US20090107654A1 - Heat dissipation module and base and manufacturing method thereof - Google Patents

Heat dissipation module and base and manufacturing method thereof Download PDF

Info

Publication number
US20090107654A1
US20090107654A1 US12/204,332 US20433208A US2009107654A1 US 20090107654 A1 US20090107654 A1 US 20090107654A1 US 20433208 A US20433208 A US 20433208A US 2009107654 A1 US2009107654 A1 US 2009107654A1
Authority
US
United States
Prior art keywords
fin
guiding column
base
heat dissipation
guiding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/204,332
Inventor
Chin-Ming Chen
Yu-Hung Huang
Chun-Yang Hung
Sung-Ching Ho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delta Electronics Inc
Original Assignee
Delta Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Assigned to DELTA ELECTRONICS, INC. reassignment DELTA ELECTRONICS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, CHIN-MING, HO, SUNG-CHING, HUANG, YU-HUNG, HUNG, CHUN-YANG
Publication of US20090107654A1 publication Critical patent/US20090107654A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Definitions

  • the present invention relates to a heat dissipation module, and in particular, to a heat dissipation module including an aluminum extruded heat dissipating base with tightly fitted fins.
  • heat produced by the electronic products has increased substantially.
  • a heat sink is utilized in heat dissipation.
  • a conventional heat sink is instituted by a base and several fins, both of which are connected by tightly fit.
  • the base is manufactured by forging and then tightly fitted with the fins.
  • the forging process results in uneven heights for the guiding columns of the base.
  • An additional process, with the help of computer numerical control, must be applied to cut the guiding columns for an uniform height. Therefore, the base and the guiding columns formed by forging require a high manufacturing cost and an extra cutting process.
  • Another conventional heat sink has a base with some separated guiding columns. As shown in FIGS. 1A and 1B , the base 11 and the guiding columns 12 are separately formed and then are connected to each other by tightly fit. In other words, the plurality of guiding columns 12 are tightly fitted into the holes 111 of the base 11 , respectively. Then, several fins 13 are tightly fitted with the guiding columns 12 . However, while fitting the guiding columns 12 into the holes 111 of the base 11 , the tolerance between each component will accumulate, and because the guiding columns 12 are not perfectly vertical, tightly fitting the fins 13 becomes more difficult. Moreover, the base 11 and the guiding columns 12 are independent from each other, resulting in decreased heat conductivity.
  • the present invention provides a heat dissipation module instituted by a heat dissipating base and a plurality of tightly fitted fins.
  • the present invention provides a heat dissipation module including a base and at least one fin.
  • the base includes a bottom and a guiding column disposed on the bottom, wherein the bottom and the guiding column are integrally formed as a single piece.
  • the fin is tightly fitted on the guiding column.
  • the bottom and the guiding column are formed by extrusion. Further, the bottom and the guiding column are formed by crosscutting.
  • the guiding column has a cross section with a rectangular or polygonal shape, and the guiding column includes a guiding angle formed on top of the guiding column.
  • the fin is made by aluminum, copper or other high thermo-conductive materials, and is formed by punching or extrusion.
  • the fin includes at least one through hole for allowing the guiding column to be penetrated and mounted thereon.
  • the fin is plural, the fins are stacked on the bottom of the base and connected with the guiding column in parallel with each other, and/or the fins are stacked on the bottom of the base and connected with the guiding column by keeping a constant distance with each other.
  • a protrusion is formed on the periphery of the through hole for increasing contact areas between the fin and the guiding column.
  • a distance between the lower fin and the upper fin is greater than or equal to a height of the protrusion of the lower fin.
  • the sum of a height of the stacked fins is less than or equal to a height of the guiding column.
  • the guiding column and the fin are plural, the heights of the some guiding columns are different, and the shapes of the some fins are different.
  • the present invention provides a heat dissipating base including a bottom and at least one guiding column disposed on the bottom, wherein the bottom and the guiding column are integrally formed as a single piece.
  • the present invention provides a manufacturing method of a heat dissipation module.
  • the steps of the manufacturing method include integrally forming a base, wherein the base includes a bottom and at least one guiding column disposed on the bottom, and tightly fitting at least one fin with the guiding column.
  • the present invention provides a heat dissipation module with an aluminum extruded heat dissipating base with tightly fit fins, utilizing extrusion to overcome the disadvantages of conventional heat sink, so as to reduce manufacturing cost and time and increase heat conductivity.
  • FIG. 1A is an exploded view of a conventional heat sink
  • FIG. 1B is a schematic view of the heat sink in FIG. 1A ;
  • FIG. 2A is an exploded view of a heat dissipation module of a preferred embodiment of the present invention.
  • FIG. 2B is a schematic view of the heat dissipation module in FIG. 2A ;
  • FIG. 2C is a side view of the heat dissipation module in FIG. 2B .
  • heat dissipation module of the present invention includes a base 2 and a plurality of fins 3 .
  • the base 2 includes a bottom 21 and a plurality of guiding columns 22 disposed thereon, wherein the bottom 21 and the guiding columns 22 are integrally formed as a single piece by extrusion.
  • the plurality of fins 3 are tightly fitted on the guiding columns 22 piece by piece. Additionally, the bottom 21 and the guiding columns 22 can be formed by crosscutting coordinately.
  • Each of the guiding columns 22 has a cross section with a rectangular or polygonal shape.
  • the top of each guiding column 22 forms a guiding angle 221 respectively for allowing the fins 3 to be disposed thereon easily.
  • the fins 3 are made by aluminum, copper or other high thermo-conductive materials. And the fins 3 are formed by punching or extrusion.
  • the fins 3 include a plurality of through holes 31 for allowing the corresponding guiding columns 22 to be penetrated and mounted thereon.
  • the fins 3 are stacked on the bottom 21 and connected with the guiding columns 22 of the base 2 by keeping a constant distance with each other, and/or the fins are stacked on the bottom 21 of the base 2 in parallel with each other.
  • a protrusion 32 is correspondingly formed on the periphery of each of the through holes 31 of each of the fins 3 for increasing contact areas between the fins 3 and the guiding columns 22 .
  • the distance between one fin and its adjacent fin is greater than the height of the protrusion 32 of the fin, i.e.
  • the distance “H” between the lower fin and its upper fin is greater than the height “h” of the protrusion 32 of the lower, as shown in FIG. 2C .
  • the present invention is not limited thereto, for example, the distance between one fin and its adjacent fin can equal to the height of the protrusion 32 of the fin, so that when the upper fin is stacked on the lower adjacent fin, the upper fin can be contact with the protrusion of the lower fin to facilitate positioning of the upper fin, the figure is not shown.
  • the sum of a height of the stacked fins 3 is less than or equal to a height of the guiding column 22 so that all fins 3 can be sequentially stacked and tightly fitted with the guiding column 22 .
  • the heat dissipating base and the guiding angles of the guiding columns in the present invention are formed by extrusion, and the heat dissipating base and the guiding columns are formed by crosscutting coordinately, and the fins are tightly fitting on the heat dissipating base, this results in lower costs, a simplified technique, an easier process and an efficient manufacturing method.
  • the heat dissipating base and the guiding columns are integrally formed as a single piece so as to achieve a high dissipating efficiency.
  • the heat dissipation module of the present invention improves upon cost reducing, manufacturing efficiency, manufacturing yield and performance.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention provides a heat dissipation module, a base thereof and a manufacturing method thereof. The heat dissipation module includes the base having a bottom, a plurality of guiding columns and a plurality of fins. The bottom and the guiding columns are formed as a single piece, and the fins are tightly fitted on the guiding columns.

