JP2833757B2 - 半導体素子の製造用ウエーハの処理装置 - Google Patents

半導体素子の製造用ウエーハの処理装置

Info

Publication number
JP2833757B2
JP2833757B2 JP13429088A JP13429088A JP2833757B2 JP 2833757 B2 JP2833757 B2 JP 2833757B2 JP 13429088 A JP13429088 A JP 13429088A JP 13429088 A JP13429088 A JP 13429088A JP 2833757 B2 JP2833757 B2 JP 2833757B2
Authority
JP
Japan
Prior art keywords
wafer
processing
manufacturing
semiconductor device
magazine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP13429088A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63318738A (ja
Inventor
クンツエーコンセヴイツツ ホルスト
ミユラー−ウーリ ハンス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KONBATSUKU GmbH
Original Assignee
KONBATSUKU GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KONBATSUKU GmbH filed Critical KONBATSUKU GmbH
Publication of JPS63318738A publication Critical patent/JPS63318738A/ja
Application granted granted Critical
Publication of JP2833757B2 publication Critical patent/JP2833757B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP13429088A 1987-06-15 1988-05-31 半導体素子の製造用ウエーハの処理装置 Expired - Fee Related JP2833757B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3719952.8 1987-06-15
DE19873719952 DE3719952A1 (de) 1987-06-15 1987-06-15 Einrichtung zur behandlung von wafern bei der herstellung von halbleiterelementen

Publications (2)

Publication Number Publication Date
JPS63318738A JPS63318738A (ja) 1988-12-27
JP2833757B2 true JP2833757B2 (ja) 1998-12-09

Family

ID=6329745

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13429088A Expired - Fee Related JP2833757B2 (ja) 1987-06-15 1988-05-31 半導体素子の製造用ウエーハの処理装置

Country Status (3)

Country Link
US (1) US4979464A (enExample)
JP (1) JP2833757B2 (enExample)
DE (1) DE3719952A1 (enExample)

Families Citing this family (37)

