JP2929859B2 - チップ部品のプレス装置 - Google Patents
チップ部品のプレス装置Info
- Publication number
- JP2929859B2 JP2929859B2 JP4252279A JP25227992A JP2929859B2 JP 2929859 B2 JP2929859 B2 JP 2929859B2 JP 4252279 A JP4252279 A JP 4252279A JP 25227992 A JP25227992 A JP 25227992A JP 2929859 B2 JP2929859 B2 JP 2929859B2
- Authority
- JP
- Japan
- Prior art keywords
- holding
- plate
- holding plate
- chip component
- support frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 230000003028 elevating effect Effects 0.000 description 8
- 125000006850 spacer group Chemical group 0.000 description 6
- 238000005452 bending Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 239000002003 electrode paste Substances 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4252279A JP2929859B2 (ja) | 1992-08-26 | 1992-08-26 | チップ部品のプレス装置 |
| TW83100012A TW225040B (enrdf_load_stackoverflow) | 1992-08-26 | 1994-01-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4252279A JP2929859B2 (ja) | 1992-08-26 | 1992-08-26 | チップ部品のプレス装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0677098A JPH0677098A (ja) | 1994-03-18 |
| JP2929859B2 true JP2929859B2 (ja) | 1999-08-03 |
Family
ID=17235040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4252279A Expired - Lifetime JP2929859B2 (ja) | 1992-08-26 | 1992-08-26 | チップ部品のプレス装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2929859B2 (enrdf_load_stackoverflow) |
| TW (1) | TW225040B (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5961269A (en) * | 1996-11-18 | 1999-10-05 | Applied Materials, Inc. | Three chamber load lock apparatus |
| JP4337498B2 (ja) | 2003-10-23 | 2009-09-30 | 株式会社村田製作所 | 導電性ペーストの塗布方法および導電性ペーストの塗布装置 |
| KR101116008B1 (ko) * | 2011-08-09 | 2012-02-14 | 정형종 | Ｍｌｃｃ 제조를 위한 세라믹 큐브 이송장치 |
| KR101353122B1 (ko) * | 2012-02-03 | 2014-01-22 | 삼성전기주식회사 | 칩 소자 고정용 지그 |
-
1992
- 1992-08-26 JP JP4252279A patent/JP2929859B2/ja not_active Expired - Lifetime
-
1994
- 1994-01-04 TW TW83100012A patent/TW225040B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0677098A (ja) | 1994-03-18 |
| TW225040B (enrdf_load_stackoverflow) | 1994-06-11 |
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