Description

    CROSS REFERENCE TO RELATED APPLICATIONS
  • This Non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No(s). 096140395 filed in Taiwan, Republic of China on Oct. 26, 2007, the entire contents of which are hereby incorporated by reference.
    • BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a heat dissipation module, and in particular, to a heat dissipation module including an aluminum extruded heat dissipating base with tightly fitted fins.
  • 2. Description of the Related Art
  • Driven by miniaturization, higher speed and higher efficiency requirements for central process units (CPU) and other electronic products, heat produced by the electronic products has increased substantially. To efficiently dissipate heat, a heat sink is utilized in heat dissipation.
  • A conventional heat sink is instituted by a base and several fins, both of which are connected by tightly fit. The base is manufactured by forging and then tightly fitted with the fins. However, the forging process results in uneven heights for the guiding columns of the base. An additional process, with the help of computer numerical control, must be applied to cut the guiding columns for an uniform height. Therefore, the base and the guiding columns formed by forging require a high manufacturing cost and an extra cutting process.
  • Another conventional heat sink has a base with some separated guiding columns. As shown in FIGS. 1A and 1B, the base 11 and the guiding columns 12 are separately formed and then are connected to each other by tightly fit. In other words, the plurality of guiding columns 12 are tightly fitted into the holes 111 of the base 11, respectively. Then, several fins 13 are tightly fitted with the guiding columns 12. However, while fitting the guiding columns 12 into the holes 111 of the base 11, the tolerance between each component will accumulate, and because the guiding columns 12 are not perfectly vertical, tightly fitting the fins 13 becomes more difficult. Moreover, the base 11 and the guiding columns 12 are independent from each other, resulting in decreased heat conductivity.
    • BRIEF SUMMARY OF THE INVENTION
  • Accordingly, the present invention provides a heat dissipation module instituted by a heat dissipating base and a plurality of tightly fitted fins.
  • The present invention provides a heat dissipation module including a base and at least one fin. The base includes a bottom and a guiding column disposed on the bottom, wherein the bottom and the guiding column are integrally formed as a single piece. The fin is tightly fitted on the guiding column.
  • Preferably, the bottom and the guiding column are formed by extrusion. Further, the bottom and the guiding column are formed by crosscutting. The guiding column has a cross section with a rectangular or polygonal shape, and the guiding column includes a guiding angle formed on top of the guiding column.
  • Also preferably, the fin is made by aluminum, copper or other high thermo-conductive materials, and is formed by punching or extrusion. The fin includes at least one through hole for allowing the guiding column to be penetrated and mounted thereon. When the fin is plural, the fins are stacked on the bottom of the base and connected with the guiding column in parallel with each other, and/or the fins are stacked on the bottom of the base and connected with the guiding column by keeping a constant distance with each other.
  • Furthermore, a protrusion is formed on the periphery of the through hole for increasing contact areas between the fin and the guiding column. When the fin is plural and an upper fin is stacked on a lower adjacent fin, a distance between the lower fin and the upper fin is greater than or equal to a height of the protrusion of the lower fin. Also, when the fin is plural, the sum of a height of the stacked fins is less than or equal to a height of the guiding column. Further, when the guiding column and the fin are plural, the heights of the some guiding columns are different, and the shapes of the some fins are different.
  • Accordingly, the present invention provides a heat dissipating base including a bottom and at least one guiding column disposed on the bottom, wherein the bottom and the guiding column are integrally formed as a single piece.
  • Accordingly, the present invention provides a manufacturing method of a heat dissipation module. The steps of the manufacturing method include integrally forming a base, wherein the base includes a bottom and at least one guiding column disposed on the bottom, and tightly fitting at least one fin with the guiding column.
