JP3049464B2 - ダイシング装置 - Google Patents
ダイシング装置Info
- Publication number
- JP3049464B2 JP3049464B2 JP32120293A JP32120293A JP3049464B2 JP 3049464 B2 JP3049464 B2 JP 3049464B2 JP 32120293 A JP32120293 A JP 32120293A JP 32120293 A JP32120293 A JP 32120293A JP 3049464 B2 JP3049464 B2 JP 3049464B2
- Authority
- JP
- Japan
- Prior art keywords
- blade
- cutting
- contact
- semiconductor wafer
- shielding plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Dicing (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32120293A JP3049464B2 (ja) | 1993-11-26 | 1993-11-26 | ダイシング装置 |
| US08/341,514 US5628673A (en) | 1993-11-26 | 1994-11-17 | Dicing machine with non-contact setup function |
| GB9423891A GB2284280B (en) | 1993-11-26 | 1994-11-25 | Dicing machine with non-contact setup function |
| KR1019940031395A KR950015717A (ko) | 1993-11-26 | 1994-11-26 | 비-접촉 셋업기능을 가진 다이싱머신 |
| TW83111399A TW255978B (Sortimente) | 1993-11-26 | 1994-12-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32120293A JP3049464B2 (ja) | 1993-11-26 | 1993-11-26 | ダイシング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07153722A JPH07153722A (ja) | 1995-06-16 |
| JP3049464B2 true JP3049464B2 (ja) | 2000-06-05 |
Family
ID=18129939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32120293A Expired - Fee Related JP3049464B2 (ja) | 1993-11-26 | 1993-11-26 | ダイシング装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP3049464B2 (Sortimente) |
| TW (1) | TW255978B (Sortimente) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6178709B2 (ja) * | 2013-11-26 | 2017-08-09 | 株式会社ディスコ | 切削装置及びセットアップ方法 |
| JP6444717B2 (ja) * | 2014-12-12 | 2018-12-26 | Towa株式会社 | 切断装置及び切断方法 |
| JP6235453B2 (ja) * | 2014-12-24 | 2017-11-22 | Towa株式会社 | 切断装置及び切断方法 |
| JP7080564B2 (ja) * | 2018-08-13 | 2022-06-06 | 株式会社ディスコ | 切削装置及びノズルの高さ検査方法 |
| CN113547240A (zh) * | 2021-07-26 | 2021-10-26 | 安徽联合智能装备有限责任公司 | 一种床身稳定双层激光切割机 |
| CN114193643A (zh) * | 2021-12-27 | 2022-03-18 | 烟台力凯数控科技有限公司 | 开方机用切割装置和晶棒切割方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS629867A (ja) * | 1985-07-08 | 1987-01-17 | Amada Co Ltd | 研削装置 |
| JPH064220B2 (ja) * | 1986-10-07 | 1994-01-19 | 株式会社新潟鐵工所 | 数値制御研削盤における自動砥石寸法測定方法 |
| JPH0767669B2 (ja) * | 1988-10-20 | 1995-07-26 | 株式会社新潟鐵工所 | 数値制御研削盤における自動砥石寸法測定装置 |
| JPH0572356U (ja) * | 1992-03-12 | 1993-10-05 | 株式会社テクニスコ | 光センサーによるセットアップ機構 |
-
1993
- 1993-11-26 JP JP32120293A patent/JP3049464B2/ja not_active Expired - Fee Related
-
1994
- 1994-12-07 TW TW83111399A patent/TW255978B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TW255978B (Sortimente) | 1995-09-01 |
| JPH07153722A (ja) | 1995-06-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |