子有限公司 一种风机调速模块辐射式散热结构
CN108925102A (zh) * 2018-06-22 2018-11-30 江苏英杰铝业有限公司 一种高性能铝板散热器
US20200236806A1 (en) * 2019-01-18 2020-07-23 United Arab Emirates University Heat sink with internal chamber for phase change material
US10809017B2 (en) * 2016-05-10 2020-10-20 Mitsubishi Electric Corporation Heat sink with projection and recess shaped fins
CN112332588A (zh) * 2020-10-26 2021-02-05 中车大连机车研究所有限公司 一种电机端盖散热器
US11024558B2 (en) * 2010-03-26 2021-06-01 Hamilton Sundstrand Corporation Heat transfer device with fins defining air flow channels
US11260953B2 (en) 2019-11-15 2022-03-01 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11260976B2 (en) 2019-11-15 2022-03-01 General Electric Company System for reducing thermal stresses in a leading edge of a high speed vehicle
US11267551B2 (en) 2019-11-15 2022-03-08 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11352120B2 (en) 2019-11-15 2022-06-07 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11407488B2 (en) 2020-12-14 2022-08-09 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11427330B2 (en) 2019-11-15 2022-08-30 General Electric Company System and method for cooling a leading edge of a high speed vehicle
JP2022173661A (ja) * 2021-05-10 2022-11-22 日本軽金属株式会社 ヒートシンク及びヒートシンクの製造方法
US11577817B2 (en) 2021-02-11 2023-02-14 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11745847B2 (en) 2020-12-08 2023-09-05 General Electric Company System and method for cooling a leading edge of a high speed vehicle
WO2024091980A1 (en) * 2022-10-24 2024-05-02 Strategic Thermal Labs, Llc Stacked-fin cold plate with a 3d vapor chamber

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JP2011038702A (ja) * 2009-08-11 2011-02-24 崇賢 ▲黄▼ 排熱効率を増進する排熱器
JP2014045136A (ja) * 2012-08-28 2014-03-13 Mitsubishi Electric Corp 発熱体と放熱体との接合体
JP7022426B2 (ja) * 2018-04-25 2022-02-18 かがつう株式会社 ヒートシンク及び電子部品パッケージ並びにヒートシンクの製造方法

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Cited By (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090107654A1 (en) * 2007-10-26 2009-04-30 Chin-Ming Chen Heat dissipation module and base and manufacturing method thereof
US20090236078A1 (en) * 2008-03-20 2009-09-24 Chin-Kuang Luo Heat-dissipating device
US20090255658A1 (en) * 2008-04-10 2009-10-15 Asia Vital Components Co., Ltd. Heat dissipation module
US20100243207A1 (en) * 2009-03-30 2010-09-30 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Thermal module
US20100300662A1 (en) * 2009-06-02 2010-12-02 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd Heat dissipating device and fixing bracket thereof
US8579017B2 (en) * 2009-08-26 2013-11-12 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with multiple heat sinks
US20110048681A1 (en) * 2009-08-26 2011-03-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20110085304A1 (en) * 2009-10-14 2011-04-14 Irvine Sensors Corporation Thermal management device comprising thermally conductive heat spreader with electrically isolated through-hole vias
US11024558B2 (en) * 2010-03-26 2021-06-01 Hamilton Sundstrand Corporation Heat transfer device with fins defining air flow channels
USD662897S1 (en) * 2011-01-04 2012-07-03 Technicolor S.A. Heat sink
USD678852S1 (en) * 2011-11-01 2013-03-26 Astral Pool Australia Pty Ltd Heat sink
US20150216079A1 (en) * 2012-09-28 2015-07-30 Hitachi, Ltd. Cooling system and electric apparatus using the same
EP2824389A1 (en) * 2013-07-08 2015-01-14 LG Electronics, Inc. LED Light
US9627599B2 (en) 2013-07-08 2017-04-18 Lg Electronics Inc. LED lighting apparatus and heat dissipation module
US9625104B2 (en) 2013-07-10 2017-04-18 Lg Electronics Inc. LED light and method of manufacturing the same
USD822625S1 (en) * 2016-04-26 2018-07-10 Showa Denko K.K. Fin for heat exchanger
US9913411B2 (en) * 2016-04-27 2018-03-06 General Electric Company Thermal capacitance system
US10809017B2 (en) * 2016-05-10 2020-10-20 Mitsubishi Electric Corporation Heat sink with projection and recess shaped fins
US9831153B1 (en) 2016-12-09 2017-11-28 Metal Industries Research & Development Centre Heat dissipating device
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TWI411383B (enrdf_load_stackoverflow) 2013-10-01

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