  • The present invention provides a heat dissipation module with an aluminum extruded heat dissipating base with tightly fit fins, utilizing extrusion to overcome the disadvantages of conventional heat sink, so as to reduce manufacturing cost and time and increase heat conductivity.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The present invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:
  • FIG. 1A is an exploded view of a conventional heat sink;
  • FIG. 1B is a schematic view of the heat sink in FIG. 1A;
  • FIG. 2A is an exploded view of a heat dissipation module of a preferred embodiment of the present invention;
  • FIG. 2B is a schematic view of the heat dissipation module in FIG. 2A; and
  • FIG. 2C is a side view of the heat dissipation module in FIG. 2B.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • As shown in FIGS. 2A to 2C, heat dissipation module of the present invention includes a base 2 and a plurality of fins 3. The base 2 includes a bottom 21 and a plurality of guiding columns 22 disposed thereon, wherein the bottom 21 and the guiding columns 22 are integrally formed as a single piece by extrusion. The plurality of fins 3 are tightly fitted on the guiding columns 22 piece by piece. Additionally, the bottom 21 and the guiding columns 22 can be formed by crosscutting coordinately.
  • Each of the guiding columns 22 has a cross section with a rectangular or polygonal shape. The top of each guiding column 22 forms a guiding angle 221 respectively for allowing the fins 3 to be disposed thereon easily. The fins 3 are made by aluminum, copper or other high thermo-conductive materials. And the fins 3 are formed by punching or extrusion.
  • Also, the fins 3 include a plurality of through holes 31 for allowing the corresponding guiding columns 22 to be penetrated and mounted thereon. In the embodiment, the fins 3 are stacked on the bottom 21 and connected with the guiding columns 22 of the base 2 by keeping a constant distance with each other, and/or the fins are stacked on the bottom 21 of the base 2 in parallel with each other. Moreover, a protrusion 32 is correspondingly formed on the periphery of each of the through holes 31 of each of the fins 3 for increasing contact areas between the fins 3 and the guiding columns 22. In this embodiment, the distance between one fin and its adjacent fin is greater than the height of the protrusion 32 of the fin, i.e. when an upper fin is stacked on the lower adjacent fin, the distance “H” between the lower fin and its upper fin is greater than the height “h” of the protrusion 32 of the lower, as shown in FIG. 2C. Further, the present invention is not limited thereto, for example, the distance between one fin and its adjacent fin can equal to the height of the protrusion 32 of the fin, so that when the upper fin is stacked on the lower adjacent fin, the upper fin can be contact with the protrusion of the lower fin to facilitate positioning of the upper fin, the figure is not shown.
  • Further, in FIG. 2A, when the heights of the some guiding columns 22 are different from the other guiding columns 22, and the shapes of the some fins 3 are different from the other fins 3. Also, the sum of a height of the stacked fins 3 is less than or equal to a height of the guiding column 22 so that all fins 3 can be sequentially stacked and tightly fitted with the guiding column 22.
  • The heat dissipating base and the guiding angles of the guiding columns in the present invention are formed by extrusion, and the heat dissipating base and the guiding columns are formed by crosscutting coordinately, and the fins are tightly fitting on the heat dissipating base, this results in lower costs, a simplified technique, an easier process and an efficient manufacturing method. Moreover, the heat dissipating base and the guiding columns are integrally formed as a single piece so as to achieve a high dissipating efficiency. Compared to the conventional heat sink, the heat dissipation module of the present invention improves upon cost reducing, manufacturing efficiency, manufacturing yield and performance.
  • While the present invention has been described by way of example and in terms of preferred embodiment, it is to be understood that the present invention is not limited thereto. On the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded with the broadest interpretation so as to encompass all such modifications and similar arrangements.

