US20100157536A1 - Heat radiating member mounting structure - Google Patents

Heat radiating member mounting structure Download PDF

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Publication number
US20100157536A1
US20100157536A1 US12/340,679 US34067908A US2010157536A1 US 20100157536 A1 US20100157536 A1 US 20100157536A1 US 34067908 A US34067908 A US 34067908A US 2010157536 A1 US2010157536 A1 US 2010157536A1
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United States
Prior art keywords
heat radiating
radiating member
mounting structure
convex portions
member mounting
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Granted
Application number
US12/340,679
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US7733653B1 (en
Inventor
Chin-Hsing Horng
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Yuan Deng Metals Industrial Co Ltd
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Yuan Deng Metals Industrial Co Ltd
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Priority to US12/340,679 priority Critical patent/US7733653B1/en
Assigned to YUAN DENG METALS INDUSTRIAL CO. LTD reassignment YUAN DENG METALS INDUSTRIAL CO. LTD ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HORNG, CHIN-HSING
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Publication of US7733653B1 publication Critical patent/US7733653B1/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to heat dissipation technology and more particularly, to a heat radiating member mounting structure for use to dissipate heat from a heat generating device.
  • An advanced electronic device has a high operation speed. During operation of a high-speed electronic device, much waste heat is produced. To maintain normal functioning of a high-speed electronic device, heat sink or cooler means may be used to carry waste heat away rapidly, avoiding the accumulation of heat. To enhance the heat dissipation performance of a heat sink, the heat spreading surface area must be relatively increased. Increasing the number of heat radiating sheet members or radiation fins can increase the heat spreading surface area. However, increasing the number of heat radiating sheet members or radiation fins of a heat sink relatively lowers the fabrication speed.
  • the present invention has been accomplished under the circumstances in view. It is one object of the present invention to provide a heat radiating member mounting structure, which enables multiple identical heat radiating members to be fastened together in a stack rapidly without tools, thereby saving the cost.
  • a heat radiating member comprises a flat base, and two side flanges respectively perpendicularly extended from two opposite lateral sides of the flat base in a parallel manner.
  • Each side flange comprises a plurality of convex portions, and a plurality of lugs respectively disposed above said convex portions.
  • Each convex portion defines a locating groove at an outer side.
  • Each lug comprises a protruding portion fitting the configuration of the locating groove.
  • FIG. 1 is an oblique elevation of a heat radiating member constructed according to the present invention.
  • FIG. 2 is an enlarged view of part A of FIG. 1 .
  • FIG. 3 is an enlarged view of part B of FIG. 1 .
  • FIG. 4 is a schematic sectional side view of two heat radiating members before installation.
  • FIG. 5 corresponds to FIG. 4 , showing the protruding portions of the lugs of the upper heat radiating member moved over the two opposite lateral edges of the flat base of the lower heat radiating member.
  • FIG. 6 corresponds to FIG. 5 , showing the protruding portions of the upper heat radiating member respectively engaged into the respective locating grooves of the lower heat radiating member.
  • FIG. 7 is a schematic sectional elevation, showing a status of use of the present invention.
  • a heat radiating member 1 is a single-piece member made of a thermally conductive sheet material (such as copper or aluminum sheet material), comprising a flat base 11 for attaching to the surface of a heat generating device (not shown) to dissipate heat energy from the heat generating device, two side flanges 12 respectively perpendicularly extended from two opposite lateral sides of the flat base 11 in a parallel manner.
  • Each side flange 12 comprises a plurality of convex portions 121 arranged in a line, and a plurality of lugs 13 respectively disposed above the convex portions 121 .
  • the convex portion 121 has two beveled guide edges 1211 symmetrically disposed at two opposite lateral sides thereof, and a locating groove 122 . Further, the convex portion 121 has its bottom side stopped against the flat base 11 .