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JPH082999Y2 (ja) * 1989-12-11 1996-01-29 ミツミ電機株式会社 スピンコート装置
DE4115509C2 (de) * 1990-05-15 1995-08-10 Steag Microtech Gmbh Sternenfe Verfahren zur Bekeimung von Halbleitersubstrat-Oberflächen, und Vorrichtung zu seiner Durchführung
US5387557A (en) * 1991-10-23 1995-02-07 F. T. L. Co., Ltd. Method for manufacturing semiconductor devices using heat-treatment vertical reactor with temperature zones
US5461214A (en) * 1992-06-15 1995-10-24 Thermtec, Inc. High performance horizontal diffusion furnace system
US5607009A (en) * 1993-01-28 1997-03-04 Applied Materials, Inc. Method of heating and cooling large area substrates and apparatus therefor
US5651868A (en) * 1994-10-26 1997-07-29 International Business Machines Corporation Method and apparatus for coating thin film data storage disks
US5850071A (en) * 1996-02-16 1998-12-15 Kokusai Electric Co., Ltd. Substrate heating equipment for use in a semiconductor fabricating apparatus
US6069342A (en) * 1996-12-18 2000-05-30 Texas Instruments Incorporated Automated multiple lead frame strip radiant die attach material curing apparatus
US5911896A (en) * 1997-06-25 1999-06-15 Brooks Automation, Inc. Substrate heating apparatus with glass-ceramic panels and thin film ribbon heater element
US7244677B2 (en) 1998-02-04 2007-07-17 Semitool. Inc. Method for filling recessed micro-structures with metallization in the production of a microelectronic device
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US6497801B1 (en) 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US7585398B2 (en) 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7020537B2 (en) 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7189318B2 (en) 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US6916412B2 (en) 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
KR100707121B1 (ko) 1999-04-13 2007-04-16 세미툴 인코포레이티드 마이크로전자 피가공물을 전기화학적으로 처리하기 위한 장치 및 마이크로전자 피가공물 상에 재료를 전기도금하기 위한 방법
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US6158944A (en) * 1999-06-18 2000-12-12 Lucent Technologies, Inc. Automated laser bar transfer apparatus and method
US6249955B1 (en) * 1999-10-13 2001-06-26 Agere Systems Optoelectronics Guardian Corp. Laser bar transport method
US6692209B1 (en) * 1999-11-19 2004-02-17 Litton Systems, Inc. Method and system for manufacturing a photocathode
US6780374B2 (en) 2000-12-08 2004-08-24 Semitool, Inc. Method and apparatus for processing a microelectronic workpiece at an elevated temperature
WO2001059815A2 (en) * 2000-02-09 2001-08-16 Semitool, Inc. Method and apparatus for processing a microelectronic workpiece at an elevated temperature
US6471913B1 (en) 2000-02-09 2002-10-29 Semitool, Inc. Method and apparatus for processing a microelectronic workpiece including an apparatus and method for executing a processing step at an elevated temperature
AU2001282879A1 (en) 2000-07-08 2002-01-21 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology
WO2002101796A2 (en) * 2001-06-12 2002-12-19 Verteq, Inc. Megasonic cleaner and dryer system
JP3886424B2 (ja) * 2001-08-28 2007-02-28 鹿児島日本電気株式会社 基板処理装置及び方法
US20040226513A1 (en) * 2003-05-12 2004-11-18 Applied Materials, Inc. Chamber for uniform heating of large area substrates
FR2938116B1 (fr) * 2008-11-04 2011-03-11 Aplinov Procede et dispositif de chauffage d'une couche d'une plaque par amorcage et flux lumineux.
US9351569B1 (en) * 2013-02-11 2016-05-31 Automated Cells and Equipment, Inc. Parts supply drawer system for robot assisted manufacturing
DE102013021716A1 (de) * 2013-12-20 2015-06-25 Gerresheimer Regensburg Gmbh Vorrichtung und Verfahren zum Aufnehmen von Werkstücken
CN112005358B (zh) 2018-04-19 2024-12-24 信越聚合物株式会社 基板收纳容器
JP7073599B2 (ja) * 2018-05-28 2022-05-24 信越ポリマー株式会社 基板収納容器
US11114329B2 (en) * 2019-04-08 2021-09-07 Semiconductor Components Industries, Llc Methods for loading or unloading substrate with evaporator planet

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2722545C2 (de) * 1977-05-18 1984-03-08 Kurt Dr.-Ing. 7802 Merzhausen Heber Diffusionsofen zur Behandlung von Halbleitersubstraten
DE3019017A1 (de) * 1980-05-19 1981-12-03 KK Automation Klaus Th. Krämer GmbH & Co KG, 7107 Neckarsulm Handhabungssystem fuer werkstuecke
US4457662A (en) * 1982-03-25 1984-07-03 Pennwalt Corporation Automatic lead frame loading machine
US4457359A (en) * 1982-05-25 1984-07-03 Varian Associates, Inc. Apparatus for gas-assisted, solid-to-solid thermal transfer with a semiconductor wafer
US4527620A (en) * 1984-05-02 1985-07-09 Varian Associates, Inc. Apparatus for controlling thermal transfer in a cyclic vacuum processing system
NL8401777A (nl) * 1984-06-04 1986-01-02 Bok Edward Gasslot voor in- en uitgang van tunnel, waarin verplaatsing en processing van wafers geschiedt met behulp van media onder double-floating conditie.
US4640223A (en) * 1984-07-24 1987-02-03 Dozier Alfred R Chemical vapor deposition reactor
JPS627118A (ja) * 1985-07-03 1987-01-14 Hitachi Ltd 分子線エピタキシ装置

Also Published As

Publication number Publication date
US4979464A (en) 1990-12-25
DE3719952A1 (de) 1988-12-29
JPS63318738A (ja) 1988-12-27
DE3719952C2 (enExample) 1989-05-03

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