Claims (20)

1. A heat dissipation module, comprising:
a base comprising a bottom and at least one guiding column disposed on the bottom, wherein the bottom and the guiding column are integrally formed as a single piece; and
at least one fin tightly fitted with the guiding column.
2. The heat dissipation module as claimed in claim 1, wherein the bottom and the guiding column are formed by extrusion and crosscutting.
3. The heat dissipation module as claimed in claim 1, wherein the guiding column has a cross section with a rectangular or polygonal shape.
4. The heat dissipation module as claimed in claim 1, wherein the guiding column comprises a guiding angle located on a top of the guiding column.
5. The heat dissipation module as claimed in claim 1, wherein the fin comprises aluminum, copper or other high thermo-conductive materials, and the fin is formed by punching or extrusion.
6. The heat dissipation module as claimed in claim 1, wherein when the fin is plural, the fins are stacked on the bottom of the base and connected with the guiding column by keeping a constant distance with each other, and/or the fins are stacked on the bottom of the base in parallel.
7. The heat dissipation module as claimed in claim 1, wherein the fin comprises at least one through hole for allowing the guiding column to be penetrated and mounted thereon.
8. The heat dissipation module as claimed in claim 7, wherein a protrusion is formed on a periphery of each through hole for increasing contact areas between the fin and the guiding column.
9. The heat dissipation module as claimed in claim 8, wherein when the fin is plural and an upper fin is stacked on a lower adjacent fin, a distance between the lower fin and the upper fin is greater than or equal to a height of the protrusion of the lower fin.
10. The heat dissipation module as claimed in claim 1, wherein when the fin is plural, the sum of a height of the stacked fins is less than or equal to a height of the guiding column.
11. The heat dissipation module as claimed in claim 1, wherein when the guiding column and the fin are plural, the heights of the some guiding columns are different, and the shapes of the some fins are different.
12. A heat dissipating base, comprising:
a bottom and at least one guiding column disposed on the bottom, wherein the bottom and the guiding column are integrally formed as a single piece.
13. The heat dissipating base as claimed in claim 12, wherein the bottom and the guiding column are formed by extrusion and crosscutting, and the guiding column comprises a guiding angle located on a top of the guiding column.
14. The heat dissipating base as claimed in claim 12, wherein the guiding column has a cross section with a rectangular or polygonal shape.
15. A manufacturing method of a heat dissipation module, comprising steps of:
integrally forming a base wherein the base comprises a bottom and at least one guiding column disposed on the bottom; and
tightly fitting at least one fin with the guiding column.
16. The method as claimed in claim 15, wherein the bottom and the guiding column are formed by extrusion and further performing a crosscutting step to form the bottom and the guiding column.
17. The method as claimed in claim 15, wherein a guiding angle is formed on a top of the guiding column of the base.
18. The method as claimed in claim 15, wherein the fin comprises aluminum, copper or other high thermo-conductive materials, and the fin is formed by punching or extrusion.
19. The method as claimed in claim 15, wherein when the fin is plural, the fins are stacked on the bottom of the base and connected with the guiding column by keeping a constant distance with each other, or the fins are stacked on the bottom of the base in parallel.
20. The method as claimed in claim 15, wherein the fin comprises at least one through hole for allowing the guiding column to be penetrated and mounted thereon, and a protrusion is formed on a periphery of each through hole for increasing contact areas between the fin and the guiding column.
US12/204,332 2007-10-26 2008-09-04 Heat dissipation module and base and manufacturing method thereof Abandoned US20090107654A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW096140395A TW200919160A (en) 2007-10-26 2007-10-26 Heat dissipation module and base and manufacturing method thereof
TW96140395 2007-10-26

Publications (1)

Publication Number Publication Date
US20090107654A1 true US20090107654A1 (en) 2009-04-30

Family

ID=40581328

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/204,332 Abandoned US20090107654A1 (en) 2007-10-26 2008-09-04 Heat dissipation module and base and manufacturing method thereof

Country Status (3)

Country Link
US (1) US20090107654A1 (en)
JP (1) JP2009111335A (en)
TW (1) TW200919160A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100243207A1 (en) * 2009-03-30 2010-09-30 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Thermal module
US20110290449A1 (en) * 2010-05-31 2011-12-01 Tsung-Hsien Huang Cooler device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5399289B2 (en) * 2010-02-16 2014-01-29 株式会社豊田中央研究所 Semiconductor device cooling apparatus and semiconductor module
WO2017077566A1 (en) * 2015-11-02 2017-05-11 三菱電機株式会社 Heat sink, cooler using same, and semiconductor device

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5216580A (en) * 1992-01-14 1993-06-01 Sun Microsystems, Inc. Optimized integral heat pipe and electronic circuit module arrangement
US5396947A (en) * 1992-03-03 1995-03-14 Itoh Research & Development Laboratory Co., Ltd Radiating device
US5651414A (en) * 1993-12-28 1997-07-29 Hitachi, Ltd. Heat-pipe type cooling apparatus
US6125920A (en) * 1997-10-16 2000-10-03 Herbert; Edward Fan with heat sink using stamped heat sink fins
US6666260B2 (en) * 1997-06-30 2003-12-23 Sun Microsystems, Inc. Scalable and modular heat sink-heat pipe cooling system
US6712128B1 (en) * 2002-11-20 2004-03-30 Thermal Corp. Cylindrical fin tower heat sink and heat exchanger
US6735864B2 (en) * 2000-01-26 2004-05-18 Matsushita Electric Industrial Co., Ltd. Heatsink method of manufacturing the same and cooling apparatus using the same
US6741468B2 (en) * 2002-07-26 2004-05-25 Hon Hai Precision Ind. Co., Ltd. Heat dissipating assembly
US7106589B2 (en) * 2003-12-23 2006-09-12 Aall Power Heatsinks, Inc. Heat sink, assembly, and method of making
US20090151900A1 (en) * 2007-12-12 2009-06-18 Tsung-Hsien Huang Heat sink