  • the locating groove 122 is formed in an outer side of the convex portion 121 , having a depth greater than the wall thickness of the side flanges 12 . Further, each lug 13 has a protruding portion 131 fitting the configuration of the locating groove 122 .
  • a plurality of heat radiating members 1 can be fastened together in a stack conveniently without any tools.
  • the protruding portions 131 of the lugs 13 of the upper heat radiating member 1 When the protruding portions 131 of the lugs 13 of the upper heat radiating member 1 are completely moved over the flat base 11 of the lower heat radiating member 1 , the protruding portions 131 receive no resisting force and immediately return to their former shape to engage the respective locating grooves 122 of the lower heat radiating member 1 , and therefore the protruding portions 131 of the upper heat radiating member 1 are respectively stopped at the bottom side of the flat base 11 of the lower heat radiating member 1 to prohibit disconnection of the upper heater radiating member 1 from the lower heat radiating member 1 .
  • the flat base 11 of the lowest heat radiating member 1 is kept in close contact with the top surface the heat generating device.
  • the combination of heat radiating members 1 can be used with a cooling fan (not shown), enabling induced currents of air to flow through the gap in between each two adjacent heat radiating members 1 (see the arrowhead signs).
  • the beveled guide edges 1211 of the convex portion 121 of the side flanges 12 guide the flowing of induced currents of air, avoiding turbulence and heat energy detaining.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat radiating member mounting structure for enabling multiple heat radiating members to be fastened together in a stack without tools is disclosed. Each heat radiating member has convex portions and lugs formed on each of two upright side flanges at two sides of a flat base thereof such that multiple heat radiating members can be fastened together by means of engaging protruding portions of the lugs of one heat radiating member into locating grooves in the convex portions of another heat radiating member.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to heat dissipation technology and more particularly, to a heat radiating member mounting structure for use to dissipate heat from a heat generating device.
  • 2. Description of the Related Art
  • An advanced electronic device has a high operation speed. During operation of a high-speed electronic device, much waste heat is produced. To maintain normal functioning of a high-speed electronic device, heat sink or cooler means may be used to carry waste heat away rapidly, avoiding the accumulation of heat. To enhance the heat dissipation performance of a heat sink, the heat spreading surface area must be relatively increased. Increasing the number of heat radiating sheet members or radiation fins can increase the heat spreading surface area. However, increasing the number of heat radiating sheet members or radiation fins of a heat sink relatively lowers the fabrication speed.
  • Therefore, it is desirable to provide a combination heat sink that can be easily and rapidly assembled, thereby reducing the cost.
    • SUMMARY OF THE INVENTION
  • The present invention has been accomplished under the circumstances in view. It is one object of the present invention to provide a heat radiating member mounting structure, which enables multiple identical heat radiating members to be fastened together in a stack rapidly without tools, thereby saving the cost.
  • To achieve this and other objects of the present invention, a heat radiating member comprises a flat base, and two side flanges respectively perpendicularly extended from two opposite lateral sides of the flat base in a parallel manner. Each side flange comprises a plurality of convex portions, and a plurality of lugs respectively disposed above said convex portions. Each convex portion defines a locating groove at an outer side. Each lug comprises a protruding portion fitting the configuration of the locating groove. By means of engaging the protruding portions of the lugs of one heat radiating member into the locating grooves of another heat radiating member, multiple heat radiating members are fastened together in a stack.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an oblique elevation of a heat radiating member constructed according to the present invention.
  • FIG. 2 is an enlarged view of part A of FIG. 1.
  • FIG. 3 is an enlarged view of part B of FIG. 1.
  • FIG. 4 is a schematic sectional side view of two heat radiating members before installation.
  • FIG. 5 corresponds to FIG. 4, showing the protruding portions of the lugs of the upper heat radiating member moved over the two opposite lateral edges of the flat base of the lower heat radiating member.
  • FIG. 6 corresponds to FIG. 5, showing the protruding portions of the upper heat radiating member respectively engaged into the respective locating grooves of the lower heat radiating member.
  • FIG. 7 is a schematic sectional elevation, showing a status of use of the present invention.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • Referring to FIGS. 1˜3, a heat radiating member 1 is a single-piece member made of a thermally conductive sheet material (such as copper or aluminum sheet material), comprising a flat base 11 for attaching to the surface of a heat generating device (not shown) to dissipate heat energy from the heat generating device, two side flanges 12 respectively perpendicularly extended from two opposite lateral sides of the flat base 11 in a parallel manner. Each side flange 12 comprises a plurality of convex portions 121 arranged in a line, and a plurality of lugs 13 respectively disposed above the convex portions 121. The convex portion 121 has two beveled guide edges 1211 symmetrically disposed at two opposite lateral sides thereof, and a locating groove 122. Further, the convex portion 121 has its bottom side stopped against the flat base 11. The locating groove 122 is formed in an outer side of the convex portion 121, having a depth greater than the wall thickness of the side flanges 12. Further, each lug 13 has a protruding portion 131 fitting the configuration of the locating groove 122.
  • Referring to FIGS. 4˜6, a plurality of heat radiating members 1 can be fastened together in a stack conveniently without any tools. When fastening two heat radiating members 1 together, aim the lugs 13 of the upper heat radiating member 1 at the locating grooves 122 of the lower heat radiating member 1, and then move the upper heat radiating member 1 downwards to move the protruding portions 131 of the lugs 13 of the upper heat radiating member 1 over the two opposite lateral edges of the flat base 11 of the lower heat radiating member 1, forcing the two side flanges 12 of the upper heat radiating member 1 to deform elastically outwardly (because the arm of force of each protruding portion 131 is shorter than the associating side flange 12, a great stress is produced, and the minor elastic deformation of each protruding portion 131 is insignificant). When the protruding portions 131 of the lugs 13 of the upper heat radiating member 1 are completely moved over the flat base 11 of the lower heat radiating member 1, the protruding portions 131 receive no resisting force and immediately return to their former shape to engage the respective locating grooves 122 of the lower heat radiating member 1, and therefore the protruding portions 131 of the upper heat radiating member 1 are respectively stopped at the bottom side of the flat base 11 of the lower heat radiating member 1 to prohibit disconnection of the upper heater radiating member 1 from the lower heat radiating member 1.
  • Referring to FIG. 7, when multiple heat radiating members 1 are fastened together and attached to a heat generating device (not shown) to dissipate heat from the heat generating device, the flat base 11 of the lowest heat radiating member 1 is kept in close contact with the top surface the heat generating device. The combination of heat radiating members 1 can be used with a cooling fan (not shown), enabling induced currents of air to flow through the gap in between each two adjacent heat radiating members 1 (see the arrowhead signs). When induced currents of air are flowing through the heat radiating members 1, the beveled guide edges 1211 of the convex portion 121 of the side flanges 12 guide the flowing of induced currents of air, avoiding turbulence and heat energy detaining.
  • In conclusion, the invention has the following advantages of characteristics:
    • 1. The convex portions 121 and protruding portions 131 are directly formed of a part of the heat radiating member 1 by means of a stamping technique, and the formation of the convex portions 121 and protruding portions 131 greatly reinforces the structural strength of the heat radiating member 1 for durable use.
    • 2. Identical heat radiating members 1 can be fastened together in a stack conveniently and rapidly without any tools.
    • 3. The invention utilizes the beveled guide edges 1211 to avoid turbulence and heat energy detaining, enhancing heat dissipation efficiency.
  • Although a particular embodiment of the invention has been described in detail for purposes of illustration, various modifications and enhancements may be made without departing from the spirit and scope of the invention. Accordingly, the invention is not to be limited except as by the appended claims.

Claims (6)

1. A heat radiating member mounting structure, comprising a plurality of heat radiating members made of a thermally conductive sheet material and fastened together in a stack for dissipating heat, each of said heat radiating members comprising a flat base and two side flanges respectively perpendicularly extending from two opposite lateral sides of said flat base in a parallel manner for mounting, wherein each of said side flanges comprises a plurality of convex portions, and a plurality of lugs respectively disposed above said convex portions, each of said convex portions defining a locating groove, said locating groove having a depth perpendicular to the corresponding side flange that is greater than the wall thickness of that side flange, each of said lugs comprising a protruding portion that protrudes along a direction perpendicular to the corresponding side flange for fitting the configuration of said locating groove so that the protruding portions of the lugs of one said heat radiating member are respectively engageable into the locating grooves of another said heat radiating member to couple the heat radiating members together.
2. The heat radiating member mounting structure as claimed in claim 1, wherein each of said convex portions has a bottom side stopped against the flat base of the respective heat radiating member.
3. The heat radiating member mounting structure as claimed in claim 1, wherein each of said convex portions has two beveled guide edges symmetrically disposed at two opposite lateral sides thereof for guiding air to avoid turbulence.
4. The heat radiating member mounting structure as claimed in claim 1, wherein said thermally conductive sheet material is a copper sheet.
5. The heat radiating member mounting structure as claimed in claim 1, wherein said thermally conductive sheet material is an aluminum sheet.
6. The heat radiating member mounting structure as claimed in claim 1, wherein each of said heat radiating members is a single-piece member.
US12/340,679 2008-12-20 2008-12-20 Heat radiating member mounting structure Expired - Fee Related US7733653B1 (en)

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US20100157536A1 true US20100157536A1 (en) 2010-06-24

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160183404A1 (en) * 2014-12-17 2016-06-23 Schlumberger Technology Corporation Heat Transferring Electronics Chassis

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090060679A1 (en) * 2007-08-31 2009-03-05 Chin-Hsing Horng Fastening apparatus of a heat radiator
CN101646330B (en) * 2008-08-07 2013-06-05 富准精密工业(深圳)有限公司 Cooling device
CN101854792A (en) * 2009-04-01 2010-10-06 富准精密工业(深圳)有限公司 Cooling device
US20120181404A1 (en) * 2011-01-13 2012-07-19 Chin-Hsing Horng Thin-sheet metal member mounting structure
WO2019140769A1 (en) * 2018-01-17 2019-07-25 广东长盈精密技术有限公司 Machining process for middle frame of cell phone

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6672379B1 (en) * 2002-07-29 2004-01-06 Waffer Technology Corp. Positioning and buckling structure for use in a radiator
US6772828B1 (en) * 2003-02-28 2004-08-10 Li-Chuan Chen Cooling fin assembly
US20050051297A1 (en) * 2003-09-05 2005-03-10 Jui-Chen Kuo Heat sink
US6883591B2 (en) * 2003-09-12 2005-04-26 Chi Yuan Co., Ltd. Stackable heat sink
US7028755B2 (en) * 2003-05-09 2006-04-18 Hon Hai Precision Ind. Co., Ltd. Heat dissipation device with interlocking fin plates
US7190588B2 (en) * 2004-07-13 2007-03-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat-dissipating fin assembly for heat sink

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6672379B1 (en) * 2002-07-29 2004-01-06 Waffer Technology Corp. Positioning and buckling structure for use in a radiator
US6772828B1 (en) * 2003-02-28 2004-08-10 Li-Chuan Chen Cooling fin assembly
US7028755B2 (en) * 2003-05-09 2006-04-18 Hon Hai Precision Ind. Co., Ltd. Heat dissipation device with interlocking fin plates
US20050051297A1 (en) * 2003-09-05 2005-03-10 Jui-Chen Kuo Heat sink
US6883591B2 (en) * 2003-09-12 2005-04-26 Chi Yuan Co., Ltd. Stackable heat sink
US7190588B2 (en) * 2004-07-13 2007-03-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat-dissipating fin assembly for heat sink

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160183404A1 (en) * 2014-12-17 2016-06-23 Schlumberger Technology Corporation Heat Transferring Electronics Chassis
US9611723B2 (en) * 2014-12-17 2017-04-04 Schlumberger Technology Corporation Heat transferring electronics chassis

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