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03108686U (en) * 1990-02-21 1991-11-08
JPH1032288A (en) * 1996-07-17 1998-02-03 Sumitomo Metal Ind Ltd Heat sink of excellent heat dissipating performance
JP3517831B2 (en) * 1999-07-13 2004-04-12 宏巳 片岡 Heat sink and manufacturing method thereof
JP2005057033A (en) * 2003-08-04 2005-03-03 Nippon Alum Co Ltd Pin fin-type heatsink and manufacturing method therefor

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5216580A (en) * 1992-01-14 1993-06-01 Sun Microsystems, Inc. Optimized integral heat pipe and electronic circuit module arrangement
US5396947A (en) * 1992-03-03 1995-03-14 Itoh Research & Development Laboratory Co., Ltd Radiating device
US5651414A (en) * 1993-12-28 1997-07-29 Hitachi, Ltd. Heat-pipe type cooling apparatus
US6666260B2 (en) * 1997-06-30 2003-12-23 Sun Microsystems, Inc. Scalable and modular heat sink-heat pipe cooling system
US6125920A (en) * 1997-10-16 2000-10-03 Herbert; Edward Fan with heat sink using stamped heat sink fins
US6735864B2 (en) * 2000-01-26 2004-05-18 Matsushita Electric Industrial Co., Ltd. Heatsink method of manufacturing the same and cooling apparatus using the same
US6741468B2 (en) * 2002-07-26 2004-05-25 Hon Hai Precision Ind. Co., Ltd. Heat dissipating assembly
US6712128B1 (en) * 2002-11-20 2004-03-30 Thermal Corp. Cylindrical fin tower heat sink and heat exchanger
US7106589B2 (en) * 2003-12-23 2006-09-12 Aall Power Heatsinks, Inc. Heat sink, assembly, and method of making
US20090151900A1 (en) * 2007-12-12 2009-06-18 Tsung-Hsien Huang Heat sink

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100243207A1 (en) * 2009-03-30 2010-09-30 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Thermal module
US20110290449A1 (en) * 2010-05-31 2011-12-01 Tsung-Hsien Huang Cooler device

Also Published As

Publication number Publication date
JP2009111335A (en) 2009-05-21
TW200919160A (en) 2009-05-01

Similar Documents

Publication Publication Date Title
US7646607B2 (en) Quasi-radial heatsink with rectangular form factor and uniform fin length
US7000687B2 (en) Heat dissipating device
US20070047206A1 (en) Composite heat dissipating apparatus
US7284597B2 (en) Heat sink with combined parallel fins and the method for assembling the same
US7690418B2 (en) Heat sink
US7307842B1 (en) Heat sink assembly having retaining device with relatively better heat dissipation effectiveness
US20130056179A1 (en) Thermal module structure
US20090151898A1 (en) Heat sink
US6926071B2 (en) Heat dissipation device
US20090107654A1 (en) Heat dissipation module and base and manufacturing method thereof
US7218522B2 (en) Heat dissipating device
US7575045B2 (en) Heat dissipating device
US20110048675A1 (en) Heat sink
US8327922B2 (en) Heat sink and method for manufacturing the same
US7672131B2 (en) Heat sink assembly and method manufacturing the same
US20080011452A1 (en) Heat sink
US7929293B2 (en) Heat dissipating assembly
US20080094800A1 (en) Heat-dissipating device and method for producing the same
US20100032144A1 (en) Heat dissipation device
US20100073878A1 (en) Heat dissipation apparatus
US20070215335A1 (en) Heat sink
US8077465B2 (en) Heat sink assembly with fixing member
JP5896124B2 (en) heatsink
JP7022426B2 (en) How to manufacture heat sinks, electronic component packages and heat sinks
CN2649826Y (en) Radiating device

Legal Events

Date Code Title Description
AS Assignment

Owner name: DELTA ELECTRONICS, INC., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, CHIN-MING;HUANG, YU-HUNG;HUNG, CHUN-YANG;AND OTHERS;REEL/FRAME:021483/0983

Effective date: 20080319

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION